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SLOVENSKI STANDARD
01-oktober-2021
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-2. del:
Razmestitev priključkov - Opis razmestitve priključkov za najpogostejše elemente
za površinsko montažo (SMD)
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern
design - Description of land pattern for the most common surface mounted components
(SMD)
Ta slovenski standard je istoveten z: EN IEC 61188-6-2:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61188-6-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.180; 31.190
English Version
Circuit boards and circuit board assemblies - Design and use -
Part 6-2: Land pattern design - Description of land pattern for the
most common surface mounted components (SMD)
(IEC 61188-6-2:2021)
Cartes imprimées et cartes imprimées équipées - Leiterplatten und Flachbaugruppen - Konstruktion und
Conception et utilisation - Partie 6-2: Conception de la zone Anwendung - Teil 6-2: Anschlussflächenbild - Beschreibung
de report - Description de la zone de report pour les des Anschlussflächenbilds für die meisten
composants montés en surface (CMS) les plus courants oberflächenmontierbaren Bauelemente (SMD, en: surface
(IEC 61188-6-2:2021) mounted components)
(IEC 61188-6-2:2021)
This European Standard was approved by CENELEC on 2021-03-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61188-6-2:2021 E
European foreword
The text of document 91/1637/CDV, future edition 1 of IEC 61188-6-2, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61188-6-2:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-11
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-11
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61188-6-2:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61188-5-1:2002 NOTE Harmonized as EN 61188-5-1:2002 (not modified)
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4
IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8
IEC 61191 (series) NOTE Harmonized as EN 61191 (series)
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2:
Common usage in electronic
technologies as well as printed board
and electronic assembly technologies
IEC 61188-6-1 - Circuit boards and circuit board EN IEC 61188-6-1 -
assemblies - Design and use - Part 6-1:
Land pattern design - Generic
requirements for land pattern on circuit
boards
IEC 61188-6-4 - Printed boards and printed board EN IEC 61188-6-4 -
assemblies - Design and use - Part 6-4:
Land pattern design - Generic
requirements for dimensional drawings
of surface mounted components (SMD)
from the viewpoint of land pattern
design
IEC 61191-2 2017 Printed board assemblies - Part 2: EN 61191-2 2017
Sectional specification - Requirements
for surface mount soldered assemblies
To be published. Stage at the time of publication: prEN IEC 61188-6-1:2020.
IEC 61188-6-2
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-2: Land pattern design – Description of land pattern for the most common
surface mounted components (SMD)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-2: Conception de la zone de report – Description de la zone de report
pour les composants montés en surface (CMS) les plus courants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9354-6
– 2 – IEC 61188-6-2:2021 IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Kinds of target solder process . 6
5 Land pattern determination . 6
6 Requirements . 7
6.1 General requirements . 7
6.2 The proposed land pattern dimension system . 7
6.2.1 Land pattern design . 7
6.2.2 Solder joint fillet design . 8
6.2.3 Courtyard excess . 10
6.2.4 Rounding factor . 10
6.2.5 Relationship between terminal classifications and class of land pattern . 10
6.2.6 Terminal types . 10
6.3 Land pattern for wave soldering . 14
6.3.1 General . 14
6.3.2 Flat bottom terminals . 14
6.3.3 Flat bottom and vertical side terminals . 14
6.4 Land pattern for reflow soldering . 15
6.4.1 General . 15
6.4.2 Flat bottom terminals . 15
6.4.3 Flat bottom and vertical side terminals . 15
6.4.4 Remarks . 16
Annex A (informative) The relation between terminal type and component packages . 19
A.1 Flat bottom terminals . 19
A.2 Flat bottom and vertical side terminals . 19
Annex B (informative) Solder joint fillet designs for wave soldering . 22
Annex C (informative) Courtyard excess for reflow soldering . 23
C.1 Courtyard excess for flat bottom terminals to use the land pattern for reflow
soldering . 23
C.2 Courtyard excess for flat bottom and vertical side terminals to use the land
pattern for reflow soldering . 23
Bibliography . 25
Figure 1 – Example of the dimensional relationship between the drawings of
components with rectangular terminals and the land pattern design . 9
Figure 2 – Definitions of dimensions of the flat bottom terminal types . 11
Figure 3 – Definitions of dimensions of the flat bottom and vertical side terminal types . 14
Figure 4 – Solder touches image. 17
Figure 5 – Unacceptable conditions for overhangs . 18
Table 1 – Relationship between terminal classifications and class of land pattern . 10
Table 2 – Conformity to the wave soldering of the terminal types . 14
IEC 61188-6-2:2021 IEC 2021 – 3 –
Table 3 – Land pattern dimensions for Flat bottom terminals soldered by reflow
soldering . 15
Table 4 – Land pattern dimensions for flat bottom and vertical side terminals soldered
by reflow soldering . 16
Table A.1 – Terminal type classifications 1 – Flat bottom terminals . 19
Table A.2 – Terminal type classifications 2 – Flat bottom and vertical side terminals . 20
Table B.1 – Solder joint fillet design for wave soldering . 22
Table C.1 – Courtyard excess for flat bottom terminals to use the land pattern for
reflow soldering . 23
Table C.2 – Courtyard excess for flat bottom and vertical side terminals to use the
land pattern for reflow soldering . 24
– 4 – IEC 61188-6-2:2021 IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –
Part 6-2: Land pattern design – Description of land pattern
for the most common surface mounted components (SMD)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activit
...