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IEC 62878-1
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
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IEC 62878-1
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-7460-6
– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16
8.2.10 Vibration (sinusoidal) . 16
8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material . 18
9.1 Humidity / Temperature / Environmental protection . 18
9.2 Mechanical protection . 18
9.3 ESD . 18
10 General requirements . 18
Bibliography . 19
Figure 1 – Value chain and interfaces . 9
Table 1 – Referee conditions . 12
– 4 – IEC 62878-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
FOREWORD
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International Standard IEC 62878-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1597/FDIS 91/1616/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62878 series, published under the general title Device embedded
substrate, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existin
...