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IEC 62047-35
Edition 1.0 2019-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 35: Test method of electrical characteristics under bending deformation
for flexible electromechanical devices
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 35: Méthode d’essai des caractéristiques électriques sous déformation
par courbure de dispositifs électromécaniques souples
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IEC 62047-35
Edition 1.0 2019-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 35: Test method of electrical characteristics under bending deformation
for flexible electromechanical devices
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 35: Méthode d’essai des caractéristiques électriques sous déformation
par courbure de dispositifs électromécaniques souples
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-7636-5
– 2 – IEC 62047-35:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
3.1 General . 7
3.2 Loading configurations . 7
3.3 Measure of loading levels . 8
4 Test piece . 8
4.1 General . 8
4.2 Shape of a test piece . 8
5 Test method . 9
5.1 Principle . 9
5.2 Test apparatus . 10
5.3 Procedure . 10
5.3.1 Testing conditions . 10
5.3.2 Selection of bending direction . 11
5.3.3 Determination of bending axes . 11
5.3.4 Measurement of test piece dimensions . 11
5.3.5 Measurement of folding distance . 12
5.3.6 Number of tests . 12
5.3.7 Instrumentation . 12
5.3.8 End of testing . 13
6 Test report . 13
6.1 General . 13
6.2 Bending direction(s) and in-plane locations of bending axes . 13
6.3 Dimensions of the test piece . 14
6.4 Performance degradation characteristics with the folding distance . 14
6.5 Distance at a defined operation limit . 15
6.6 Testing conditions . 15
Annex A (normative) Example of flexible MEMS device . 16
Annex B (informative) Controls for appropriate performance instrumentation and
setting of bending axis position . 18
B.1 Loading wall design with electric accessing cavity and fine adjustment
capability for bending axis location during the test . 18
B.2 Special arrangement of the target parts of device to obtain a number of
bending axis locations in a single testing . 19
Annex C (informative) Loading principle for extremely thin soft devices . 20
Annex D (informative) Issues related to local loading severity . 21
D.1 Possible inhomogeneity in local curvature and parameter of loading . 21
D.2 Possible variations of loading parameter . 21
Figure 1 – Schematic illustration of a flexible MEMS test piece . 9
Figure 2 – Principle of folding test . 10
Figure 3 – Selection of bending axis . 12
Figure 4 – Illustration of performance degradation in the test report . 14
Figure A.1 – Target part and loading configuration of test piece for organic thin-film
transistor device . 16
Figure A.2 – Device performance degradation behaviour and distances at defined
operation limits for an organic thin-film effect transistor . 17
Figure B.1 – Loading point adjustment mechanism . 18
Figure B.2 – Cascade arrangement of target parts for efficient testing . 19
Figure C.1 – Bending configuration . 20
Figure D.1 – Possibility of inhomogeneous local curvature distribution . 21
– 4 – IEC 62047-35:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 35: Test method of electrical characteristics under bending
deformation for flexible electromechanical devices
FOREWORD
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