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IEC 60512-28-100
Edition 2.0 2019-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Connectors for electrical and electronic equipment – Tests and measurements –
Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and
IEC 61076-3 series connectors 2 000 MHz – Tests 28a to 28g
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IEC 60512-28-100
Edition 2.0 2019-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Connectors for electrical and electronic equipment – Tests and measurements –
Part 28-100: Signal integrity tests up to 1 000 MHz on IEC 60603-7 and
IEC 61076-3 series connectors 2 000 MHz – Tests 28a to 28g
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.220.10 ISBN 978-2-8322-7632-7
– 2 – IEC 60512-28-100:2019 RLV © IEC 2019
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and acronyms abbreviated terms . 10
3.1 Terms and definitions . 11
3.2 Acronyms Abbreviated terms . 11
4 Overall test arrangement . 11
4.1 General . 11
4.2 Test instrumentation . 11
4.2.1 General . 11
4.2.2 Vector network analyser . 12
4.2.3 RF switching unit . 12
4.2.4 Reference loads and termination loads . 12
4.3 Measurement precautions . 12
4.4 Mixed mode S-parameter nomenclature . 13
4.5 Coaxial cables and interconnect for network analyzers . 14
4.6 Requirements Characteristic for switching switching matrices . 14
4.7 Test fixture requirements . 15
4.7.1 Test fixture types . 17
4.8 Requirements for termination performance at calibration plane . 17
4.9 Reference loads for calibration . 18
4.10 Calibration . 18
4.10.1 General . 18
4.10.2 Calibration test interface . 19
4.10.3 Calibration at end of coaxial test cables . 19
4.11 Termination loads for termination of conductor pairs . 19
4.11.1 General . 19
4.11.2 Verification of termination loads Impedance matching resistor
termination networks . 19
4.12 Termination of screens . 20
4.13 Test specimen and reference planes . 20
4.13.1 General . 20
4.13.2 Interconnections between device under test (DUT) and the calibration
plane . 20
4.14 Overall test setup requirements . 23
5 Connector measurements up to 1 000 2 000 MHz . 23
5.1 General . 24
5.2 Insertion loss, test 28a . 24
5.2.1 Object . 24
5.2.2 Connecting hardware insertion loss . 24
5.2.3 Test method . 24
5.2.4 Test set-up . 25
5.2.5 Procedure . 25
5.2.6 Test report . 25
5.2.7 Accuracy . 26
5.3 Return loss, test 28b . 26
5.3.1 Object . 26
5.3.2 Connecting hardware return loss . 26
5.3.3 Test method . 26
5.3.4 Test set-up . 26
5.3.5 Procedure . 26
5.3.6 Test report . 26
5.3.7 Accuracy . 27
5.4 Near-end crosstalk (NEXT), test 28c . 27
5.4.1 Object . 27
5.4.2 Connecting hardware NEXT . 27
5.4.3 Test method . 27
5.4.4 Test set-up . 27
5.4.5 Procedure . 28
5.4.6 Test report . 29
5.4.7 Accuracy . 29
5.5 Far-end crosstalk (FEXT), test 28d . 29
5.5.1 Object . 29
5.5.2 Connecting hardware FEXT . 29
5.5.3 Test method . 29
5.5.4 Test set-up . 29
5.5.5 Procedure . 30
5.5.6 Test report . 30
5.5.7 Accuracy . 30
Transfer impedance (Z ), Test 28e .
T
5.6 Transverse conversion loss (TCL), test 28f . 31
5.6.1 Object . 31
5.6.2 Connecting hardware TCL . 31
5.6.3 Test method . 31
5.6.4 Test set-up . 31
5.6.5 Procedure . 32
5.6.6 Test report . 32
5.6.7 Accuracy . 32
5.7 Transverse conversion transfer loss (TCTL), test 28g . 32
5.7.1 Object . 32
5.7.2 Connecting hardware TCTL . 33
5.7.3 Test method . 33
5.7.4 Test set-up . 33
5.7.5 Procedure . 33
5.7.6 Test report . 33
5.7.7 Accuracy . 34
5.8 Shield transfer impedance (Z ), test 26e . 34
T
5.8.1 Object . 34
5.8.2 Connecting hardware Ttansfer impedance (Z ). 34
T
5.8.3 Test method . 34
5.8.4 Test set-up . 34
5.8.5 Procedure . 34
5.8.6 Test report . 35
5.8.7 Accuracy . 35
...