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IEC 60352-5
Edition 5.0 2020-07
INTERNATIONAL
STANDARD
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical
guidance
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IEC 60352-5
Edition 5.0 2020-07
INTERNATIONAL
STANDARD
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical
guidance
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.220.10 ISBN 978-2-8322-8476-6
– 2 – IEC 60352-5:2020 © IEC 2020
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Requirements . 10
4.1 General . 10
4.2 Tools . 10
4.2.1 General . 10
4.2.2 Tools evaluation . 10
4.3 Press-in terminations . 10
4.3.1 Materials . 10
4.3.2 Dimensions of the press-in zone . 10
4.3.3 Surface finishes . 10
4.4 Test boards . 11
4.4.1 General . 11
4.4.2 Materials . 11
4.4.3 Thickness of test boards . 11
4.4.4 Hole. 11
4.4.5 Plated-through hole . 12
4.5 Press-in connections . 13
4.6 Manufacturer´s specification . 14
5 Tests . 15
5.1 General remarks . 15
5.1.1 General . 15
5.1.2 Standard conditions for testing . 15
5.1.3 Mounting of specimens . 15
5.2 Test and measuring methods . 16
5.2.1 General examination . 16
5.2.2 Mechanical tests . 16
5.2.3 Contact resistance measurements . 19
5.2.4 Climatic tests . 20
5.3 Test schedules . 21
5.3.1 General . 21
5.3.2 Qualification test schedule . 21
5.3.3 Flow chart . 23
5.3.4 Application test schedule . 24
5.4 Test report . 25
5.4.1 Qualification test report . 25
5.4.2 Application test report . 26
Annex A (informative) Practical guidance . 27
A.1 General . 27
A.2 Current-carrying capacity . 27
A.3 Tool information . 27
A.3.1 Termination insertion tool . 27
A.3.2 Support block . 27
A.3.3 Termination removal tool . 28
A.4 Information to press-in termination and press-in connections . 28
A.4.1 General . 28
A.4.2 Design features . 28
A.4.3 Materials and surface finishes . 29
A.4.4 Press-in terminations with connector contact elements . 29
A.5 Printed board information . 29
A.5.1 General . 29
A.5.2 Plated-through hole . 30
A.5.3 Dimensioning of the hole . 30
A.5.4 Manufacturing of the hole, example with drilling for FR4 . 31
A.5.5 Manufacturing of the hole with materials other than FR4 . 31
A.6 Press-in connection information . 31
A.6.1 General . 31
A.6.2 Press-in connection . 31
A.6.3 Repair of press-in connections . 32
A.6.4 Combination of press-in connections and soldered connections . 33
A.6.5 Bimetallic electrolytic corrosion effects . 33
Bibliography . 34
Figure 1 – Guide for hole ranges in a test board . 12
Figure 2 – Plated-through hole . 13
Figure 3 – Location and example of the transversal microsection for measuring the
copper thickness . 13
Figure 4 – Test arrangement – push-out force. 17
Figure 5 – Transverse section of a press-in connection . 18
Figure 6 – Longitudinal section of a press-in connection . 19
Figure 7 – Test arrangement for contact resistance . 20
Figure 8 – Qualification test schedule . 24
Figure A.1 – Conceptual composition of a four-layer printed circuit board . 30
Figure A.2 – Example of a termination removal tool . 33
Table 1 – Plated-through hole requirements for test printed boards . 12
Table 2 – Vibration, preferred test severities . 18
Table 3 – Qualification test schedule – Test group AP . 22
Table 4 – Qualification test schedule – Test group BP . 22
Table 5 – Qualification test schedule – Test group CP . 23
Table 6 – Application test schedule – Test group DP . 25
Table A.1 – Example for dimensioning the printed circuit board hole . 31
– 4 – IEC 60352-5:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections – General requirements,
test methods and practical guidance
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representati
...