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SLOVENSKI STANDARD
01-junij-2021
Nadomešča:
SIST EN 61760-3:2010
Tehnologija površinske montaže - 3. del: Standardne metode za specifikacijo
komponent za spajkanje "Through Hole Reflow" (THR)
Surface mounting technology - Part 3: Standard method for the specification of
components for through hole reflow (THR) soldering
Technique du montage en surface - Partie 3 : Méthode normalisée relative à la
spécification des composants pour le brasage par refusion à trous traversants (THR,
Through Hole Reflow)
Ta slovenski standard je istoveten z: EN IEC 61760-3:2021
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61760-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.190 Supersedes EN 61760-3:2010 and all of its amendments
and corrigenda (if any)
English Version
Surface mounting technology - Part 3: Standard method for the
specification of components for through-hole reflow (THR)
soldering
(IEC 61760-3:2021)
Technique du montage en surface - Partie 3: Méthode Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren
normalisée relative à la spécification des composants pour zur Spezifizierung von Durchsteckmontage-Bauelementen
le brasage par refusion à trous traversants (THR, Through für das Aufschmelzlöten (THR)
Hole Reflow) (IEC 61760-3:2021)
(IEC 61760-3:2021)
This European Standard was approved by CENELEC on 2021-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61760-3:2021 E
European foreword
The text of document 91/1684/FDIS, future edition 2 of IEC 61760-3, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61760-3:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-10
document have to be withdrawn
This document supersedes EN 61760-3:2010 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61760-3:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-82:2019 NOTE Harmonized as EN IEC 60068-2-82:2019 (not modified)
IEC 62090 NOTE Harmonized as EN 62090
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068 series Environmental testing - -
IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - EN 60068-2-20 2008
Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads
IEC 60068-2-21 - Environmental testing - Part 2-21: Tests - EN 60068-2-21 -
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-45 1980 Basic environmental testing procedures - EN 60068-2-45 1992
Part 2-45: Tests - Test XA and guidance:
Immersion in cleaning solvents
+ A1 1993 + A1 1993
IEC 60068-2-58 - Environmental testing - Part 2-58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
IEC 60068-2-77 - Environmental testing - Part 2-77: Tests - EN 60068-2-77 -
Test 77: Body strength and impact shock
IEC 60194-1 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
To be integrated into the seventh edition of IEC 60068-2-21. Stage at the time of publication: IEC/AFDIS 60068-
2-21:2021.
Publication Year Title EN/HD Year
IEC 60286 series Packaging of components for automatic EN 60286 series
handling
IEC 60286-3 - Packaging of components for automatic EN IEC 60286-3 -
handling - Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4 - Packaging of components for automatic EN 60286-4 -
handling - Part 4: Stick magazines for
electronic components encapsulated in
packages of different forms
IEC 60286-5 - Packaging of components for automatic EN IEC 60286-5 -
handling - Part 5: Matrix trays
IEC 60749-20 - Semiconductor devices - Mechanical and EN IEC 60749-20 -
climatic test methods - Part 20:
Resistance of plastic encapsulated SMDs
to the combined effect of moisture and
soldering heat
IEC 61188-6-4 - Printed boards and printed board EN IEC 61188-6-4 -
assemblies - Design and use - Part 6-4:
Land pattern design - Generic
requirements for dimensional drawings of
surface mounted components (SMD) from
the viewpoint of land pattern design
IEC 61191-3 - Printed board assemblies - Part 3: EN 61191-3 -
Sectional specification - Requirements for
through-hole mount soldered assemblies
IEC 61760-1 2020 Surface mounting technology - Part 1: EN IEC 61760-1 2020
Standard method for the specification of
surface mounting components (SMDs)
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of
surface mounting devices (SMD) -
Application guide
IEC 61760-4 2015 Surface mounting technology - Part 4: EN 61760-4 2015
Classification, packaging, labelling and
handling of moisture sensitive devices
IPC/JEDEC - Moisture/Reflow Sensitivity Classification - -
J-STD-020 for Non-hermetic Solid State Surface
Mount Devices
IPC-A-610 - Acceptability of Electronics Assemblies - -
IEC 61760-3
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology –
Part 3: Standard method for the specification of components for through-hole
reflow (THR) soldering
Technique du montage en surface –
Partie 3: Méthode normalisée relative à la spécification des composants pour
le brasage par refusion à trous traversants (THR, Through Hole Reflow)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190 ISBN 978-2-8322-9294-5
– 2 – IEC 61760-3:2021 © IEC 2021
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Requirements to component design and component specifications . 9
4.1 General requirement . 9
4.2 Packaging . 9
4.3 Labelling of component packaging . 10
4.4 Component marking . 10
4.5 Storage and transportation . 10
4.6 Component outline and design . 10
4.6.1 Drawing and specification . 10
4.6.2 Requirement of pick-up area . 11
4.6.3 Component tilt . 13
4.6.4 Bottom surface requirements . 13
4.6.5 Terminal requirements . 14
4.6.6 Optical recognition . 19
4.6.7 Component height . 19
4.6.8 Component mass . 20
4.7 Mechanical stress . 20
4.8 Component reliability . 20
4.9 Additional requirements for compatibility with lead-free soldering . 20
5 Typical process conditions for THR soldering process . 20
5.1 Mounting by through-hole reflow soldering . 20
5.2 Solder paste supply . 21
5.3 Component insertion . 22
5.4 Reflow soldering methods (recommended) . 22
5.5 Cleaning . 23
5.5.1 General . 23
5.5.2 Cleaning medium and cleaning method . 23
5.5.3 Cleaning process conditions . 23
5.6 Removal and/or replacement of soldered components . 24
6 Relevant tests and requirements for components and component specifications for
THR soldering process . 24
6.1 General . 24
6.2 Wettability . 25
6.3 Dewetting . 25
6.4 Resistance to soldering heat . 25
6.5 Resistance to cleaning solvent . 25
6.5.1 General . 25
6.5.2 Solvent resistance of component . 26
6.5.3 Solvent resistance of marking . 26
6.6 Soldering profile . 26
6.7 Moisture sensitivity level .
...