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SLOVENSKI STANDARD
01-julij-2018
Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni
sistem in klasifikacija oblik okrovov polprevodniških elementov - Dopolnilo A1
(IEC 60191-4:2013/A1:2018)
Mechanical standardization of semiconductor devices - Part 4: Coding system and
classification into forms of package outlines for semiconductor device packages (IEC
60191-4:2013/A1:2018)
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für
Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für
Halbleiterbauelemente (IEC 60191-4:2013/A1:2018)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de
codification et classification en formes des structures des boîtiers pour dispositifs à
semiconducteurs (IEC 60191-4:2013/A1:2018)
Ta slovenski standard je istoveten z: EN 60191-4:2014/A1:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 60191-4:2014/A1
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2018
ICS 31.080
English Version
Mechanical standardization of semiconductor devices - Part 4:
Coding system and classification into forms of package outlines
for semiconductor device packages
(IEC 60191-4:2013/A1:2018)
Normalisation mécanique des dispositifs à semiconducteurs Mechanische Normung von Halbleiterbauelementen - Teil
- Partie 4: Système de codification et classification en 4: Codierungssystem für Gehäuse und Eingruppierung der
formes des structures des boîtiers pour dispositifs à Gehäuse nach der Gehäuseform für Halbleiterbauelemente
semiconducteurs (IEC 60191-4:2013/A1:2018)
(IEC 60191-4:2013/A1:2018)
This amendment A1 modifies the European Standard EN 60191-4:2014; it was approved by CENELEC on 2018-05-01. CENELEC
members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this amendment the
status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language made by translation under the
responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as
the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60191-4:2014/A1:2018 E
European foreword
The text of document 47D/897/CDV, future edition 3 of IEC 60191-4:2013/A1, prepared by
IEC/TC 47D "Semiconductor devices packaging, of IEC technical committee 47: Semiconductor
devices" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
• latest date by which the document has to be (dop) 2019-02-01
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2021-05-01
• latest date by which the national
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60191-4:2013/A1:2018 was approved by CENELEC as a
European Standard without any modification.
IEC 60191-4
Edition 3.0 2018-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
A MENDMENT 1
AM ENDEMENT 1
Mechanical standardization of semiconductor devices –
Part 4: Coding system and classification into forms of package outlines for
semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 4: Système de codification et classification en formes des structures des
boîtiers pour dispositifs à semiconducteurs
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-5495-0
– 2 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
FOREWORD
This amendment has been prepared by subcommittee 47D: Semiconductor devices packaging,
of IEC technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
CDV Report on voting
47D/897/CDV 47D/904/RVC
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC website under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Add, after Annexes A and B, the following new Annex C:
Annex C
(informative)
Terminology of semiconductor package outlines
To prevent misuse, misunderstanding and confusion of terminology of semiconductor package
outline, correct terms and descriptions are required to be indicated in the international
standards.
Correct terms and descriptions of semiconductor package outline including package code
variations are listed in Table C.1.
IEC 60191-4:2013/AMD1:2018 – 3 –
© IEC 2018
Table C.1 – Package name and parts name
Classification Term Description
Package name Ball Grid Array Package A package with the balls or bumps
placed in a row of 3 x 3 or more, or in
(BGA)
grid, on the upper or lower side of its
body
Package name Low Profile Ball Grid Array Package BGA with the seated height of over
1,2 mm and up to 1,7 mm
(LBGA)
Package name Thin Ball Grid Array Package BGA with the seated height of over
1,0 mm and up to 1,2 mm
(TBGA)
Package name Very Thin Ball Grid Array Package BGA with the seated height of over
0,8 mm and up to 1,0 mm
(VBGA)
Package name Very-very Thin Ball Grid Array Package BGA with the seated height of over
0,65 mm and up to 0,8 mm
(WBGA)
Package name Ultra-thin Ball Grid Array Package BGA with the seated height of over
0,5 mm and up to 0,65 mm
(UBGA)
Package name Extra Thin Ball Grid Array Package BGA with the seated height of up to
0,5 mm
(XBGA)
Package name Heat Sink Ball Grid Array Package BGA with a heat sink
(HBGA)
Package name Heat Sink Low Profile Ball Grid Array Package LBGA with a heat sink
(HLBGA)
Package name Heat Sink Thin Ball Grid Array Package TBGA with a heat sink
(HTBGA)
Package name Heat Sink Very Thin Ball Grid Array Package VBGA with a heat sink
(HVBGA)
Package name Heat Sink Very-very Thin Ball Grid Array WBGA with a heat sink
Package
(HWBGA)
Package name Heat Sink Ultra-thin Ball Grid Array Package UBGA with a heat sink
(HUBGA)
Package name Heat Sink Extra Thin Ball Grid Array Package XBGA with a heat sink
(HXBGA)
Package name Fine Pitch Ball Grid Array Package BGA with the terminal pitch of up to
0,8 mm
(FBGA)
Package name Low Profile Fine Pitch Ball Grid Array Package FBGA with the seated height of over
1,2 mm and up to 1,7 mm
(LFBGA)
Package name Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
1,0 mm and up to 1,2 mm
(TFBGA)
Package name Very Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
0,8 mm and up to 1,0 mm
(VFBGA)
Package name Very-very Thin Fine Pitch Ball Grid Array FBGA with the seated height of over
Package 0,65 mm and up to 0,8 mm
(WFBGA)
– 4 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Ultra-thin Fine Pitch Ball Grid Array Package FBGA with the seated height of over
0,5 mm and up to 0,65 mm
(UFBGA)
Package name Extra Thin Fine Pitch Ball Grid Array Package FBGA with the seated height of up to
0,5 mm
(XFBGA)
Package name Terminal for stack Fine Pitch Ball Grid Array FBGA with the terminals for layer stack
Package
(PFBGA)
Package name Terminal for stack Low Profile Fine Pitch Ball LFBGA with the terminals for layer stack
Grid Array Package
(PLFBGA)
Package name Terminal for stack Thin Fine Pitch Ball Grid TFBGA with the terminals for layer stack
Array Package
(PTFBGA)
Package name Terminal for stack Very Thin Fine Pitch Ball Grid VFBGA with the terminals for layer stack
Array Package
(PVFBGA)
Package name Terminal for stack Very-very Thin Fine Pitch WFBGA with the terminals for layer stack
Ball Grid Array Package
(PWFBGA)
Package name Terminal for stack Ultra-thin Fine Pitch Ball Grid UFBGA with the terminals for layer stack
Array Package
(PUFBGA)
Package name Terminal for stack Extra Thin Fine Pitch Ball XFBGA with the terminals for layer stack
Grid Array Package
(PXFBGA)
Package name Interstitial Ball Grid Array Package Interstitial BGA
(IBGA)
Package name Plastic Ball Grid Array Package Plastic BGA
(P-BGA)
Package name Ceramic Ball Grid Array Package Ceramic BGA
(C-BGA)
Package name Silicon Fine Pitch Ball Grid Array Package Silicon FBGA
(S-FBGA)
Package name Dual Inline Package A package with the leads extended from
the two sides of its body and used for
(DIP)
through-hole mounting
Package name Shrink Dual Inline Package Shrink DIP
(SDIP)
Package name Heat Sink Dual Inline Package DIP with a heat sink
(HDIP)
Package name Heat Sink Shrink Dual Inline Package SDIP with a heat sink
(HSDIP)
Package name Piggyback Dual Inline Package Piggyback DIP
(PDIP)
Package name Plastic Dual Inline Package Plastic DIP
(P-DIP)
IEC 60191-4:2013/AMD1:2018 – 5 –
© IEC 2018
Classification Term Description
Package name Ceramic Dual Inline Package Ceramic DIP
(C-DIP)
Package name Glass-Sealed Ceramic Dual Inline Package Glass-sealed ceramic DIP
(G-DIP)
Package name Glass-Sealed Ceramic Window Dual Inline Glass-sealed ceramic DIP with a window
Package
(G-DDIP)
Package name Dual Tape Carrier Package A package with the leads extended from
the two sides of its body and consisting
(DTP)
of the tapes
Package name Dual Tape Carrier Package Type 1 DTP Type-1
(DTP(1))
Package name Dual Tape Carrier Package Type 2 DTP Type-2
(DTP(2))
Package name Land Grid Array Package A package without pins and with the
lands placed in a row of 3 x 3 or more, or
(LGA)
in grid, on the upper or lower side of its
body
Package name Low Profile Land Grid Array Package LGA with the seated height of over
1,2 mm and up to 1,7 mm
(LLGA)
Package name Thin Land Grid Array Package LGA with the seated height of over
1,0 mm and up to 1,2 mm
(TLGA)
Package name Very Thin Land Grid Array Package LGA with the seated height of over
0,8 mm and up to 1,0 mm
(VLGA)
Package name Very-very Thin Land Grid Array Package LGA with the seated height of over
0,65 mm and up to 0,8 mm
(WLGA)
Package name Ultra-thin Land Grid Array Package LGA with the seated height of over
0,5 mm and up to 0,65 mm
(ULGA)
Package name Extra Thin Land Grid Array Package LGA with the seated height of up to
0,5 mm
(XLGA)
Package name Heat Sink Land Grid Array Package LGA with a heat sink
(HLGA)
Package name Heat Sink Low Profile Land Grid Array Package LLGA with a heat sink
(HLLGA)
Package name Heat Sink Thin Land Grid Array Package TLGA with a heat sink
(HTLGA)
Package name Heat Sink Very Thin Land Grid Array Package VLGA with a heat sink
(HVLGA)
Package name Heat Sink Very-very Thin Land Grid Array WLGA with a heat sink
Package
(HWLGA)
Package name Heat Sink Ultra-thin Land Grid Array Package ULGA with a heat sink
(HULGA)
Package name Heat Sink Extra Thin Land Grid Array Package XLGA with a heat sink
(HXLGA)
– 6 – IEC 60191-4:2013/AMD1:2018
© IEC 2018
Classification Term Description
Package name Fine Pitch Land Grid Array Package LGA with the terminal pitch of up to
0,8 mm
(FLGA)
Package name Low Profile Fine Pitch Land Grid Array Package FLGA with the seated height of over
1,2 mm and up to 1,7 mm
(LFLGA)
Package name Thin Fine Pitch Land Grid Array Package FLGA with the seated height of over
1,0 mm and up to 1,2 mm
(TFLGA)
Package name Very Thin Fine Pitch Land Grid Array Package FLGA with the seated height of over
0,8 mm and up to 1,0 mm
(VFLGA)
Package name Very-very Thin Fine Pitch Land Grid Array FLGA with the seated height of over
Package 0,65 mm and up to 0,8 mm
(WFLGA)
Package name Ultra-thin Fine Pitch Land Grid Array Package FLGA with the seated height of over
0,5 mm and up to 0,65 mm
(UFLGA)
Package name Extra Thin Fine Pitch Land Grid Array Package FLGA with the seated height of up to
0,5 mm
(XFLGA)
...