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IEC 62024-1
Edition 4.0 2024-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Electrical characteristics and measuring
methods –
Part 1: Nanohenry range chip inductor
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IEC 62024-1
Edition 4.0 2024-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Electrical characteristics and
measuring methods –
Part 1: Nanohenry range chip inductor
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.100.10 ISBN 978-2-8322-9414-7
– 2 – IEC 62024-1:2024 RLV
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Inductance, Q-factor and impedance. 6
4.1 Inductance . 6
4.1.1 Measuring method . 6
4.1.2 Measuring circuit . 7
4.1.3 Mounting the inductor for the test . 9
4.1.4 Measuring method and calculation formula . 12
4.1.5 Notes on measurement . 13
4.2 Quality factor . 15
4.2.1 Measuring method . 15
4.2.2 Measuring circuit . 15
4.2.3 Mounting the inductor for test . 15
4.2.4 Measuring method and calculation formula . 15
4.2.5 Notes on measurement . 16
4.3 Impedance . 16
4.3.1 Measuring method . 16
4.3.2 Measuring circuit . 16
4.3.3 Mounting the inductor for test . 16
4.3.4 Measuring method and calculation . 16
4.3.5 Notes on measurement . 17
5 Resonance frequency . 17
5.1 Self-resonance frequency . 17
5.2 Minimum output method . 17
5.2.1 General . 17
5.2.2 Measuring circuit . 17
5.2.3 Mounting the inductor for test . 18
5.2.4 Measuring method and calculation formula . 19
5.2.5 Note on measurement . 20
5.3 Reflection method .
5.3 Measurement by analyzer . 23
5.3.1 Measurement by impedance analyzer and one-port network analyzer . 23
5.3.2 Measurement by two-port network analyzer . 23
6 DC resistance . 23
6.1 Voltage-drop method. 23
6.1.1 Measuring circuit . 23
6.1.2 Measuring method and calculation formula . 24
6.2 Bridge method . 25
6.2.1 Measuring circuit . 25
6.2.2 Measuring method and calculation formula . 25
6.3 Notes on measurement . 25
6.4 Measuring temperature . 26
7 S-parameter . 26
7.1 Measurement setup and procedure . 26
7.1.1 General . 26
7.1.2 Two-port S-parameter . 27
7.1.3 Test fixture . 27
7.2 Calibrations and verification of test setup . 28
7.2.1 General . 28
7.2.2 Calibration . 29
7.2.3 De-embedding . 32
7.3 Indirect method of impedance . 32
7.4 Evaluation from the two-port S-parameter . 32
Annex A (normative) Mounting method for a surface mounting inductor . 35
A.1 Overview. 35
A.2 Mounting printed-circuit board and mounting land . 35
A.3 Solder . 35
A.4 Test condition . 35
A.5 Cleaning . 35
Annex B (normative) Elimination of residual parameter effects in test fixture . 37
B.1 Overview. 37
B.2 Test fixture represented by the ABCD matrix of a two-terminal pair network . 37
Bibliography . 39
Figure 1 – Example of circuit for vector voltage/current method . 8
Figure 2 – Example of circuit for reflection coefficient method . 9
Figure 3 – Fixture A . 9
Figure 4 – Fixture B . 11
Figure 5 – Fixture C . 12
Figure 6 – Short device shape . 14
Figure 7 – Example of test circuit for the minimum output method . 18
Figure 8 – Self-resonance frequency test board (minimum output method) . 19
Figure 9 – Suitable test fixture for measuring self-resonance frequency .
Figure 9 – Example of test circuit for voltage-drop method . 24
Figure 10 – Example of test circuit for bridge method . 25
Figure 11 – Schematic diagram of the two-port S-parameter measurement setup and
the network analyzer . 27
Figure 12 – S-parameter test fixture for two-terminal devices . 27
Figure 13 – Test fixture for a two-terminal device (shunt connection) . 28
Figure 14 – Test fixture for a two-terminal device (series connection) . 28
Figure 15 – Examples of the standards for TRL calibration . 30
Figure 16 – Examples of the standards for TRL calibration with microprobes . 31
Figure 17 – Examples of full two-port de-embedding with microprobes . 32
Figure 18 – Two-port measurement of a two-terminal device in shunt connection . 33
Figure 19 – Two-port measurement of a two-terminal device in series connection . 33
Figure B.1 – Test fixture represented by the ABCD matrix . 37
Table 1 – Dimensions of l and d . 10
Table 2 – Short device dimensions and inductances . 15
– 4 – IEC 62024-1:2024 RLV
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
Part 1: Nanohenry range chip inductor
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, gov
...