IEC 61760-3:2021

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

IEC 61760-3:2021

Name:IEC 61760-3:2021   Standard name:Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Standard number:IEC 61760-3:2021   language:English and French language
Release Date:02-Feb-2021   technical committee:TC 91 - Electronics assembly technology
Drafting committee:WG 1 - TC 91/WG 1   ICS number:31.190 - Electronic component assemblies

IEC 61760-3
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 3: Standard method for the specification of components for through-hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)





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IEC 61760-3
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 3: Standard method for the specification of components for through-hole

reflow (THR) soldering
Technique du montage en surface –

Partie 3: Méthode normalisée relative à la spécification des composants pour

le brasage par refusion à trous traversants (THR, Through Hole Reflow)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-9294-5

– 2 – IEC 61760-3:2021 © IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Requirements to component design and component specifications . 9
4.1 General requirement . 9
4.2 Packaging . 9
4.3 Labelling of component packaging . 10
4.4 Component marking . 10
4.5 Storage and transportation . 10
4.6 Component outline and design . 10
4.6.1 Drawing and specification . 10
4.6.2 Requirement of pick-up area . 11
4.6.3 Component tilt . 13
4.6.4 Bottom surface requirements . 13
4.6.5 Terminal requirements . 14
4.6.6 Optical recognition . 19
4.6.7 Component height . 19
4.6.8 Component mass . 20
4.7 Mechanical stress . 20
4.8 Component reliability . 20
4.9 Additional requirements for compatibility with lead-free soldering . 20
5 Typical process conditions for THR soldering process . 20
5.1 Mounting by through-hole reflow soldering . 20
5.2 Solder paste supply . 21
5.3 Component insertion . 22
5.4 Reflow soldering methods (recommended) . 22
5.5 Cleaning . 23
5.5.1 General . 23
5.5.2 Cleaning medium and cleaning method . 23
5.5.3 Cleaning process conditions . 23
5.6 Removal and/or replacement of soldered components . 24
6 Relevant tests and requirements for components and component specifications for
THR soldering process . 24
6.1 General . 24
6.2 Wettability . 25
6.3 Dewetting . 25
6.4 Resistance to soldering heat . 25
6.5 Resistance to cleaning solvent . 25
6.5.1 General . 25
6.5.2 Solvent resistance of component . 26
6.5.3 Solvent resistance of marking . 26
6.6 Soldering profile . 26
6.7 Moisture sensitivity level . 26
7 Quality criteria for THR soldering . 26
Annex A (informative) Flux creeping-up and solder wicking . 27

Bibliography . 28

Figure 1 – Example of a component with marked specific orientation put in tape
and tray . 9
Figure 2 – Example of components in a tape . 10
Figure 3 – Pick-up area . 12
Figure 4 – Chuck jaw . 12
Figure 5 – Component side flat surface . 13
Figure 6 – Component top flat surface . 13
Figure 7 – Clearance . 14
Figure 8 – Stand-off height . 14
Figure 9 – Terminal length and protrusion length . 15
Figure 10 – Terminal position tolerance 0,2 mm . 16
Figure 11 – Terminal position tolerance 0,4 mm . 17
Figure 12 – Terminal shape . 18
Figure 13 – Solder wetting . 19
Figure 14 – Typical soldering process steps. 21
Figure 15 – Solder paste supply . 22
Figure A.1 – Example of the flux creeping-up . 27
Figure A.2 – Example of the solder wicking . 27

Table 1 – Typical cleaning conditions. 24

– 4 – IEC 61760-3:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 3: Standard method for the specification of
components for through-hole reflow (THR) soldering

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and ele
...

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