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IEC 60749-15
Edition 3.0 2020-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices
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IEC 60749-15
Edition 3.0 2020-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-8686-9
– 2 – IEC 60749-15:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 7
4.3 Heatsinks or shielding . 7
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 8
6 Procedure . 8
6.1 Test method . 8
6.2 Ageing and pre-conditioning of specimens . 8
6.3 Preparation of the solder bath . 8
6.4 Use of flux . 8
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 9
6.8 Failure criteria . 9
7 Summary . 9
Bibliography . 10
Table 1 – Parameters for solder dipping. 7
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 15: Resistance to soldering temperature
for through-hole mounted devices
FOREWORD
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This redline version of the official IEC Standard allows the user to identify the changes
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– 4 – IEC 60749-15:2020 RLV © IEC 2020
International Standard IEC 60749-15 has been prepared by IEC technical committee 47:
Semiconductor devices.
This third edition cancels and replaces the second edition published in 2010. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of new Clause 3, Terms and definitions;
b) clarification of the use of a soldering iron for producing the heating effect;
c) inclusion an option to use accelerated ageing.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2630/FDIS 47/2639/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
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SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 15: Resistance to soldering temperature
for through-hole mounted devices
1 Scope
This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering or a soldering iron.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of
semiconductors, the clauses of this standard apply.
2 General
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60749-3, Semiconductor devices – Mechanical and climatic test methods – Part 3:
External visual examination
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
– 6 – IEC 60749-15:2020 RLV © IEC 2020
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
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• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
colophony
DEPRECATED: rosin
natural resin obtained as the residue after removal of turpentine from the oleo-resin of the
pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin
acid esters
Note 1 to entry: "Rosin" is a synonym for colophony, and is deprecated because of the common co
...