SIST EN 61249-2-36:2009

Materials for printed boards and other interconnecting structures -- Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

SIST EN 61249-2-36:2009

Name:SIST EN 61249-2-36:2009   Standard name:Materials for printed boards and other interconnecting structures -- Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Standard number:SIST EN 61249-2-36:2009   language:English language
Release Date:11-May-2009   technical committee:ITIV - Electronics assembly technology and Environmental standardization
Drafting committee:   ICS number:31.180 - Printed circuits and boards
SLOVENSKI STANDARD
SIST EN 61249-2-36:2009
01-junij-2009
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Materials for printed boards and other interconnecting structures -- Part 2-36: Reinforced
base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined
flammability (vertical burning test), copper-clad for lead-free assembly
Matériaux pour circuits imprimés et autres structures d'interconnexion -- Partie 2-36:
Matériaux de base renforcés plaqués et non plaqués - Feuilles stratifiées en tissu de
verre de type E époxyde, plaquées cuivre, d'inflammabilité définie (essai de combustion
verticale) pour les assemblages sans plomb
Ta slovenski standard je istoveten z: EN 61249-2-36:2009
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61249-2-36:2009 en,fr
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61249-2-36:2009

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SIST EN 61249-2-36:2009

EUROPEAN STANDARD
EN 61249-2-36

NORME EUROPÉENNE
March 2009
EUROPÄISCHE NORM

ICS 31.180


English version


Materials for printed boards and other interconnecting structures -
Part 2-36: Reinforced base materials, clad and unclad -
Epoxide woven E-glass laminate sheets of defined flammability (vertical
burning test), copper-clad for lead-free assembly
(IEC 61249-2-36:2008)

Matériaux pour circuits imprimés  Materialien für Leiterplatten
et autres structures d'interconnexion - und andere Verbindungsstrukturen -
Partie 2-36: Matériaux de base renforcés, Teil 2-36: Kaschierte und unkaschierte
plaqués et non plaqués - verstärkte Basismaterialien -
Feuilles stratifiées en tissu de verre Kupferkaschierte mit E-Glasgewebe
de type E époxyde, verstärkte Epoxidharz-Laminattafeln
plaquées cuivre, d'inflammabilité définie mit definierter Brennbarkeit
(essai de combustion verticale) (Brennprüfung mit vertikaler Prüflingslage)
pour les assemblages sans plomb für bleifreie Bestückungstechnik
(CEI 61249-2-36:2008) (IEC 61249-2-36:2008)


This European Standard was approved by CENELEC on 2009-02-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: avenue Marnix 17, B - 1000 Brussels


© 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61249-2-36:2009 E

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SIST EN 61249-2-36:2009
EN 61249-2-36:2009 – 2 –

Foreword
The text of document 91/801/FDIS, future edition 1 of IEC 61249-2-36, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 61249-2-36 on 2009-02-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2009-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2012-02-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61249-2-36:2008 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60194 NOTE  Harmonized as EN 60194:2006 (not modified).
__________

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SIST EN 61249-2-36:2009
– 3 – EN 61249-2-36:2009

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 61189-2 2006 Test methods for electrical materials, printed EN 61189-2 2006
boards and other interconnection structures
and assemblies -
Part 2: Test methods for materials for
interconnection structures


IEC 61249-5-1 1995 Materials for interconnection structures - EN 61249-5-1 1996
Part 5: Sectional specification set for
conductive foils and films with and without
coatings -
Section 1: Copper foils (for the manufacture of
copper-clad base materials)


1) 2)
ISO 9000 - Quality management systems - EN ISO 9000 2005
Fundamentals and vocabulary


1)
ISO 11014-1 - Safety data sheet for chemical products - - -
Part 1: Content and order of sections


1) 2)
ISO 14001 - Environmental management systems - EN ISO 14001 2004
Requirements with guidance for use



1)
Undated reference.
2)
Valid edition at date of issue.

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SIST EN 61249-2-36:2009

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SIST EN 61249-2-36:2009
IEC 61249-2-36
Edition 1.0 2008-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Materials for printed boards and other interconnecting structures –
Part 2-36: Reinforced base materials, clad and unclad – Epoxide woven E-glass
laminate sheets of defined flammability (vertical burning test), copper-clad for
lead-free assembly

Matériaux pour circuits imprimés et autres structures d'interconnexion –
Partie 2-36: Matériaux de base renforcés, plaqués et non plaqués – Feuilles
stratifiées en tissu de verre de type E époxyde, plaquées cuivre, d’inflammabilité
définie (essai de combustion verticale) pour les assemblages sans plomb

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.180 ISBN 2-8318-1018-0
Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61249-2-36:2009
– 2 – 61249-2-36 © IEC:2008
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references.6
3 Materials and construction .6
3.1 Resin system.6
3.2 Metal foil .7
3.3 Reinforcement .7
4 Internal marking.7
5 Electrical properties .7
6 Non-electrical properties of the copper-clad laminate .7
6.1 Appearance of the copper-clad sheet .7
6.1.1 Indentations (pits and dents) .8
6.1.2 Wrinkles .8
6.1.3 Scratches .8
6.1.4 Raised areas .8
6.1.5 Surface waviness.9
6.2 Appearance of the unclad face.9
6.3 Laminate thickness.9
6.4 Bow and twist .9
6.5 Properties related to the copper foil bond.10
6.6 Punching and machining.11
6.7 Dimensional stability.11
6.8 Sheet sizes.12
6.8.1 Typical sheet sizes .12
6.8.2 Tolerances for sheet sizes .12
6.9 Cut panels .12
6.9.1 Cut panel sizes .12
6.9.2 Size tolerances for cut panels .12
6.9.3 Rectangularity of cut panels .13
7 Non-electrical properties of the base material after complete removal of the copper
foil.13
7.1 Appearance of the dielectric base material.13
7.2 Flexural strength.14
7.3 Flammability .14
7.4 Water absorption .14
7.5 Measling.15
7.6 Glass transition temperature and cure factor.15
7.7 Decomposition temperature .15
7.8 Thermal resistance .16
7.9 Z-axis expansion .16
8 Quality assurance .16
8.1 Quality system .16
8.2 Responsibility for inspection.16
8.3 Qualification inspection.16
8.4 Quality conformance inspection .17

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SIST EN 61249-2-36:2009
61249-2-36 © IEC:2008 – 3 –
8.5 Certificate of conformance.17
8.6 Safety data sheet.17
9 Packaging and marking.17
10 Ordering information .17
Annex A (informative) Engineering information .19
Annex B (informative) Common laminate constructions.21
Annex C (informative) Guidelines for qualification and conformance inspection.22
Bibliography .23

Table 1 – Electrical properties .7
Table 2 – Nominal thickness and tolerance of metal-clad laminate.9
Table 3 – Bow and twist .10
Table 4 – Pull-off and peel strength .11
Table 5 – Dimensional stability .12
Table 6 – Size tolerances for cut panels .13
Table 7 – Rectangularity of cut panels .13
Table 8 – Flexural strength.14
Table 9 – Flammability .14
Table 10 – Water absorption .15
Table 11 – Measling.15
Table 12 – Glass transition temperature and cure factor .15
Table 13 – Decomposition temperature .16
Table 14 – Thermal resistance .16
Table 15 – Z-axis expansion.16

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SIST EN 61249-2-36:2009
– 4 – 61249-2-36 © IEC:2008
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

MATERIALS FOR PRINTED BOARDS
AND OTHER INTERCONNECTING STRUCTURES –

Part 2-36: Reinforced base materials, clad and unclad –
Epoxide woven E-glass laminate sheets of defined flammability
(vertical burning test), copper-clad for lead-free assembly


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61249-2-36 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/801/FDIS 91/824/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 61249-2-36:2009
61249-2-36 © IEC:2008 – 5 –
A list of all parts of the IEC 61249 series, under the general title Materials for printed boards
and other interconnecting structures, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 61249-2-36:2009
– 6 – 61249-2-36 © IEC:2008
MATERIALS FOR PRINTED BOARDS
AND OTHER INTERCONNECTING STRUCTURES –

Part 2-36: Reinforced base materials, clad and unclad –
Epoxide woven E-glass laminate sheets of defined flammability
(vertical burning test), copper-clad for lead-free assembly



1 Scope
This part of IEC 61249 gives requirements for properties of di-functional brominated epoxide
woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning
test), copper-clad. The glass transition temperature is defined to be 120 °C minimum.
Its flame resistance is defined in terms of the flammability requirements of 7.3.
Some property requirements may have several classes of performance. The class desired
should be specified on the purchase order otherwise the default class of material will be
supplied.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 61189-2:2006, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 2: Test method for interconnection structures
IEC 61249-5-1:1995, Materials for interconnection structures – Part 5: Sectional specification
set for conductive foils and films with and without coatings – Section 1: Copper foils (for the
manufacture of copper-clad base materials)
ISO 9000, Quality management systems – Fundamentals and vocabulary
ISO 11014-1, Safety data sheet for chemical products – Part 1: Content and order of sections
ISO 14001, Environmental management systems – Requirements with guidance for use
3 Materials and construction
The sheet consists of an insulating base with metal foil bonded to one side or both.
3.1 Resin system
Majority di-functional epoxide, modified epoxide, woven E-glass laminate with a glass transition
temperature of 120 °C minimum. The flammability rating is achieved through the use of
bromine reacted into the polymer. Inorganic fillers may be used. Contrast agents may be added
to enhance processing such as automated optical inspection (AOI).
Its flame resistance is defined in terms of the flammability requirements of 7.3.

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SIST EN 61249-2-36:2009
61249-2-36 © IEC:2008 – 7 –
3.2 Metal foil
Copper as specified in IEC 61249-5-1, copper foil (for the manufacture of copper-clad
materials). The preferred foils are electro-deposited of defined ductility.
3.3 Reinforcement
Woven E-glass as specified in the future IEC 61249-6-3, woven E-glass fabric (for the
manufacture of prepreg and copper clad materials).
4 Internal marking
Not specified.
5 Electrical properties
The electrical property requirements are shown in Table 1.
Table 1 – Electrical properties
Test method
Property Requirements
(IEC 61189-2)
Resistance of foil 2E12 As specified in IEC 61249-5-1
Surface resistance after damp heat
while in the humidity chamber 2E03 ≥10 000 MΩ
(optional)
Surface resistance after damp heat
2E03 ≥50 000 MΩ
and recovery
Volume resistivity after damp heat
while in the humidity chamber 2E04 ≥5 000 MΩm
(optional)
Volume resistivity after damp heat and
2E04
≥10 000 MΩm
recovery
Relative permittivity after damp heat
2E10 ≤5,4
and recovery (1 MHz)
Dissipation factor after damp heat and
2E10 ≤0,035
recovery (1 MHz)
Electric strength (only for material
2E11 ≥30 kV/mm
thickness less than 0,5 mm)
Arc resistance 2E14 ≥60 s
Dielectric breakdown (only for material
2E15 ≥40 kV
thicknesses ≥0,5 mm)
Surface resistance at 125 °C 2E07
≥1 000 MΩ
Volume resistivity at 125 °C 2E07 ≥1 000 MΩm

6 Non-electrical properties of the copper-clad laminate
6.1 Appearance of the copper-clad sheet
The copper-clad face shall be substantially free from defects that may have an impact on the
material´s fitness for use for the intended purpose.

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SIST EN 61249-2-36:2009
– 8 – 61249-2-36 © IEC:2008
For the following specific defects, the requirements given shall apply when inspection is made
in accordance with IEC 61189-2, method 2M18.
6.1.1 Indentations (pits and dents)
The size of an indentation, usually the length, shall be determined and given a point value to be
used as measure of the quality.
Size
Point value for each
mm
indentation

0,13 – 0,25 1
0,26 – 0,50 2
0,51 – 0,75 4
0,76 – 1,00 7
Over 1,00 30

The total point count for any 300 mm × 300 mm area shall be calculated to determine the class
of the material.
Class A 29 maximum
Class B 17 maximum
Class C 5 maximum
Class D 0
Class X To be agreed upon by user and supplier
The required class of material shall be specified in the purchase order. Class A applies unless
otherwise specified.
6.1.2 Wrinkles
There shall be no wrinkles in the copper surface.
6.1.3 Scratches
Scratches deeper than 20 % of the nominal thickness of the foil thickness are not permitted.
Scratches with a depth less than 5 % of the nominal thickness of the foil shall not be counted
unless this depth is 10 μm or more.
Scratches with a depth between 5 % and 20 % of the nominal thickness of the foil are
permitted to a total length of 100 mm for a 300 mm × 300 mm area.
6.1.4 Raised areas
Raised areas are usually impressions in the press plates used during manufacture but may
also be caused by blisters or inclusions of foreign particles under the foil.
Raised areas caused by blisters or inclusions are not permitted.
Raised areas being impressions of defects in press plates are permitted to the following extent:
Class A and X material maximum height 15 μm and maximum length 15 mm;
Class B and C material maximum height 8 μm and maximum length 15 mm;

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SIST EN 61249-2-36:2009
61249-2-36 © IEC:2008 – 9 –
Class D material maximum height 5 μm and maximum length 15 mm.
6.1.5 Surface waviness
When examined in accordance with test method 2M12 of IEC 61189-2, the surface waviness in
both the machine and cross machine direction shall not exceed 7 μm.
6.2 Appearance of the unclad face
The unclad face of a single side clad sheet shall have the natural appearance resulting from
the curing process. Small irregularities in colour are permitted. The gloss of the unclad face
shall be that given by the press plate or release foil used. Variations of gloss due to the impact
of pressure of gases released during the curing are permitted.
6.3 Laminate thickness
The laminate thickness may be ordered to include or exclude the copper foil contribution as
specified in the purchase order. As a general rule, laminates less than 0,8 mm are measured
excluding copper, and laminates greater or equal to 0,8 mm are measured including copper. If
the copper-clad laminate is tested in accordance with test method 2D01 of IEC 61189-2, the
thickness shall not depart from the nominal thickness by more than the appropriate value
shown in Table 2. The fine tolerances shall apply unless the other tolerances are ordered.
Table 2 – Nominal thickness and tolerance of metal-clad laminate
Nominal thickness Nominal thickness Tolerance requirements
excluding metal foil including metal foil ± mm
(material intended (material intended for single
for multilayer boards) or double sided boards)
Coarse Fine Extra fine
mm mm
0,03 0,02 0,01
≥0,05 ≤0,10
0,04 0,03 0,02
>0,10 ≤0,15
0,05 0,04 0,03
>0,15 ≤0,30
0,08 0,05 0,04
>0,30 ≤0,50
0,09 0,06 0,05
>0,50 ≤0,80
0,13 0,09 0,07
≥0,80 ≤1,00
>0,80 ≤1,00
0,17 0,11 0,08
>1,00 ≤1,30
>1,00 ≤1,30
0,20 0,13 0,10
>1,30 ≤1,70
0,23 0,15 0,12
>1,70 ≤2,10
0,25 0,18 0,15
>2,10 ≤2,60
0,30 0,20 0,15
>2,60 ≤3,20

The thickness and tolerances do not apply to the outer 25 mm of the trimmed master sheet or
the outer 13 mm of the cut-to-size panel as manufactured and delivered by the supplier. At no
point shall the thickness vary from the nominal by a value greater than 125 % of the specified
tolerance.
6.4 Bow and twist
When the copper-clad laminate is tested in accordance with test method 2M01 of IEC 61189-2,
the bow and twist shall not exceed the values given in Table 3.

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SIST EN 61249-2-36:2009
– 10 – 61249-2-36 © IEC:2008
Table 3 – Bow and twist
Requirements
Nominal Panel dimension
%
Test method
Property thickness longest side
(IEC 61189-2)
mm mm Copper foil on Copper foil on
one side both sides
Bow and 2M01 ≥0,8 ≤1,3 ≤350 ≤2,0 ≤1,5
twist
>350 ≤500 ≤1,8 ≤1,3
>500 ≤1,5 ≤1,0
>1,3 <1,7 ≤350 ≤1,5 ≤1,0
>350 ≤500 ≤1,3 ≤0,8
>500 ≤1,0 ≤0,5
≥1,7 ≤3,2 ≤350 ≤1,0 ≤0,5

>350 ≤500 ≤0,8 ≤0,4
>500 ≤0,5 ≤0,3
NOTE 1 The requirements for bow and twist apply only to one-sided, copper-clad laminates with maximum foil
2
thickness of 105 μm (915 g/m
...

  • Relates Information
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    09-28
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    09-28
  • HD 566 S1:1990

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    ISO 5131:1982/Amd 1:1992
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  • EN 60598-2-22:1990

    EN 60598-2-22:1996
    09-27
  • ISO 8504-2:1992

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    09-27
  • EN 12165:2024

    prEN 12165:2022
    09-27
  • IEC TS 61158-6:1999

    IEC TS 61158-6:1999 - Digital data communications for measurement and control - Fieldbus for use in industrial control systems - Part 6: Application Layer protocol specification Released:3/24/1999 Isbn:2831847613
    09-27
  • ISO 4252:1992

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    09-27