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IEC 62025-2
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics
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IEC 62025-2
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.100.10 ISBN 978-2-8322-7432-3
– 2 – IEC 62025-2:2019 RLV IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Test conditions . 7
4.1 Standard atmospheric conditions for test . 7
4.2 Referee conditions . 7
5 Mechanical characteristics test . 8
5.1 Body strength test . 8
5.1.1 Body strength test procedures . 8
5.1.2 Information to be given in the detail specification . 9
5.2 Robustness of terminations (electrodes) . 9
5.2.1 Resistance to bending of printed-circuit board . 9
5.2.2 Adherence test (see test of Ue of IEC 60068-2-21) . 13
5.3 Solderability . 15
5.3.1 General . 15
5.3.2 Preconditioning . 15
5.3.3 Initial measurement . 15
5.3.4 Test method . 15
5.3.5 Recovery . 17
5.3.6 Final measurement . 17
5.3.7 Items to be specified in detail specification . 17
5.4 Resistance to soldering heat . 18
5.4.1 General . 18
5.4.2 Preconditioning . 18
5.4.3 Initial measurement . 18
5.4.4 Test method . 18
5.4.5 Recovery . 19
5.4.6 Final measurement . 19
5.4.7 Items to be specified in detail specification . 19
5.5 Resistance to dissolution of metallization . 20
5.5.1 General . 20
5.5.2 Preconditioning . 20
5.5.3 Initial measurement . 20
5.5.4 Test methods . 20
5.5.5 Final measurements . 20
5.5.6 Items to be specified in detail specification . 21
5.6 Vibration . 21
5.6.1 Test equipment . 21
5.6.2 Preparation . 21
5.6.3 Test method . 21
5.6.4 Items to be specified in detail specification . 21
5.7 Resistance to shock . 22
5.7.1 Mechanical shock method . 22
5.7.2 Items to be specified in detail specification . 22
Annex A (normative) Mounting of surface mounting inductor on test printed-circuit
board . 23
A.1 General . 23
A.2 Mounting printed-circuit board and mounting land . 23
A.3 Solder . 23
A.4 Preparation . 24
A.5 Preheating . 24
A.6 Soldering . 24
A.7 Cleaning . 24
Figure 1 – Method for pressurizing the body . 8
Figure 2 – Pressurizing jig . 9
Figure 3 – Example of printed-circuit board . 10
Figure 4 – Layout . 12
Figure 5 – Pressurizing jig . 12
Figure 6 – Pressurizing . 12
Figure 7 – Pressurizing and shape of jig . 14
Figure 8 – Reflow temperature profile . 17
Table 1 – Size of soldering lands according to the code of multi-layer chip inductors . 10
Table 2 – Thickness of solder paste by the size code of inductors . 11
Table 3 – Conditions of immersion into solder . 16
Table 4 – Reflow temperature . 16
Table 5 – Severity . 18
Table 6 – Reflow temperature . 19
Table 7 – Conditions of vibration . 21
– 4 – IEC 62025-2:2019 RLV IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
Part 2: Test methods for non-electrical characteristics
FOREWORD
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