IEC 63287-1:2021

Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification

IEC 63287-1:2021

Name:IEC 63287-1:2021   Standard name:Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
Standard number:IEC 63287-1:2021   language:English and French language
Release Date:24-Aug-2021   technical committee:TC 47 - Semiconductor devices
Drafting committee:WG 2 - TC 47/WG 2   ICS number:31.080.01 - Semiconductor devices in general

IEC 63287-1
Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Generic semiconductor qualification guidelines –
Part 1: Guidelines for IC reliability qualification

Dispositifs à semiconducteurs – Lignes directrices génériques concernant la
qualification des semiconducteurs –
Partie 1: Lignes directrices concernant la qualification de la fiabilité des circuits
intégrés




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IEC 63287-1
Edition 1.0 2021-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Generic semiconductor qualification guidelines –

Part 1: Guidelines for IC reliability qualification

Dispositifs à semiconducteurs – Lignes directrices génériques concernant la

qualification des semiconducteurs –

Partie 1: Lignes directrices concernant la qualification de la fiabilité des circuits

intégrés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-1017-2

– 2 – IEC 63287-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Product categories and applications . 8
5 Failure . 9
5.1 Failure distribution . 9
5.2 Early failure . 10
5.2.1 Description . 10
5.2.2 Early failure rate . 11
5.2.3 Screening . 15
5.3 Random failure . 17
5.3.1 Description . 17
5.3.2 Mean failure rate . 18
5.4 Wear-out failure . 21
5.4.1 Description . 21
5.4.2 Wear-out failure rate . 21
6 Reliability test . 24
6.1 Reliability test description . 24
6.2 Reliability test plan . 24
6.2.1 Procedures for creating a reliability test plan . 24
6.2.2 Estimation of the test time required to confirm the TDDB from the
number of test samples . 27
6.2.3 Estimation of the number of samples required to confirm the TDDB from
the test time. 28
6.3 Reliability test methods . 29
6.4 Acceleration models for reliability tests . 33
6.4.1 Arrhenius model . 33
6.4.2 V-model . 33
6.4.3 Absolute water vapor pressure model . 33
6.4.4 Coffin-Manson model . 33
6.5 Concept of family . 34
6.5.1 General . 34
6.5.2 Conducting life test using family . 34
6.5.3 Verification of early failure rate using family . 37
7 Stress test methods . 39
8 Supplementary tests . 40
9 Summary table of assumptions . 40
10 Summary . 42
Bibliography . 43

Figure 1 – Bathtub curve . 10
Figure 2 – Failure process of IC manufacturing lots during the early failure period . 11
Figure 3 – Weibull conceptual diagram of the early failure rate . 12

Figure 4 – Example of a failure ratio: α (in hundreds) and the number of failures for CL
of 60 % . 14
Figure 5 – Screening and estimated early fail rate in Weibull diagram . 16
Figure 6 – Bathtub curve setting the point immediately after production as the origin . 17
Figure 7 – Bathtub curve setting the point after screening as the origin. 17
Figure 8 – Conceptual diagram of calculation method for the mean failure rate from the
exponential distribution . 18
Figure 9 – Conceptual diagram of calculation method for the mean failure rate as an
extension of early failure . 19
Figure 10 – Conceptual diagram of the wear-out failure . 21
Figure 11 – Conceptual diagram describing the concept of the acceleration test . 22
Figure 12 – Concept of the reliability test in a Weibull diagram (based on sample size) . 26
Figure 13 – Concept of the reliability test in a Weibull diagram (based on test time) . 29
Figure 14 – Difference in sampling sizes according to the m value (image) . 30
Figure 15 – How the screening defect rate is seen depending on the difference of chip
size (example) . 37

Table 1 – Examples of product categories . 9
–6
Table 2 – Cumulative failure probability 0,1 % over 10 years [×10 ] for the third, fifth
and seventh years . 26
Table 3 – Major reliability (life) test methods and purposes . 31
Table 4 – Examples of the number of test samples and the test time in typical reliability
(life) test methods . 32
Table 5 – Concept of family (example) . 34
Table 6 – Concept of difference/failure mechanism/corresponding test item (examples). 36
Table 7 – Factors for calculation examples of early failure rate using family data . 38
Table 8 – LTPD sampling table for acceptance number Ac = 0 . 39
Table 9 – Major reliability (strength) test methods and purposes . 39
Table 10 – Supplementary tests . 40
a
Table 11 – Accelerating factors, cal
...

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