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IEC 63244-1
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor devices for wireless power transfer
and charging –
Part 1: General requirements and specifications
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert
de puissance et la charge sans fil –
Partie 1: Exigences et spécifications générales
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IEC 63244-1
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor devices for wireless power transfer
and charging –
Part 1: General requirements and specifications
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert
de puissance et la charge sans fil –
Partie 1: Exigences et spécifications générales
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-1023-2
– 2 – IEC 63244-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and symbols. 8
3.1 Terms and definitions . 8
3.1.1 General terminology . 8
3.1.2 Terminology for near-field based wireless power transfer . 9
3.1.3 Terminology for far-field based wireless power transfer . 10
3.2 Symbols and abbreviated terms . 11
4 Classification . 12
5 Test items for reliability . 14
5.1 General . 14
5.2 IP rating . 14
5.3 Temperature test . 15
5.4 Humidity test . 15
5.5 Mechanical impact and vibration test . 15
5.6 EMC test . 15
5.6.1 General . 15
5.6.2 Electromagnetic immunity . 15
5.6.3 Electromagnetic emission . 15
6 Performance evaluation items . 16
6.1 Efficiency . 16
6.1.1 General . 16
6.1.2 Block diagram for efficiency analysis . 16
6.1.3 Component-level efficiency . 17
6.1.4 Module-level efficiency . 20
6.1.5 System-level power transfer efficiency . 22
6.2 Evaluation components in PTx and PRx . 23
6.2.1 General . 23
6.2.2 Rectifier and ripple smoothing circuit . 23
6.2.3 DC to DC converter . 26
6.2.4 Inverter . 27
6.2.5 Variable gain amplifier (VGA) . 29
Annex A (informative) Field regions for electromagnetically short antenna . 32
Bibliography . 33
Figure 1 – Classification of WET technologies . 13
Figure 2 – Example of reliability test conditions and items . 14
Figure 3 – Block diagram for efficiency analysis of MF WPT system . 16
Figure 4 – Block diagram for efficiency analysis of EMW WPT system . 16
Figure 5 – Measurement setup for AC to DC converting efficiency or rectifying
efficiency . 18
Figure 6 – Measurement setup for DC to DC converting efficiency . 19
Figure 7 – Measurement setup for DC to AC converting efficiency . 20
Figure 8 – Measurement setup for coupling efficiency between transmitting and
receiving coils . 21
Figure 9 – Measurement setup for power transfer efficiency between power
transmitting and receiving antennas . 22
Figure 10 – Semiconductor components in PTx and PRx . 23
Figure 11 – Half-wave rectifier and input/output waveform . 25
Figure 12 – Full-wave rectifier and input/output waveform . 26
Figure 13 – Diode- bridge rectifier and RC smoothing circuits . 26
Figure 14 – Example of step down converter (Buck converter) and step up converter
(Boost converter) . 27
Figure 15 – Example of equivalent circuit and square AC output signal . 28
Figure 16 – Block diagram of VGA . 29
Figure 17 – 3 dB bandwidth . 30
Figure 18 – P1dB, MDS and dynamic input range of a variable gain amplifier . 30
Figure A.1 – Field regions for electromagnetically short antenna . 32
Table 1 – Letter symbols and abbreviated terms . 12
Table 2 – Example of blank specifications: classification of wireless power transfer
methods and distance according to products and power consumption . 13
Table 3 – Example of blank specifications of a rectifier diode. 24
Table 4 – Example of blank specifications of a step- down DC-to-DC converter . 27
Table 5 – Example of blank specifications of an inverter used for MF WPT . 28
– 4 – IEC 63244-1:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR DEVICES FOR WIRELESS
POWER TRANSFER AND CHARGING –
Part 1: General requirements and specifications
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may part
...