|
IEC 61188-6-2
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-2: Land pattern design – Description of land pattern for the most common
surface mounted components (SMD)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-2: Conception de la zone de report – Description de la zone de report
pour les composants montés en surface (CMS) les plus courants
your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de
CH-1211 Geneva 20
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.
Recherche de publications IEC - IEC online collection - oc.iec.ch
webstore.iec.ch/advsearchform Découvrez notre puissant moteur de recherche et consultez
La recherche avancée permet de trouver des publications IEC gratuitement tous les aperçus des publications. Avec un
en utilisant différents critères (numéro de référence, texte, abonnement, vous aurez toujours accès à un contenu à jour
comité d’études, …). Elle donne aussi des informations sur adapté à vos besoins.
les projets et les publications remplacées ou retirées.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
Le premier dictionnaire d'électrotechnologie en ligne au
Restez informé sur les nouvelles publications IEC. Just
monde, avec plus de 22 000 articles terminologiques en
Published détaille les nouvelles publications parues.
anglais et en français, ainsi que les termes équivalents dans
Disponible en ligne et une fois par mois par email.
16 langues additionnelles. Egalement appelé Vocabulaire
Electrotechnique International (IEV) en ligne.
Service Clients - webstore.iec.ch/csc
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
[email protected] .
IEC 61188-6-2
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-2: Land pattern design – Description of land pattern for the most common
surface mounted components (SMD)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-2: Conception de la zone de report – Description de la zone de report
pour les composants montés en surface (CMS) les plus courants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9354-6
– 2 – IEC 61188-6-2:2021 IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Kinds of target solder process . 6
5 Land pattern determination . 6
6 Requirements . 7
6.1 General requirements . 7
6.2 The proposed land pattern dimension system . 7
6.2.1 Land pattern design . 7
6.2.2 Solder joint fillet design . 8
6.2.3 Courtyard excess . 10
6.2.4 Rounding factor . 10
6.2.5 Relationship between terminal classifications and class of land pattern . 10
6.2.6 Terminal types . 10
6.3 Land pattern for wave soldering . 14
6.3.1 General . 14
6.3.2 Flat bottom terminals . 14
6.3.3 Flat bottom and vertical side terminals . 14
6.4 Land pattern for reflow soldering . 15
6.4.1 General . 15
6.4.2 Flat bottom terminals . 15
6.4.3 Flat bottom and vertical side terminals . 15
6.4.4 Remarks . 16
Annex A (informative) The relation between terminal type and component packages . 19
A.1 Flat bottom terminals . 19
A.2 Flat bottom and vertical side terminals . 19
Annex B (informative) Solder joint fillet designs for wave soldering . 22
Annex C (informative) Courtyard excess for reflow soldering . 23
C.1 Courtyard excess for flat bottom terminals to use the land pattern for reflow
soldering . 23
C.2 Courtyard excess for flat bottom and vertical side terminals to use the land
pattern for reflow soldering . 23
Bibliography . 25
Figure 1 – Example of the dimensional relationship between the drawings of
components with rectangular terminals and the land pattern design . 9
Figure 2 – Definitions of dimensions of the flat bottom terminal types . 11
Figure 3 – Definitions of dimensions of the flat bottom and vertical side terminal types . 14
Figure 4 – Solder touches image. 17
Figure 5 – Unacceptable conditions for overhangs . 18
Table 1 – Relationship between terminal classifications and class of land pattern . 10
Table 2 – Conformity to the wave soldering of the terminal types . 14
Table 3 – Land pattern dimensions for Flat bottom terminals soldered by reflow
soldering . 15
Table 4 – Land pattern dimensions for flat bottom and vertical side terminals soldered
by reflow soldering . 16
Table A.1 – Terminal type classifications 1 – Flat bottom terminals . 19
Table A.2 – Terminal type classifications 2 – Flat bottom and vertical side terminals . 20
Table B.1 – Solder joint fillet design for wave soldering . 22
Table C.1 – Courtyard excess for flat bottom terminals to use the land pattern for
reflow soldering . 23
Table C.2 – Courtyard excess for flat bottom and vertical side terminals to use the
land pattern for reflow soldering . 24
– 4 – IEC 61188-6-2:2021 IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –
Part 6-2: Land pattern design – Description of land pattern
for the most common surface mounted components (SMD)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regiona
...