The steel wire for cutting silicon wafers is a steel wire with a carbon content above 0.8% and high strength. The surface is plated with brass by thermal diffusion, mainly because brass has good ductility and is a good lubricating film for steel wire drawing. Its wire drawing can adapt to the high-speed deformation of wet wire drawing.
In addition, the surface after brass plating appears **, which is more beautiful and more suitable for cutting steel wire, gold in steel.
By the way, to answer Palmerbaker's question, the steel wire is plated with brass before pulling on the water tank. The process is the same as for copper and steel wire. After drawing, it is directly into the product. without any treatment.