IEC 60747-8:2010/AMD1:2021

Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

IEC 60747-8:2010/AMD1:2021

Name:IEC 60747-8:2010/AMD1:2021   Standard name:Amendment 1 - Semiconductor devices - Discrete devices - Part 8: Field-effect transistors
Standard number:IEC 60747-8:2010/AMD1:2021   language:English language
Release Date:24-Jun-2021   technical committee:SC 47E - Discrete semiconductor devices
Drafting committee:WG 3 - TC 47/SC 47E/WG 3   ICS number:31.080.30 - Transistors

IEC 60747-8
Edition 3.0 2021-06
INTERNATIONAL
STANDARD
AMENDMENT 1
Semiconductor devices – Discrete devices –
Part 8: Field-effect transistors

IEC 60747-8:2010-12/AMD1:2021-06(en)





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IEC 60747-8
Edition 3.0 2021-06
INTERNATIONAL
STANDARD
AMENDMENT 1
Semiconductor devices – Discrete devices –

Part 8: Field-effect transistors

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.30 ISBN 978-2-8322-9851-0

– 2 – IEC 60747-8:2010/AMD1:2021
© IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
DISCRETE DEVICES –
Part 8: Field-effect transistors

AMENDMENT 1
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
Amendment 1 to IEC 60747-8:2021 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this Amendment is based on the following documents:
Draft Report on voting
47E/726/CDV 47E/744/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Amendment is English.

© IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at /members_experts/refdocs. The main document types developed by IEC are
described in greater detail at /standardsdev/publications/.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 4 – IEC 60747-8:2010/AMD1:2021
© IEC 2021
3.4 Conventional used terms
Replace the existing Table 1 title and whole table in this subclause with the following new
Table 1:
Table 1 – Terms for MOSFET in this document and the conventional used
terms for the inverse diode integrated in the MOSFETs for N-channel
Letter Deprecated terms for inverse diode with
Preferred terms
symbol MOSFET in off-state
Drain-source reverse voltage V Inverse diode forward voltage
SD
MOSFET forward recovery current I Inverse diode reverse recovery current
fr
MOSFET peak forward recovery current I Inverse diode pea
...

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