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IEC TS 62686-2
Edition 1.0 2019-01
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 2: General requirements for passive components
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IEC TS 62686-2
Edition 1.0 2019-01
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 2: General requirements for passive components
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-6247-4
– 2 – IEC TS 62686-2:2019 © IEC 2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 11
4 Technical requirements . 12
4.1 General . 12
4.1.1 Overview . 12
4.1.2 Equivalent methods . 13
4.2 Procedures . 13
4.2.1 General . 13
4.2.2 Product discontinuance . 14
4.2.3 ESD protection during manufacture . 14
4.2.4 Traceability . 14
4.3 Shipment controls . 14
4.3.1 General . 14
4.3.2 Unit pack container . 14
4.3.3 Intermediate packing . 14
4.3.4 Date codes . 15
4.3.5 Moisture sensitivity level (MSL) . 15
4.3.6 Lead-free marking . 15
4.3.7 Labels . 15
4.3.8 Electrostatic discharge (ESD) . 16
4.4 Product or process change notification (PCN) . 16
4.4.1 General . 16
4.4.2 Notification . 17
4.4.3 Notification details . 17
4.5 Electrical . 17
4.5.1 General . 17
4.5.2 Electrical test . 17
4.6 Mechanical . 17
4.6.1 General . 17
4.6.2 Device marking . 18
4.6.3 Lead-free components . 18
4.6.4 Moisture sensitivity . 18
4.6.5 Termination finishes . 18
4.6.6 Termination finish notification of change . 19
4.7 Audit capability . 19
4.7.1 General . 19
4.7.2 Internal quality audits . 19
4.7.3 Subcontract manufacturing . 19
4.8 Quality assurance . 19
4.8.1 General . 19
4.8.2 Quality system . 20
4.8.3 Sampling plans . 20
4.8.4 Failure analysis support . 20
4.8.5 Outgoing quality . 20
4.9 Qualification . 20
4.9.1 General . 20
4.9.2 Methodology . 21
4.9.3 Test samples . 24
4.9.4 Qualification categories . 24
4.9.5 Maintenance of qualification standard . 24
4.9.6 In-process test results . 25
4.9.7 Test references . 25
4.9.8 Qualification report . 25
4.9.9 Archiving . 25
4.9.10 Qualification of device changes . 25
4.9.11 Similarity assessment . 25
4.10 Product monitoring in the production line . 26
4.10.1 General . 26
4.10.2 Monitoring programme . 26
4.10.3 Problem notification . 26
4.10.4 Data reporting. 26
4.11 Environmental health and safety (EHS) . 26
4.11.1 General . 26
4.11.2 General EHS compliance . 27
4.11.3 Device handling . 27
4.11.4 Device materials and substances . 27
Annex A (informative) Test code (TC) information for guidance . 28
A.1 General . 28
A.2 TC1 – Electrical test. 28
A.3 TC2 – External visual . 28
A.4 TC3 – Package dimensions . 29
A.5 TC4 – High temperature exposure (storage) . 30
A.6 TC5 – Temperature cycling . 30
A.7 TC6 – Moisture resistance . 30
A.8 TC7 – Biased humidity . 30
A.9 TC8 – High temperature operating life. 30
A.10 TC9 – Terminal strength (leaded) . 31
A.11 TC10-Resistance to solvents . 31
A.12 TC11 – Mechanical shock . 31
A.13 TC12 – Vibration . 31
A.14 TC13 – Resistance to heat . 31
A.15 TC14 – Thermal shock . 32
A.16 TC15 – Board flex (SMD) . 32
A.17 TC16 – Beam load . 32
A.18 TC17 – Solderability . 32
A.19 TC18 – Electrostatic discharge . 32
A.20 TC19 – Flammability .
...