IEC 62812:2019

Low resistance measurements - Methods and guidance

IEC 62812:2019

Name:IEC 62812:2019   Standard name:Low resistance measurements - Methods and guidance
Standard number:IEC 62812:2019   language:English and French language
Release Date:01-May-2019   technical committee:TC 40 - Capacitors and resistors for electronic equipment
Drafting committee:PT 62812 - TC 40/PT 62812   ICS number:01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION

IEC 62812
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Low resistance measurements – Methods and guidance

Mesures de faibles résistances – Méthodes et recommandations





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IEC 62812
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Low resistance measurements – Methods and guidance

Mesures de faibles résistances – Méthodes et recommandations

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.01 ISBN 978-2-8322-6870-4

– 2 – IEC 62812:2019 © IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Resistance measurement phenomena . 7
4.1 General . 7
4.2 Lead and contact resistance . 7
4.3 Self-heating . 9
4.4 Variation of resistance with temperature . 10
4.5 Thermoelectric e.m.f. . 12
4.6 Peltier effect . 15
5 Methods of measurement . 16
5.1 General . 16
5.2 Four-wire resistance measurement . 16
5.3 Offset compensation method . 19
5.4 Current inversion method . 22
5.5 Differential current inversion method . 25
5.6 Short-term trigger method . 28
6 Connecting the specimen . 32
6.1 Resistors with lead wires for soldered assembly . 32
6.1.1 Connecting leaded resistors in a test fixture . 32
6.2 Resistors with solder terminations for surface mount assembly . 33
6.2.1 Connecting SMD resistors on a test substrate. 33
6.2.2 Connecting SMD resistors in a test fixture . 35
7 Information to be given in the relevant component specification . 36
Annex A (normative) Letter symbols and abbreviated terms . 37
A.1 Letter symbols . 37
A.2 Abbreviated terms . 38
Annex B (informative) Test results of soldering pad with Kelvin connection for surface
mount resistors . 39
B.1 General . 39
B.2 Test procedures . 39
B.2.1 Test substrates . 39
B.2.2 Test method . 41
B.3 Measurement result and studies . 42
Bibliography . 45

Figure 1 – Resistance measurement using two-wire sensing . 8
Figure 2 – Variation of resistance with temperature (random example) . 10
Figure 3 – Resistances on a resistor with lead wires . 11
Figure 4 – SMD chip resistor on a PCB . 12
Figure 5 – Thermoelectric e.m.f. . 13
Figure 6 – Thermocouples on a resistor with lead wires . 14
Figure 7 – Resistance measurement affected by thermoelectric e.m.f. . 15

Figure 8 – Four-wire resistance measurement . 17
Figure 9 – Offset compensation method for resistance measurement . 19
Figure 10 – Current and voltage in the offset compensation method . 20
Figure 11 – Current inversion method for resistance measurement . 22
Figure 12 – Current and voltage in the current inversion method . 23
Figure 13 – Current and voltage in the differential current inversion method . 26
Figure 14 – Example of resistor specimen. 31
Figure 15 – Connecting leaded resistors in a test fixture . 32
Figure 16 – Resistance of cylindrical copper lead wires . 33
Figure 17 – Soldering pad of test substrate for Kelvin (four-point) connections . 34
Figure 18 – Resistance of PCB conductor tracks with 35 µm copper thickness. 35
Figure 19 – Example for connecting SMD resistors on a test fixture . 36
Figure B.1 – Lengths of soldering pad . 40
Figure B.2 – Position of voltage sense conductor . 40
Figure B.3 – Thickness of the solder printing screen and position of sense line . 43
Figure B.4 – Position of voltage-sensing line. 43
Figure B.5 – Soldering pad length . 44
Figure B.6 – Recommended soldering pad . 44

Table 1 – Relative Seebeck coefficients of selected metals. 13
Table A.1 – Letter symbols . 37
Table B.1 – Thickness of solder printing screen . 41
Table B.2 – Table of test conditions . 42

– 4 – IEC 62812:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
LOW RESISTANCE MEASUREMENTS –
METHODS AND GUIDANCE
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with con
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