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STANDARDSIST EN 140401:20021DGRPHãþD
SIST EN 140401:2009
EUROPEAN STANDARD EN 140401 NORME EUROPÉENNE
EUROPÄISCHE NORM April 2009
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: avenue Marnix 17, B - 1000 Brussels
© 2009 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 140401:2009 E
ICS 31.040.10 Supersedes EN 140401:2002
English version
Blank Detail Specification:
Fixed low power film surface mount (SMD) resistors
Spécification particulière cadre: Résistances fixes à couches
et à faible dissipation
pour montage en surface (CMS)
Vordruck für Bauartspezifikation: Oberflächenmontierbare (SMD)
Schicht-Festwiderstande
niedriger Belastbarkeit
This European Standard was approved by CENELEC on 2009-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
SIST EN 140401:2009
EN 140401:2009 – 2 –
Foreword This European Standard was prepared by the Technical Committee CENELEC TC 40XB, Resistors. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 140401 on 2009-03-01. This European Standard supersedes EN 140401:2002. Preceding documents on the subject covered by this specification have been – EN 140401:1996, – CECC 40 401:1989. Compared to the superseded standard, the following changes have been implemented: – modification of the title; – introduction of a test on the resistance to electrostatic discharge (ESD) in 1.6 and Annex A; – introduction of description and test methods for lead-free soldering in 1.8, 1.10.3 and Annex A; – introduction of code letters for the temperature coefficient (TCR) as in EN 60062:2005; – revision of ordering information in 1.9.4; – adoption of the IECQ rules of procedure, IEC QC 001002-3; – revision of the sample quantities and the sequence of tests in Annex A; – editorial revision. The following dates were fixed: – latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement
(dop)
2010-03-01 – latest date by which the national standards conflicting with the EN have to be withdrawn
(dow)
2012-03-01 This specification supports the building of a series of documents describing fixed low power film resistors as follows: – EN 60115-1 Fixed resistors for use in electronic equipment – Part 1: Generic specification
(IEC 60115-1, mod.) – EN 140400 Sectional specification: Fixed low power surface mount (SMD) resistors – EN 140401-xxx Relevant detail specification(s) written on the basis of this blank detail specification __________ SIST EN 140401:2009
– 3 – EN 140401:2009 Contents Introduction . 4 1 Characteristics and ratings . 5 1.1 Dimensions and ratings. 5 1.2 Derating curve . 6 1.3 Resistance range and tolerance on rated resistance . 7 1.3.1 Version A . 7 1.3.2 Version E . 7 1.4 Variation of resistance with temperature and temperature rise . 8 1.5 Climatic categories . 8 1.6 Limits for change of resistance at tests . 9 1.7 Non-linearity . 9 1.8 Tests related to soldering . 10 1.8.1 Severities for solderability testing . 10 1.8.2 Severities for testing resistance to soldering heat . 11 1.9 Marking, packaging and ordering designation . 11 1.9.1 Marking of the component . 12 1.9.2 Packaging . 12 1.9.3 Marking of the packaging . 12 1.9.4 Ordering information. 12 1.10 Additional information (not for inspection purpose) . 13 1.10.1 Storage . 13 1.10.2 Mounting . 13 1.10.3 Soldering process . 13 1.10.4 Use of cleaning solvents . 13 2 Quality assessment procedures . 13 2.1 General. 13 2.1.1 Zero defect approach . 13 2.1.2 100 % Test . 14 2.1.3 0 Ω Resistors . 14 2.1.4 Certificate of Conformity (CoC) . 14 2.1.5 Certified test records . 14 2.1.6 Failure rate level . 15 2.2 Qualification approval . 15 2.2.1 Version A . 15 2.2.2 Version E . 15 2.3 Quality conformance inspection . 15 2.3.1 Qualification approval according to IEC QC 001002-3:2005, Clause 3 . 15 2.3.2 Technology approval according to IEC QC 001002-3:2005, Clause 6 . 15 2.3.3 Non-conforming items . 16 Annex A (normative)
Fixed sample size Qualification Approval and Quality Conformance
.....................
Inspection test schedule for fixed low power film resistors . 17 Annex B (informative)
Letter symbols and abbreviations . 27 Bibliography . 29
SIST EN 140401:2009
EN 140401:2009 – 4 –
Introduction Blank detail specification A blank detail specification is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with European standards nor shall they be so described. In the preparation of the detail specification the content of EN 140400:2003, 1.2 shall be taken into account. The detail specification should be written by using the preferred values given in EN 140400. The detail specification should contain a table of contents prior the first page of the actual specification. For the use of SI units refer to ISO 1000, for the use of letter symbols to be used in electrical technology, refer to EN 60027-1. Notes in this document shall be considered as guidance and are not part of the detail specification itself. Identification of the detail specification and the component The first page of the detail specification should have the layout recommended on page 5. The numbers in square brackets correspond to the indications to be completed thereunder: [1] the name of the Standardisation Organisation under whose authority the detail specification is published and if applicable, the organisation from whom the detail specification is available; [2] the CECC symbol and the number allocated to the detail specification by the CENELEC General Secretariat; [3] the number and issue number of the EN generic and sectional specification as relevant; also national reference if different; [4] the national number of the detail specification, date of issue and any further information required by the national system, together with any amendment numbers, if different from the EN number; [5] a brief description of the component or range of components; [6] information on typical construction (where applicable); [7] an outline drawing with the main dimensions which are of importance for interchangeability and/or reference to the appropriate national or international document for outlines. Alternatively, this drawing may be given in an annex to the detail specification; [8] the level of quality assessment covered by the detail specification. For [5] and [6] the text to be given in the detail specification should be suitable for an entry in a register of approvals and the “CENELEC Catalogue of European Standards”.
SIST EN 140401:2009
– 5 – EN 140401:2009 Specification available from: [1] EN 140401-…
(Specification number)
[2]Electronic components of assessed quality in accordance with: [3] EN 60115-1:2001 + A1:2001 + A11:2007 EN 140400:2003 Issue … [4](Month) (Year)
[7]
Other shapes are permitted within the given dimensions. Figure 1 – Outline and dimensions (see Table 1) Fixed low power film surface mount (SMD) resistors, Style …
[5](Description of the component) [6]Assessment level EZ a [8] Version A: with 100 %-test Version E: with failure rate level and 100 %-test Stability classes … a For explanation on assessment level EZ see 2.1.1 NOTE
Version E is optional. 1 Characteristics and ratings Various parameters of this component are precisely defined in this specification. Unspecified parameters may vary from one component to another. 1.1 Dimensions and ratings Table 1 – Style and dimensions Style Length L mm
mm
mm
mm Mass amg metric x min. max. min. max. min. max. min. max. max.
a For information only. x Optional column for additional information (e.g. size code). NOTE
See EN 140400:2003, 1.2 a).
Information about manufacturers who have components qualified to this detail specification is available in the approvals section of the website http://www.iecq.org. SIST EN 140401:2009
EN 140401:2009 – 6 –
Table 2a – Ratings Style x Rated dissipation P70 mW Limiting element voltaged.c. or a.c. (r.m.s.) UmaxV Insulation voltage d.c. or a.c. (peak) Uins V 1 min continuous
x Optional column for additional information (e.g. stability class, rated dissipation at other ambient temperature than 70 °C) NOTE 1 See EN 140400:2003, 1.2 g), h), i). NOTE 2 Should it be necessary to control further parameters, a more detailed specification should be used. Then the additional test method(s) shall be fully described and appropriate limits and inspection levels (IL) shall be specified. Table 2b – Ratings for 0 Ω resistors Style Maximum current Imax A Maximum resistance Rres max mΩ Insulation voltage d.c. or a.c. (peak) Uins V 1 min continuous
NOTE Table 2b is optional. 1.2 Derating curve Resistors covered by this specification are derated according to the following diagram: Ambient temperature ϑaPercentage of rated dissipation0 %60 %40 %20 %100 %80 %70 °CLower category temperature (LCT)Upper category temperature (UCT) Figure 2 – Derating curve
NOTE 1
See EN 140400:2003, 1.2 g). NOTE 2
A larger area of operation may be given in the detail specification, provided it includes all the area given above. SIST EN 140401:2009
– 7 – EN 140401:2009 1.3 Resistance range and tolerance on rated resistance 1.3.1 Version A The following combinations of temperature coefficient and tolerance on rated resistance may be approved only. Products from this extent shall be used for the qualification approval according to 2.2.1 and for the quality conformance inspection according to 2.3. Resistance values of an E-series according to IEC 60063 shall be used.
The qualification of resistance values below or beyond the specified resistance values is permitted if they fulfil the requirements of the closest stability class (e.g. Style … shall fulfil the requirements of stability class …). Table 3a – Resistance range and tolerance on rated resistance for version A Style Tolerance on rated resistance Temperature coefficient
10-6/K Resistance
range Stability class b % Code a
0 Ω resistors according to Table 2b for styles … a Code letters according to EN 60062:2005. b For the category temperatures of stability classes refer to Table 6. 1.3.2 Version E The following combinations of temperature coefficient, tolerance on rated resistance, resistance range and E-series according to IEC 60063 are permitted only. Products from this extent shall be used for the qualification approval according to 2.2.2 and for the quality conformance inspection according to 2.3 and are permitted only: Table 3b – Resistance range and tolerance on rated resistance for version E Style Tolerance on rated resistance Temperature coefficient
10-6/K Resistance
range Stability class b E series % Code a
0 Ω resistors according to Table 2b for styles … a Code letters according to EN 60062:2005. b For the category temperatures of stability classes, refer to Table 6. NOTE Table 3b is only required for version E and should be a subset of Table 3a. SIST EN 140401:2009
EN 140401:2009 – 8 –
1.4 Variation of resistance with temperature and temperature rise Table 4 – Temperature coefficients and permissible change of resistance Temperature coefficient Limit of resistance change ∆R/R %
10-6/K Codea Codeb LCT / Reference temperature°C Reference temperature / UCT°C
-… / 20 -… / 20 20 / … 20 / …
a Code letters according to EN 60062:2005. b Historical code letters according to …, for information only. NOTE 1 Second code column with historical reference is optional. NOTE 2 See EN 140400:2003, 1.2 f). Table 5 – Limit of temperature rise Stability class Limit of temperature rise
at rated dissipation
Tr ≤ …
Tr ≤ …
1.5 Climatic categories NOTE See EN 140400:2003, 1.2 b). Table 6 – Climatic categories Stability class Climatic category LCT / UCT / Duration
… / … / …
… / … / …
SIST EN 140401:2009
– 9 – EN 140401:2009 1.6 Limits for change of resistance at tests NOTE See EN 140400:2003, 1.2 c). Table 7a – Limits for change of resistance at tests
Stability class Limit of resistance change ∆R/R EN 60115-1 a 4.23 Climatic
sequence 4.24 Damp heat,
steady state 4.25.3 Endurance at
upper category
temperature EN 60115-1 a 4.25.1 Endurance at 70 °C
EN 60115-1 a 4.13 Overload 4.18 Resistance to
soldering heat 4.19 Rapid change
of temperature,
5 cycles 4.22 Vibration 4.33 Substrate
bending 1 000 h Extended, 8 000 h
a EN 60115-1:2001 + A1:2001 + A11:2007.
Table 7b – Limits for change of resistance at tests
Stability class Limit of resistance change ∆R/R
EN 60115-1 a 4.19 Rapid change
of temperature, ≥ 100 cycles EN 60115-1 a 4.27 Single pulse
high voltage
overload test EN 60115-1 a 4.27 Periodic
electric
overload EN 60115-1 a 4.40 Electrostatic discharge b
a EN 60115-1:2001 + A1:2001 + A11:2007. b Human body model (HBM) according to EN 61340-3-1, 3 positive + 3 negative discharges.
NOTE
The number of cycles for the rapid change of temperature test should preferably be 1 000.
1.7 Non-linearity If for resistors in the range 10 Ω ≤ R ≤ … measurement of non-linearity is required according to 2.1.2,
the measured values shall be above the limits given in the diagram below. The resistors shall be tested according to IEC/TR 60440 where the test voltage shall be the rated voltage. SIST EN 140401:2009
EN 140401:2009 – 10 –
Resistance value RAttenuation of 3rd Harmonic A310 Ω100 Ω1 kΩ10 kΩ100 kΩ1 MΩ10 MΩ130 dB120 dB110 dB100 dB90 dB80 dB70 dB60 dB NOTE
The X-scale shall be in accordance to the resistance range given in Table 3a. Figure 3 – Limits of non-linearity in resistance 1.8 Tests related to soldering 1.8.1 Severities for solderability testing Solderability testing shall be preceded by an accelerated ageing according to EN 60068-2-58:2004, 5.2, Test Td: 4 h at 155 °C dry heat. To prove the compatibility of resistors according to this specification with lead free solder, e.g. SnCu, SnCuNi, SnAg or SnAgCu and traditional SnPb solder, solderability shall be tested with both types of solder. a) Solderability with traditional SnPb solder shall be tested according to EN 60068-2-58:2004, 8.2.1, Test Td, solder bath method, with the following conditions:
Solder alloy: Sn60Pb40 or Sn63Pb37
Solder bath temperature: (235 ± 5) °C
Immersion time: (2 ± 0,2) s b) Solderability with lead-free solder shall be tested according to EN 60068-2-58:2004, 8.1.1, Test Td, solder bath method, with the following conditions (Group 3):
Solder alloy: Sn96,5Ag3,0Cu0,5
Solder bath temperature: (245 ± 5) °C
Immersion time: (3 ± 0,3) s or with the following conditions (Group 4):
Solder alloy: Sn99,3Cu0,7
Solder bath temperature: (250 ± 5) °C
Immersion time: (3 ± 0,3) s The categories Group 3 and Group 4 are defined in EN 60068-2-58 for the discrimination of the wide variety of lead-free solder alloys by means of the related typical soldering processes and their specific temperature ranges. Group 3, described as „medium-high temperature“, lists examples of solder alloys SnAg, SnAgCu and SnAgBi, all intended for both reflow and flow (wave) soldering. Group 4, described as „high temperature“, covers SnCu solder, primarily intended for flow (wave) soldering. SIST EN 140401:2009
– 11 – EN 140401:2009 1.8.2 Severities for testing resistance to soldering heat The severity of the resistance to soldering heat test is determined by the peak temperature and by the temperature slopes before and after the dwell time at the peak temperature. Therefore no separate tests are required for lead free soldering, e.g. SnCu, SnCuNi, SnAg or SnAgCu and traditional SnPb soldering, if the more severe test condition from those given in EN 60068-2-58 is adopted. a) For the solder bath method, EN 60068-2-58:2004, 8.1.1 for lead-free soldering and EN 60068-2-58:2004, 8.2.1 for SnPb soldering require similar test conditions:
Solder alloy: any alloy SnPb or SnCu or SnAgCu or SnAg
Solder bath temperature: (260 ± 5) °C
Immersion time: (10 ± 1) s
Test cycles one only b) For reflow soldering using the vapour phase reflow method, the most severe test conditions from
EN 61760-1:2006, Clause 6 for lead-free soldering and EN 60068-2-58:2004, 8.2.4 for SnPb soldering are:
Solder alloy none,
specimen shall be placed on an unmetallized ceramic substrate
Temperature slopes (3 ± 0,5) K/s
Peak temperature (230 ± 5) °C
Peak dwell time
(40 ± 1) s
Test cycles 3, the recovery period between two successive cycles shall be
the
time it takes until the specimen drops below 50 °C c) For reflow soldering using the infrared and forced gas convection reflow method, the most severe test conditions from EN 60068-2-58:2004, 8.1.2 for lead-free soldering and EN 60068-2-58:2004, 8.2.4 for SnPb soldering are:
Solder alloy none,
specimen shall be placed on an unmetallized ceramic substrate
Preheating 150 °C to 180 °C for (120 ± 5) s
Peak temperature (255 ± 5) °C
Dwell times (20 ± 1) s above 245 °C
(60 ± 5) s above 220 °C
Test cycles 3, the recovery period between two successive cycles shall be the
time it takes until the specimen drops below 50 °C The solder bath method is the most severe of the above test methods, representing the soldering stress of all wave soldering and reflow soldering methods.
For precision resistors, where the prime concern is the overall stability of the resistance, wave soldering is not considered a recommendable method.
Table 8 – Test method for resistance to soldering heat test Stability class Test method for resistance to soldering heat test
For version E resistors the solder bath method shall be used. 1.9 Marking, packaging and ordering designation NOTE
The marking of components and packaging shall be in accordance with the requirements of EN 60115-1:2001 + A1:2001 + A11:2007, 2.4 and EN 140400:2003, 1.2 k) and l). SIST EN 140401:2009
EN 140401:2009 – 12 –
1.9.1 Marking of the component NOTE
Marking of the component can be mandatory or not. 1.9.2 Packaging Components may be taped or put in a bulk case. For environmental protection packaging into bulk cases is preferred. Taping shall be in accordance with EN 60286-3. Bulk case packaging shall be in accordance with EN 60286-6.
1.9.3 Marking of the packaging The packaging of the component shall be marked with ordering information in accordance to 1.9.4 and additionally with – CECC or IECQ sign of conformity, – CECC or IECQ manufacturer code, – NATO manufacturer code (only version E, if required), – date code of manufacture according to EN 60062. Additional information is permissible. 1.9.4 Ordering information Orders for resistors covered by this specification shall contain the following information: – detail specification number; – assessment level; – style; – temperature coefficient; – rated resistance; – tolerance on rated resistance; – failure rate level (only for Version E); – form of delivery, packaging method (in addition to the ordering information given in the examples below). Example of the ordering information for 4,75 kΩ resistors: Version A: EN140401–xxxEZ