IEC 60384-2:2021

Fixed capacitors for use in electronic equipment - Part 2: Sectional specification - Fixed metallized polyethylene terephthalate film dielectric DC capacitors

IEC 60384-2:2021

Name:IEC 60384-2:2021   Standard name:Fixed capacitors for use in electronic equipment - Part 2: Sectional specification - Fixed metallized polyethylene terephthalate film dielectric DC capacitors
Standard number:IEC 60384-2:2021   language:English language
Release Date:11-Apr-2021   technical committee:TC 40 - Capacitors and resistors for electronic equipment
Drafting committee:MT 60384-2 - TC 40/MT 60384-2   ICS number:31.060.30 - Paper and plastics capacitors

IEC 60384-2
Edition 5.0 2021-04
INTERNATIONAL
STANDARD
Fixed capacitors for use in electronic equipment –
Part 2: Sectional specification – Fixed metallized polyethylene-terephthalate film
dielectric DC capacitors:




your local IEC member National Committee for further information.

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IEC 60384-2
Edition 5.0 2021-04
INTERNATIONAL
STANDARD
Fixed capacitors for use in electronic equipment –

Part 2: Sectional specification – Fixed metallized polyethylene-terephthalate film

dielectric DC capacitors:
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.060.30 ISBN 978-2-8322-9654-7

– 2 – IEC 60384-2:2021 © IEC 2021
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Preferred ratings and characteristics . 8
4.1 Preferred characteristics . 8
4.2 Preferred values of ratings . 8
4.2.1 Nominal capacitance (C ) . 8
N
4.2.2 Tolerance on nominal capacitance . 8
4.2.3 Rated voltage (U ) . 9
R
4.2.4 Category voltage (U ) . 9
C
4.2.5 Rated temperature . 9
5 Test and measurement procedures, and performance requirements . 9
5.1 Visual examination and check of dimensions . 9
5.2 Electrical tests . 9
5.2.1 Voltage proof . 9
5.2.2 Capacitance . 10
5.2.3 Tangent of loss angle (tan δ) . 10
5.2.4 Insulation resistance . 11
5.3 Robustness of terminations . 12
5.3.1 General . 12
5.3.2 Initial inspections . 12
5.3.3 Test method . 13
5.3.4 Final inspections and requirements . 13
5.4 Resistance to soldering heat . 13
5.4.1 General . 13
5.4.2 Test conditions . 13
5.4.3 Final inspections and requirements . 13
5.5 Solderability . 13
5.5.1 General . 13
5.5.2 Test conditions . 13
5.5.3 Final requirements . 14
5.6 Rapid change of the temperature . 14
5.6.1 General . 14
5.6.2 Initial inspections . 14
5.6.3 Test conditions . 14
5.6.4 Final inspections . 14
5.7 Vibration . 14
5.7.1 General . 14
5.7.2 Test conditions . 14
5.7.3 Final inspections and requirements . 14
5.8 Bump (repetitive shock) . 14
5.8.1 General . 14
5.8.2 Initial inspections . 14
5.8.3 Test conditions . 15

5.8.4 Final inspections and requirements . 15
5.9 Shock . 15
5.9.1 General . 15
5.9.2 Initial inspections . 15
5.9.3 Test conditions . 15
5.9.4 Final inspections and requirements . 15
5.10 Climatic sequence. 16
5.10.1 General . 16
5.10.2 Initial inspections . 16
5.10.3 Dry heat . 16
5.10.4 Damp heat, cyclic, Test Db, first cycle . 16
5.10.5 Cold. 16
5.10.6 Low air pressure . 16
5.10.7 Damp heat, cyclic, Test Db, remaining cycles . 16
5.11 Damp heat, steady state . 17
5.11.1 General . 17
5.11.2 Initial inspections . 17
5.11.3 Test conditions . 17
5.11.4 Final inspections and requirements . 17
5.12 Endurance . 17
5.12.1 General . 17
5.12.2 Initial inspections . 17
5.12.3 Test conditions . 17
5.12.4 Final inspections and requirements . 17
5.13 Charge and discharge . 18
5.13.1 General . 18
5.13.2 Initial inspections . 18
5.13.3 Test conditions . 18
5.13.4 Final inspections and requirements . 19
5.14 Component solvent resistance . 19
5.15 Solvent resistance of the marking . 19
6 Marking . 19
6.1 General . 19
6.2 Information for marking . 19
6.3 Marking of capacitors . 19
6.4 Marking of packaging . 19
6.5 Additional marking . 19
7 Information to be given in a detail specification . 20
7.1 General . 20
7.2 Outline drawing and dimensions . 20
7.3 Mounting . 20
7.4 Rating and characteristics . 20
7.4.1 General . 20
7.4.2 Particular characteristics . 20
7.4.3 Soldering . 20
7.5 Marking . 21
8 Quality assessment procedures . 21
8.1 Primary stage of manufacture . 21
8.2 Structurally similar components . 21
...

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