IEC 60691:2015

Thermal-links - Requirements and application guide

IEC 60691:2015

Name:IEC 60691:2015   Standard name:Thermal-links - Requirements and application guide
Standard number:IEC 60691:2015   language:English language
Release Date:10-Jan-2019   technical committee:SC 32C - Miniature fuses
Drafting committee:MT 9 - TC 32/SC 32C/MT 9   ICS number:01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION

IEC 60691
Edition 4.1 2019-01
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Thermal-links – Requirements and application guide








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IEC 60691
Edition 4.1 2019-01
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Thermal-links – Requirements and application guide

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.120.50 ISBN 978-2-8322-6430-0

IEC 60691
Edition 4.1 2019-01
CONSOLIDATED VERSION
REDLINE VERSION
colour
inside
Thermal-links – Requirements and application guide

– 2 – IEC 60691:2015+AMD1:2019 CSV

© IEC 2019
CONTENTS
FOREWORD . 4

INTRODUCTION . 6

1 Scope . 7

2 Normative references . 7

3 Terms and definitions . 8

4 General requirements . 10

5 General notes on tests . 11
6 Classification . 13
6.1 Electrical conditions . 13
6.2 Thermal conditions. 14
6.3 Resistance to tracking . 14
7 Marking . 14
8 Documentation . 15
9 Constructional requirements . 15
9.1 General . 15
9.2 Lead secureness tests . 16
9.2.1 General . 16
9.2.2 Tensile test . 16
9.2.3 Thrust test . 17
9.2.4 Bending/twist test . 17
9.3 Contacts used for the current path . 18
9.4 Accessible mounting brackets or metal parts . 18
9.5 Insulating materials . 18
9.6 Resistance to tracking . 18
9.7 Creepage distances and clearances . 18
9.8 Temperature and humidity cycle conditioning . 19
9.9 Terminals and terminations . 19
10 Electrical requirements . 19
10.1 Dielectric strength . 19
10.2 Insulation resistance . 20
10.3 Interrupting current . 21

10.3.1 General . 21
10.3.2 Specific conditions . 21
10.4 Transient overload current . 22
10.5 Limited short-circuit test . 23
10.5.1 General . 23
10.5.2 Test method . 23
10.5.3 Fuse size (rating) . 23
10.5.4 Compliance . 24
11 Temperature tests . 24
11.1 General . 24
11.2 Holding temperature, T . 24
h
11.3 Rated functioning temperature, T . 25
f
11.4 Maximum temperature limit, T . 25
m
© IEC 2019
11.5 Ageing . 25

12 Resistance to rusting . 26

13 Manufacturer’s validation programme . 26

Annex A (normative) Application guide. 28

Annex B (normative) Alternative ageing test for thermal-links with T greater than
h
250 °C for use in electric irons . 29

Annex C (normative) Conductive heat ageing test . 30

C.1 Conductive heat ageing test . 30

C.2 Method . 30

C.3 Ageing . 31
C.4 Results . 32
C.5 Dielectric strength test . 32
C.6 Test oven . 32

Annex D (informative) Extended holding temperature evaluation . 34
D.1 Extended holding temperature conditioning test . 34
D.2 Load current interrupt test . 34
Annex E (normative) Seal ageing test . 36
Annex F (normative) Identification requirements . 38
Annex G (normative) Indelibility of markings . 39
Annex H (normative) Requirements for thermal-link packaged assemblies . 40
Bibliography . 43

Figure 1 – Bending/twist test . 17
Figure C.1 – Typical test fixture assembly . 32
Figure C.2 – Typical thermal-link test oven . 33
Figure D.1 – Typical terminal block support test fixture . 35
Figure E.1 – Conditioning time versus oven temperature for proposed temperature

index. 37
Figure G.1 – Apparatus for testing durability of markings . 39

Table 1 – Test schedule . 13
Table 2 – Strength of leads and terminal parts – Minimum required tensile and thrust
test forces . 17

Table 3 – Creepage distances and clearances (absolute minimum values) . 19
Table 4 – Test voltages for dielectric strength . 20
Table 5 – Test current for interrupting test . 21
Table 6 – Limited short-circuit test capacity . 23
Table H.1 – Push and pull force . 41
Table H.2 – Minimum nominal cross-sectional area of conductor . 42

– 4 – IEC 60691:2015+AMD1:2019 CSV

© IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
THERMAL-LINKS –
REQUIREMENTS AND APPLICATION GUIDE

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordanc
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