EN IEC 61189-2-630:2018

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

Name：EN IEC 61189-2-630:2018   Standard name：Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning Standard number：EN IEC 61189-2-630:2018   language：English language Release Date：04-Oct-2018   technical committee：CLC/SR 91 - Electronics assembly technology Drafting committee：IEC/TC 91 - IEC_TC_91   ICS number：31.180 - Printed circuits and boards

SLOVENSKI STANDARD
SIST EN 61189-2-630:2019
01-april-2019
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Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-630: Test methods for base materials for rigid printed boards -
Moisture Absorption after pressure vessel conditioning
Ta slovenski standard je istoveten z: EN IEC 61189-2-630:2018
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61189-2-630:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

SIST EN 61189-2-630:2019
SIST EN 61189-2-630:2019
EUROPEAN STANDARD EN IEC 61189-2-630

NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2018
ICS 31.180
English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-630: Test
methods for materials for interconnection structures - Moisture
absorption after pressure vessel conditioning
(IEC 61189-2-630:2018)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-630: Méthodes d'essai des matériaux 630: Prüfverfahren für Materialien für
pour structures d'interconnexion - Absorption d'humidité Verbindungsstrukturen - Feuchteaufnahme nach
après conditionnement dans un récipient sous pression Druckbehälterbeanspruchung
(IEC 61189-2-630:2018) (IEC 61189-2-630:2018)
This European Standard was approved by CENELEC on 2018-07-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-630:2018 E

SIST EN 61189-2-630:2019
European foreword
The text of document 91/1471/CDV, future edition 1 of IEC 61189-2-630, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-630:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-04-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-07-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61189-2-630:2018 was approved by CENELEC as a
European Standard without any modification.

SIST EN 61189-2-630:2019
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions

SIST EN 61189-2-630:2019
SIST EN 61189-2-630:2019
IEC 61189-2-630
Edition 1.0 2018-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed board and other interconnection

structures and assemblies –
Part 2-630: Test methods for materials for interconnection structures – Moisture

absorption after pressure vessel conditioning

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-630: Méthodes d'essai des matériaux pour structures d’interconnexion –

Absorption d'humidité après conditionnement dans un récipient sous pression

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-5741-8

SIST EN 61189-2-630:2019
– 2 – IEC 61189-2-630:2018 © IEC 2018
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Preparation of test specimens . 5
5 Test specimens . 5
6 Test apparatus . 6
7 Test procedure . 6
8 Calculation . 7
9 Report . 7

SIST EN 61189-2-630:2019
IEC 61189-2-630:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-630: Test methods for materials for interconnection structures –
Moisture absorption after pressure vessel conditioning

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all
...