|
SLOVENSKI STANDARD
01-oktober-2021
Nadomešča:
SIST EN 61188-5-1:2003
Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-1. del:
Razmestitev priključkov - Osnovne zahteve za razmestitev priključkov na tiskanih
vezjih
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern
design - Generic requirements for land pattern on circuit boards
Ta slovenski standard je istoveten z: EN IEC 61188-6-1:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61188-6-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2021
ICS 31.180; 31.190 Supersedes EN 61188-5-1:2002 and all of its
amendments and corrigenda (if any)
English Version
Circuit boards and circuit board assemblies - Design and use -
Part 6-1: Land pattern design - Generic requirements for land
pattern on circuit boards
(IEC 61188-6-1:2021)
Cartes imprimées et cartes imprimées équipées - Leiterplatten und Flachbaugruppen - Konstruktion und
Conception et utilisation - Partie 6-1: Conception de la zone Anwendung - Teil 6-1: Anschlussflächengestaltung -
de report - Exigences génériques pour la zone de report sur Allgemeine Anforderungen an die Anschlussflächenstruktur
les cartes imprimées auf Leiterplatten
(IEC 61188-6-1:2021) (IEC 61188-6-1:2021)
This European Standard was approved by CENELEC on 2021-03-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61188-6-1:2021 E
European foreword
The text of document 91/1636/CDV, future edition 1 of IEC 61188-6-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61188-6-1:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-30
document have to be withdrawn
This document supersedes EN 61188-5-1:2002 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61188-6-1:2021 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61188-5-1:2002 NOTE Harmonized as EN 61188-5-1:2002 (not modified)
IEC 61188-5-2:2003 NOTE Harmonized as EN 61188-5-2:2003 (not modified)
IEC 61188-5-3:2007 NOTE Harmonized as EN 61188-5-3:2007 (not modified)
IEC 61188-5-4:2007 NOTE Harmonized as EN 61188-5-4:2007 (not modified)
IEC 61188-5-5:2007 NOTE Harmonized as EN 61188-5-5:2007 (not modified)
IEC 61188-5-6:2003 NOTE Harmonized as EN 61188-5-6:2003 (not modified)
IEC 61188-5-8:2007 NOTE Harmonized as EN 61188-5-8:2008 (not modified)
IEC 61188-6-2 NOTE Harmonized as EN IEC 61188-6-2
IEC 61760-1 NOTE Harmonized as EN IEC 61760-1
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 - Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61191-1 - Printed board assemblies - Part 1: Generic EN IEC 61191-1 -
specification - Requirements for soldered
electrical and electronic assemblies using
surface mount and related assembly
technologies
IEC 61191-2 2017 Printed board assemblies - Part 2: EN 61191-2 2017
Sectional specification - Requirements for
surface mount soldered assemblies
IEC 61191-3 - Printed board assemblies - Part 3: EN 61191-3 -
Sectional specification - Requirements for
through-hole mount soldered assemblies
IEC 61191-4 - Printed board assemblies - Part 4: EN 61191-4 -
Sectional specification - Requirements for
terminal soldered assemblies
IEC 61760-3 - Surface mounting technology - Part 3: EN IEC 61760-3 -
Standard method for the specification of
components for through-hole reflow (THR)
soldering
IEC 61188-6-1
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-1: Land pattern design – Generic requirements for land pattern on
circuit boards
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-1: Conception de la zone de report – Exigences génériques pour la zone
de report sur les cartes imprimées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9443-7
– 2 – IEC 61188-6-1:2021 © IEC 2021
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Design requirements . 10
4.1 General . 10
4.2 Product classification . 10
4.3 General surface mount land and land pattern requirements. 11
4.4 Component packages and soldering process . 11
4.5 Soldering surface requirements. 11
4.5.1 Main soldering techniques . 11
4.5.2 Reflow soldering . 11
4.5.3 Reflow soldering of leaded components . 12
4.5.4 Wave soldering of surface mounted components . 12
4.5.5 Wave soldering of through-hole mounted components . 14
4.6 Soldering surface definition techniques . 15
4.6.1 General . 15
4.6.2 Metal defined lands . 15
4.6.3 Solder mask defined lands . 15
4.6.4 Comparison of solder mask defined and non solder mask defined
solderable surfaces . 16
5 Component classification . 16
5.1 General . 16
5.2 Leaded components . 16
5.3 Surface mount components . 17
6 The proportional dimensioning system . 17
7 Terminal classification . 18
7.1 Leaded terminals . 18
7.2 Surface mount terminals . 18
7.2.1 Terminal classes. 18
7.2.2 Flat bottom terminals . 18
7.2.3 General land requirements for flat bottom terminals . 19
7.2.4 Flat bottom and vertical side terminals . 19
7.2.5 General land requirements for flat bottom and vertical side terminals . 20
8 Requirements for lands of solder joints . 20
8.1 Land/Pad dimensioning considerations of leaded terminals . 20
8.2 Land dimensioning considerations of surface mount terminals . 20
Annex A (informative) Dimensioning concept of former IEC 61188-5-1 . 21
A.1 Dimensioning systems . 21
A.1.1 General . 21
A.1.2 Component tolerancing . 22
A.1.3 Solving for dimension Z . 25
A.1.4 Land tolerancing . 25
A.1.5 Fabrication allowances . 25
A.1.6 Assembly tolerancing . 26
IEC 61188-6-1:2021 © IEC 2021 – 3 –
A.1.7 Dimension and tolerance analysis . 27
Annex B (informative) History of land dimensioning standards . 29
B.1 IPC-782 . 29
B.2 IEC 61188-5 series . 29
B.3 IPC-7351 . 29
Bibliography . 30
Figure 1 – Component placed on solder paste . 12
Figure 2 – Component glued for wave soldering. 13
Figure 3 – Wave soldered component with solder thieves . 14
Figure 4 – Solder joint of a leaded component . 15
Figure 5 – Leaded component – Capacitor .
...