Sound insulation hoods (noise reduction: static environment and environmental protection) can be constructed on the assembly line to isolate the noise generated during machine startup. Two situations should be considered when designing the sound insulation hood. that the sound insulation cover must be constructed. The size, the other is based on the on-site environment, sound and sound insulation effect that the sound insulation blanket should achieve without affecting the normal operation of the machine.
The design of the soundproof enclosure requires a certain basis in sound acoustics. Special processing techniques are also used during the construction process to create a truly quiet room with good noise reduction and noise reduction effects.
What are the changes? What are the advantages of ouvrir a window on the top of the sash?
1. Choose from appearance
TT matrix is good, more elegant, with clear edges and corners. .
2 Choose from steel material
TT matrix is brushed aluminum panel + full steel body. 331 is an imported SECC galvanized steel interior material. Relatively speaking, the TT matrix. is better.
3 Internal space environment and heat dissipation
This is still a TT matrix, and the heat dissipation system has always been the signature of TT. The airflow design and black metal mesh front panel ensure transparency inside and outside the chassis. Combined with the quiet 12cm rear fan, it accelerates air circulation inside the chassis and creates excellent ventilation conditions inside and outside the chassis. The unique air guide of the chassis side panel at 38degrees is designed with air return holes for the CPU and graphics card, forming a circular heat conduction.
The 331 perforated mesh design can also effectively increase the heat exchange speed inside the chassis and form a heat conduction cycle. But on that basis alone, it seems a bit immature compared to the TT Matrix. Haha
4 installs
Tie! Internal installation is quite simple, just hand tighten the screws.
5 functions
TT matrix is leading, EMI radiation resistant shrapnel, side panel lock, side panel buckle and other functions are very interesting.
As these two chassis are not in the same price range, there is no difficulty in comparing them.
With the development of chassis, many new technologies have emerged that violate the Intel TAC2.0 standard, such as power supplyelectrical installation mounted at the bottom and the upper window. What I'm going to talk about today is the top window. So, what benefits does this top window bring to chassis heat dissipation? The most obvious feature of an Intel TAC2.0-compliant window-on-top chassis is that it has a smooth horizontal air duct, and the side panel has holes so that the processor can form independent heat dissipation. The performance and heat generation of PCI graphics cards continue to increase, and the high power consumption and heat caused by large-capacity hard drives also pose more challenges for chassis that meet the Intel TAC2.0 standard. . The top-opening window was born in this situation. Today the author will briefly analyze the impact of the top opening window on the air duct under the two power models.bottom-mounted power supply and top-mounted power supply. Page 2: Intel TAC2.0 Standard Chassis Air Ducts Continue to Increase with the Skyrocketing Performance and Heat Generation of PCI Graphics Cards. The high power consumption and high heat brought by large-capacity hard drives, the standard CAG1.1 chassis can no longer adapt. for heat dissipation needs, exist. Under these circumstances, Intel launched the TAC2.0 heat dissipation specification for heat dissipation of hardware such as PCI graphics cards and hard drives. TAC2.0 Intel TAC2.0 Standard Chassis The side panel of the TAC2.0 standard chassis has the air guide removed, and the side panel opening size is 150 x 110 mm, which has a very beneficial effect on the three heating zones of the processor, North Bridge, and graphics card. Chassis complies with the TAC2.0 standard Analysis of air ductsInternal IR of the TAC2.0 Standard Chassis The heat of the TAC2.0 Standard Chassis is mainly dissipated by the perforated mesh on the back (fans can be installed) and by its design. is a typical horizontal wind channel. However, such a design cannot completely dissipate heat in the chassis, and will also form a certain heat dissipation dead zone, causing certain damage to computer hardware. So where is the dead space for heat dissipation in such a design? Let's take a look below. Page 3: Top-Mounted Power Supply and Top-Opening Window Air Duct As mentioned above, the chassis that meets TAC2.0 standard has a certain heat dissipation dead zone in the air duct design. air, so where is this heat dissipation dead zone? First of all, let's look at the design of the power supply on the market, because the designption of the power supply is closely related to this heat dissipation dead zone. Ordinary aftermarket power supplies We know that the air inlets of ordinary aftermarket power supplies are generally downward, which creates a heat dissipation dead zone for chassis without a window on the top. Cooling Dead Spot Top Window After opening a window on the top of the chassis, the heat in the cooling dead spot can be dissipated smoothly through the top window. The upper window can also form a vertical air duct. The vertical air duct is combined with the horizontal air duct. This design eliminates dead corners for heat dissipation, greatly improving the heat dissipation effect of the chassis. Page 4: Bottom mounted power supply. Top opening window air duct. For power supply designMounted at the top, the top-opening window not only allows the chassis to have a vertical air duct, but also eliminates dead spots for heat dissipation. So in a bottom mounted power supply design, if there is no top window, will there be dead space for heat dissipation? Let's take a look at the bottom power supply design first, and there is no sash-to-window air duct on the top. Even if there are no windows on the top, there will still be dead spots for heat dissipation. Through air duct analysis, we will find that if there are no windows on the top, there will also be dead spots for heat dissipation. Of course, if the optical drive baffle is designed as a perforated mesh, this heat dissipation dead space will not exist. Although today's optical drives are rarely used, sIf they are used, there will always be a heat dissipation dead zone. If the window is open on the top, there is no need to consider dead corners for heat dissipation or the use of optical drives. Such a chassis design will also form vertical and horizontal air ducts for three-dimensional heat dissipation and heat dissipation. The effect will naturally be much stronger. Is it always good to have a window upstairs? Are there no disadvantages? The author here reminds everyone that for frames with windows on the top, we should pay attention to dust-proof design. If the dust-proof design is not good, it will also cause certain damage to the computer. Through the analysis, the author summarized the following points: 1. The standard TAC2.0 chassis has obvious dead spots for heat dissipation. This type of chassis is suitable for platformswith relatively low heat generation. 2. The top power supply design with a window on the top will eliminate the heat dissipation dead zone, but the load of the power supply When used as a heat dissipation device, it will have a certain impact on the service life of food. 3. Bottom mounted power supply design and top window will also eliminate dead spots for heat dissipation. If the optical drive baffle is designed with perforated mesh and no optical drive is installed, the top window will be less effective. 4. Opening windows from above is not without its drawbacks. Here it is worth considering the dust-proof design to determine whether the dust-proof design is in place.