|
IEC TR 61189-5-506
Edition 1.0 2019-06
TECHNICAL
REPORT
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-506: General test methods for materials and assemblies – An
intercomparison evaluation to implement the use of fine-pitch test structures for
surface insulation resistance (SIR) testing of solder fluxes in accordance with
IEC 61189-5-501
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de
CH-1211 Geneva 20
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
.
IEC TR 61189-5-506
Edition 1.0 2019-06
TECHNICAL
REPORT
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-506: General test methods for materials and assemblies – An
intercomparison evaluation to implement the use of fine-pitch test structures for
surface insulation resistance (SIR) testing of solder fluxes in accordance with
IEC 61189-5-501
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180 ISBN 978-2-8322-7083-7
– 2 – IEC TR 61189-5-506:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Test board concept for intercomparison . 7
4.1 The need for a fine-pitch SIR pattern . 7
4.2 Test board design . 8
4.3 Test board fluxing . 9
5 Test procedure for intercomparison . 10
5.1 Sample preparation . 10
5.2 Preparation of samples for humidity chamber . 11
5.3 Placement of samples inside the humidity chamber . 11
5.4 Resistance measurements . 12
5.5 Evaluation of results . 12
5.6 Additional information . 12
6 Results . 12
Bibliography . 23
Figure 1 – TB144 . 9
Figure 2 – Connector arrangement . 11
Figure 3 – Sample orientation in test chamber . 12
Figure 4 – Participants (a to f) resistance measurements for the six test patterns on
the checker board . 13
Figure 5 – Participant A control boards . 13
Figure 6 – Participant A flux loaded boards . 14
Figure 7 – Participant B control boards . 14
Figure 8 – Participant B flux loaded boards . 14
Figure 9 – Participant C control boards . 15
Figure 10 – Participant C flux loaded boards . 15
Figure 11 – Participant D control boards . 15
Figure 12 – Participant D flux loaded boards . 16
Figure 13 – Participant E control boards . 16
Figure 14 – Participant E flux loaded boards . 16
Figure 15 – Participant F control boards . 17
Figure 16 – Participant F flux loaded boards . 17
Figure 17 – Participant G control boards . 17
Figure 18 – Participant G flux loaded boards . 18
Figure 19 – Participant D, and evidence of a fibre and the effect on the SIR . 18
Figure 20 – Participant E and evidence or corrosion shorting across the gap . 18
Figure 21 – Participant G and evidence of a water droplet and the resulting drop in
SIR and dendrite like failure . 19
Figure 22 – Participant G and a corrosion defect probably from a flux residue . 19
Figure 23 – Participant C dendrites and corrosions formed on all SIR patterns of all
fluxed samples tested at 85°C/85% . 19
Figure 24 – The average final SIR value for the control boards . 20
Figure 25 – The average final SIR value for the flux loaded boards . 20
Figure 26 – The average final SIR for flux-loaded patterns by participant . 21
Figure 27 – Final SIR plotted as ohm.squares . 21
Figure 28 – Ratio of the log Ω.square value to the 500-µm pattern . 22
Table 1 – SIR pattern information . 9
Table 2 – Flux to be used for SIR evaluation test . 10
Table 3 – Samples for SIR evaluation testing . 10
– 4 – IEC TR 61189-5-506:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-506: General test methods for materials and assemblies – An
intercomparison evaluation to implement the use of fine-pitch test
structures for surface insulation resistance (SIR) testing of solder fluxes
in accordance with IEC 61189-5-501
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a Technical Report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC/TR 61189-5-506, which is a technical report, has been prepared by IEC technical
committee 91: Electronics assembly technology.
The text of this Technical Report is based on the following documents:
Draft TR Report on voting
91/1500/DTR 91/1530A/RVDTR
Full information on the voting for the approval of this Technical Report can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts
...