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SLOVENSKI STANDARD
01-junij-2018
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SIST EN 60191-1:2008
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Mechanical standardization of semiconductor devices - Part 1: General rules for the
preparation of outline drawings of discrete devices (IEC 60191-1:2018)
Mechanische Normung von Halbleiterbauelementen - Teil 1: Allgemeine Regeln für die
Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen (IEC 60191-
1:2018)
Normalisation mécanique des dispositifs à semi-conducteurs - Partie 1: Règles
générales pour la préparation des dessins d'encombrement des dispositifs discrets (IEC
60191-1:2018)
Ta slovenski standard je istoveten z: EN IEC 60191-1:2018
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60191-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2018
ICS 31.080.01 Supersedes EN 60191-1:2007
English Version
Mechanical standardization of semiconductor devices - Part 1:
General rules for the preparation of outline drawings of discrete
devices
(IEC 60191-1:2018)
Normalisation mécanique des dispositifs à semi- Mechanische Normung von Halbleiterbauelementen - Teil
conducteurs - Partie 1: Règles générales pour la 1: Allgemeine Regeln für die Erstellung von
préparation des dessins d'encombrement des dispositifs Gehäusezeichnungen von Einzelhalbleiterbauelementen
discrets (IEC 60191-1:2018)
(IEC 60191-1:2018)
This European Standard was approved by CENELEC on 2018-02-27. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60191-1:2018 E
European foreword
The text of document 47D/886/CDV, future edition 3 of IEC 60191-1, prepared by IEC/SC 47D
"Semiconductor devices packaging, of IEC technical committee 47: Semiconductor devices" was
submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 60191-1:2018.
The following dates are fixed:
(dop) 2018-11-27
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-02-27
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60191-1:2007.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60191-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60191-6 (series) NOTE Harmonized as EN 60191-6 (series).
ISO 5459:2011 NOTE Harmonized as EN ISO 5459:2011 (not modified).
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60191-2 - Mechanical standardization of - -
semiconductor devices - Part 2:
Dimensions
IEC 60191-4 - Mechanical standardization of EN 60191-4 -
semiconductor devices - Part 4: Coding
system and classification into forms of
package outlines for semiconductor device
packages
IEC 60191-6-1 - Mechanical standardization of EN 60191-6-1 -
semiconductor devices - Part 6-1: General
rules for the preparation of outline
drawings of surface mounted
semiconductor device packages - Design
guide for gull-wing lead terminals
IEC 60191-6-3 - Mechanical standardization of EN 60191-6-3 -
semiconductor devices - Part 6-3: General
rules for the preparation of outline
drawings of surface mounted
semiconductor device packages -
Measuring methods for package
dimensions of quad flat packs (QFP)
IEC 60191-6-20 - Mechanical standardization of EN 60191-6-20 -
semiconductor devices - Part 6-20:
General rules for the preparation of outline
drawings of surface mounted
semiconductor device packages -
Measuring methods for package
dimensions of small outline J-lead
packages (SOJ)
IEC 60191-6-21 - Mechanical standardization of EN 60191-6-21 -
semiconductor devices - Part 6-21:
General rules for the preparation of outline
drawings of surface mounted
semiconductor device packages -
Measuring methods for package
dimensions of small outline packages
(SOP)
IEC 60191-1
Edition 3.0 2018-01
INTERNATIONAL
STANDARD
Mechanical standardization of semiconductor devices –
Part 1: General rules for the preparation of outline drawings of discrete devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-5266-6
– 2 – IEC 60191-1:2018 IEC 2018
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General rules for all drawings . 8
4.1 Drawing layout . 8
4.2 Dimensions and tolerances . 9
4.3 Methods for locating the datum . 10
4.4 Numbering of terminals . 11
4.4.1 General . 11
4.4.2 Single-ended devices with terminals in a linear array . 11
4.4.3 Single-ended devices with terminals in a circular array . 11
4.4.4 Double-ended devices . 11
4.4.5 Devices with terminals disposed in a square or rectangular periphery . 11
4.4.6 Particular case of lozenge – shaped bases . 11
4.4.7 Other devices . 12
5 Additional rules . 12
5.1 Rules for device and case outline drawings . 12
5.2 Rules to specify the dimensions and positions of terminals . 13
5.2.1 General rules . 13
5.2.2 Rules to specify the dimensions and the positions of the terminals on a
base drawing . 13
5.3 Rules for gauge drawings . 13
6 Inter-conversion of inch and millimetre dimensions and rules for rounding off . 14
7 Rules for coding . 14
Annex A (informative) Reference letter symbols . 15
Annex B (informative) Rules to specify the dimensions and positions of terminals on a
base drawing . 18
B.1 Example of dimensioning for a circular base outline with no tab and having
four terminals located symmetrically on a pitch circle . 18
B.1.1 Interpretation of the principle of dimensioning . 18
B.1.2 Checking . 19
B.2 Example of dimensioning for a circular base outline with a tab and having
four terminals located symmetrically on a pitch circle . 19
B.2.1 Interpretation of the principle of dimensioning . 19
B.2.2 Checking . 20
Annex C (normative) General philosophy of flat base devices . 24
Annex D (normative) Special rules for SMD-packages . 26
D.1 General reference . 26
D.2 Lead terminals . 26
D.3 Measuring methods . 26
Annex E (informative) Examples of semiconductor device drawings . 27
Annex F (informative) Former rules for rounding off . 33
F.1 Toleranced dimensions . 33
F.1.1 Maximum and minimum values of toleranced dimensions . 33
F.1.2 Nominal value of toleranced dimensions . 33
IEC 60191-1:2018 © IEC 2018 – 3 –
F.2 Untoleranced dimensions (maximum only or minimum only) . 33
F.3 Untoleranced nominal dimensions given for general information . 33
F.4 Untoleranced nominal dimensions given to specify true geometrical positions . 34
Annex G (informative) Former rules for coding . 35
G.1 General . 35
G.2 Device outlines . 35
G.3 Bases . 35
G.4 Case outlines . 35
G.5 Type variants and provisional drawings . 35
Bibliography . 36
Figure 1 – Numbering of terminals for the particular case of lozenge – shaped bases . 12
Figure 2 – System to indicate the dimensions of the terminals . 13
Figure B.1 – Circular base outline with no tab .
...