IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 61760-2:2021

Name:IEC 61760-2:2021   Standard name:Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Standard number:IEC 61760-2:2021   language:English language
Release Date:15-Jul-2021   technical committee:TC 91 - Electronics assembly technology
Drafting committee:WG 1 - TC 91/WG 1   ICS number:31.240 - Mechanical structures for electronic equipment

IEC 61760-2
Edition 3.0 2021-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide




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IEC 61760-2
Edition 3.0 2021-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Surface mounting technology –
Part 2: Transportation and storage conditions of surface mounting devices
(SMD) – Application guide
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.240 ISBN 978-2-8322-4950-5

– 2 – IEC 61760-2:2021 RLV © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope and object . 5
2 Normative references. 5
3 Terms and definitions . 6
4 General conditions . 5
5 Transportation conditions . 6
5.1 General transportation conditions . 6
5.2 Special transportation conditions . 7
5.2.1 General . 7
5.2.2 Category 1 (advised for all products) . 7
5.2.3 Category 2 . 7
6 Storage conditions . 7
7 Related issues . 8
Annex A (informative) Transportation climatic and storage conditions . 9
Annex X (informative) Cross-references for references to the previous edition of this
document . 17
Bibliography . 18

Figure A.1 – Consolidation of mechanical conditions . 15

Table A.1 – Transportation climatic conditions according to IEC 60721-3-2 .
Table A.2 – Transportation mechanical conditions according to IEC 60721-3-2 .
Table A.3 – Storage conditions according to IEC 60721-3-1 .
Table A.1 – Classification of climatic conditions according to IEC 60721-3-2:2018,
Table 1 . 13
Table A.2 – Classification of mechanical conditions according to IEC 60721-3-2:2018,
Table 5 . 14
Table A.3 – Storage conditions according to IEC 60721-3-1:2018, Table 1 . 16
Table X.1 – Cross-references . 17

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
FOREWORD
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This redline version of the official IEC Standard allows the user to identify the changes made to
the previous edition IEC 61760-2:2007. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.

– 4 – IEC 61760-2:2021 RLV © IEC 2021
IEC 61760-2 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1666/CDV 91/1708/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at /members_experts/refdocs. The main document types developed by IEC are
described in greater detail at /standardsdev/publications.
Cross-references for references from this edition 3 to the previous edition 2 of this document
are listed in Annex X of this document.
A list of all parts in the IEC 61760 series, published under the general title Surface mounting
technology, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

SURFACE MOUNTING TECHNOLOGY –
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) –
Application guide
1 Scope and object
This International Standard describes specifies the transportation and storage conditions for
surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of
surface mounting devices, both active and passive. (Conditions for printed boards are not taken
into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that
can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.
Improper transportation and storage of SMDs may can cause deterioration and result in
assembly problems such as poor solderability, delamination and "popcorning".
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays
IEC 60286-6, Packaging of components for automatic handling – Part 6: Bulk case packaging
for surface mounting components
IEC 60721-3-1:2018, Classification of environmental conditions – Part 3-1: Classification of
groups of environmental parameters and their severities –: Storage
IEC 60721-3-2:2018, Classification of environmental conditions – Part 3-2: Classification of
groups of environmental parameters and their severities –: Transportation and handling
IEC 60749 (all parts), Semiconductor devices – Mechanical and climatic test methods
IEC/TS 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic
phenomena – User guide
– 6 – IEC 61760-2:2021 RLV © IEC 2021
3 Terms and definitions
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
No terms and definitions are listed in this document.
4 General conditions
Surface mounting devices shal
...

  • Relates Information
  • ISO 8130-9:1992

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    09-28
  • EN 352-2:2020/FprA1

    EN 352-2:2021/oprA1:2023
    09-28
  • IEC TS 61158-4:1999

    IEC TS 61158-4:1999 - Digital data communications for measurement and control - Fieldbus for use in industrial control systems - Part 4: Data Link protocol specification Released:3/24/1999 Isbn:2831847656
    09-28
  • HD 566 S1:1990

    HD 566 S1:1998
    09-28
  • ISO 5131:1982/Amd 1:1992

    ISO 5131:1982/Amd 1:1992
    09-28
  • EN 60598-2-22:1990

    EN 60598-2-22:1996
    09-27
  • ISO 8504-2:1992

    ISO 8504-2:1992 - Preparation of steel substrates before application of paints and related products -- Surface preparation methods
    09-27
  • EN 12165:2024

    prEN 12165:2022
    09-27
  • IEC TS 61158-6:1999

    IEC TS 61158-6:1999 - Digital data communications for measurement and control - Fieldbus for use in industrial control systems - Part 6: Application Layer protocol specification Released:3/24/1999 Isbn:2831847613
    09-27
  • ISO 4252:1992

    ISO 4252:1992 - Agricultural tractors -- Operator's workplace, access and exit -- Dimensions
    09-27