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IEC 62047-37
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor
application
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 37: Méthodes d’essai d’environnement des couches minces
piézoélectriques MEMS pour les applications de type capteur
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IEC 62047-37
Edition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor
application
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 37: Méthodes d’essai d’environnement des couches minces
piézoélectriques MEMS pour les applications de type capteur
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99; 31.140 ISBN 978-2-8322-8231-1
– 2 – IEC 62047-37:2020 © IEC 2020
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Testing procedure . 6
4.1 General . 6
4.2 Initial measurements . 7
4.3 Tests . 7
4.3.1 DUT setup and environmental conditions . 7
4.3.2 Test duration . 7
4.3.3 Number of tests and number of DUTs . 7
4.4 Post-treatment . 8
4.5 Final measurements . 8
5 Environmental and dielectric withstand testing . 8
5.1 Environmental testing . 8
5.1.1 General . 8
5.1.2 High-temperature bias test . 9
5.1.3 High-temperature and high-humidity bias test . 9
5.1.4 High-temperature storage . 9
5.1.5 Low-temperature storage . 10
5.1.6 High-temperature and high-humidity storage . 10
5.1.7 Soldering heat test . 10
5.1.8 Temperature cycling test . 11
5.2 Dielectric withstand testing . 12
Annex A (informative) Report of test results . 14
A.1 General . 14
A.2 High-temperature bias test . 14
Bibliography . 16
Figure 1 – Flow of the testing procedure . 7
Figure 2 – Temperature profile for reflow soldering with lead-free solder . 11
Figure 3 – Temperature profile of the temperature cycling test . 12
Figure 4 – Example of a dielectric withstand test circuit for DC voltage . 13
Figure A.1 – Measurement setup of direct piezoelectric coefficient . 15
Table 1 – Selectable test conditions . 9
Table 2 – Selectable test conditions . 10
Table 3 – Soldering heat test condition . 10
Table 4 – Conditions of temperature profile for reflow soldering with lead-free solder . 11
Table A.1 – Example of test conditions for high temperature bias test . 15
Table A.2 – High temperature bias test: 23 °C and 100 °C . 15
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 37: Environmental test methods of MEMS
piezoelectric thin films for sensor application
FOREWORD
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International Standard IEC 62047-37 has been prepared by subcommittee 47F:
...