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TECHNICAL SPECIFICATION
Smart Cards;
Machine to Machine UICC;
Physical and logical characteristics
(Release 10)
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Release 10 2 ETSI TS 102 671 V10.0.0 (2018-08)
Reference
RTS/SCP-T090071va00
Keywords
M2M, MFF
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Release 10 3 ETSI TS 102 671 V10.0.0 (2018-08)
Contents
Intellectual Property Rights . 5
Foreword . 5
Modal verbs terminology . 5
1 Scope . 6
2 References . 6
2.1 Normative references . 6
2.2 Informative references . 7
3 Definitions and abbreviations . 7
3.1 Definitions . 7
3.2 Abbreviations . 7
4 Overview . 8
5 Definition of Environmental Classes. 8
5.1 Environmental condition classification system . 8
5.2 Operational and Storage Temperature (TX) . 8
5.2.0 Overview . 8
5.2.1 Temperature (TS) -25 °C to +85 °C . 9
5.2.2 Temperature (TA) -40 °C to +85 °C . 9
5.2.3 Temperature (TB) -40 °C to +105 °C . 9
5.2.4 Temperature (TC) -40 °C to +125 °C . 9
5.3 Moisture/Reflow conditions (MX) . 9
5.3.0 Overview . 9
5.3.1 Moisture/Reflow conditions (MA) . 9
5.4 Humidity (HX) . 9
5.4.0 Overview . 9
5.4.1 Humidity (class HA) - High humidity . 9
5.5 Corrosion (CX) . 10
5.5.0 Overview . 10
5.5.1 Corrosion (CA to CD) - Salt atmosphere . 10
5.6 Vibration (VX) . 10
5.6.0 Overview . 10
5.6.1 Vibration (VA) - Automotive vibration . 10
5.7 Void . 10
5.8 Shock (SX) . 10
5.8.0 Overview . 10
5.8.1 Shock (SA) - Automotive shock . 10
5.9 Data Retention Time (RX) . 10
5.9.0 Overview . 10
5.9.1 Data Retention Time (RA) - 10 years . 11
5.9.2 Data Retention Time (RB) - 12 years . 11
5.9.3 Data Retention Time (RC) - 15 years . 11
5.10 Minimum Updates (UX) . 11
5.10.0 Overview . 11
5.10.1 Minimum Updates (UA) - 100 000 . 11
5.10.2 Minimum Updates (UB) - 500 000 . 11
5.10.3 Minimum Updates (UC) - 1 000 000 . 11
6 M2M UICC - Physical Characteristics . . 11
6.0 Basic requirements . 11
6.1 General M2M UICC physical characteristics . 11
6.1.0 Introduction. 11
6.1.1 Contacts . 12
6.2 Specific MFF physical characteristics . 12
6.2.0 Introduction. 12
6.2.1 MFF1 . 12
ETSI
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Release 10 4 ETSI TS 102 671 V10.0.0 (2018-08)
6.2.1.0 Dimensions. 12
6.2.1.1 Orientation mark for the bottom of the package . 13
6.2.1.2 Orientation mark for top of package . 14
6.2.2 MFF2 . 14
6.2.2.1 Dimensions. 14
6.2.2.1 Orientation mark for the bottom of the package . 15
6.2.2.2 Orientation mark for top of package . 15
7 Electrical and Logical specifications of the MFF UICC - Terminal interface . 15
7.0 Requirements . 15
7.1 Voltage Class support . 15
8 Device Pairing Mechanism . 15
8.0 Introduction . 15
8.1 Secure Channel Pairing . 15
8.2 CAT application pairing . 16
Annex A (informative): PCB layout for the MFF . 17
Annex B (informative): Change history . 19
History . 20
ETSI
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Release 10 5 ETSI TS 102 671 V10.0.0 (2018-08)
Intellectual Property Rights
Essential patents
IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information
pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found
in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in
respect of ETSI standards", which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web
server (https://ipr.etsi.org/).
Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee
can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web
server) which are, or may be, or may become, essential to the present document.
Trademarks
The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners.
ETSI claims no ownership of these except for any which are indicated as being the property of ETSI, and conveys no
right to use or reproduce any trademark and/or tradename. Mention of those trademarks in the present document does
not constitute an endorsement by ETSI of products, services or organizations associated with those trademarks.
Foreword
This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP).
The contents of the present document are subject to continuing work within TC SCP and may change following formal
TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with
an identifying change of release date and an increase in version number as follows:
Version x.y.z
where:
x the first digit:
0 early working draft;
1 presented to TC SCP for information;
2 presented to TC SCP for approval;
3 or greater indicates TC SCP approved document under change control.
y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections,
updates, etc.
z the third digit is incremented when editorial only changes have been incorporated in the document.
Modal verbs terminology
In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and
"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of
provisions).
"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.
ETSI
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Release 10 6 ETSI TS 102 671 V10.0.0 (2018-08)
1 Scope
The present document details the technical specifications for M2M UICCs.
Specifically, the present document specifies:
• Physical, logical and electrical specifications for additional machine to machine form factors for the M2M
UICC.
• Environmental specifications of the M2M UICC dedicated to M2M applications for all specified UICC form
factors.
• Device pairing mechanisms that allow the M2M UICC to verify the terminal with which it is operating.
2 References
2.1 Normative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
Referenced documents which are not found to be publicly available in the expected location might be found at
http://docbox.etsi.org/Reference.
NOTE: While any hyperlinks included in this clause were valid at the time of publication ETSI cannot guarantee
their long term validity.
The following referenced documents are necessary for the application of the present document.
[1] ETSI TS 102 221: "Smart Cards; UICC-Terminal interface; Physical and logical characteristics".
[2] ETSI TS 102 412: "Smart Cards; Smart Card Platform Requirements Stage 1".
[3] ETSI TS 102 613: "Smart Cards; UICC - Contactless Front-end (CLF) Interface; Part 1: Physical
and data link layer characteristics".
[4] ETSI TS 102 600: "Smart Cards; UICC-Terminal interface; Characteristics of the USB interface".
[5] ETSI TS 102 484: "Smart Cards; Secure channel between a UICC and an end-point terminal".
[6] ETSI TS 102 223: "Smart Cards; Card Application Toolkit (CAT)".
[7] IPC/JEDEC J-STD-020D.1: "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices".
[8] JEDEC JESD22-A104D: "Temperature Cycling".
[9] JEDEC JESD22-B103B: "Vibration, Variable Frequency".
[10] JEDEC JESD22-B104C: "Mechanical Shock".
[11] JEDEC JESD22-A107B: "Salt Atmosphere".
NOTE: For JEDEC documents see http://jedec.org/download/.
ETSI
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Release 10 7 ETSI TS 102 671 V10.0.0 (2018-08)
2.2 Informative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non-specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee
their long term validity.
The following referenced documents are not necessary for the application of the present document but they assist the
user with regard to a particular subject area.
Not applicable.
3 Definitions and abbreviations
3.1 Definitions
For the purposes of the present document, the following terms and definitions apply:
M2M communication module: electronics system including all necessary components to establish wireless
communications between machines
NOTE: M2M communication modules are usually integrated directly into target devices, such as Automated
Meter Readers (AMRs), vending machines, alarm systems, automotive equipment or others.
M2M UICC: UICC with specific properties for use in M2M environments, this includes existing form factors and the
new form factors MFF1 and MFF2
Machine t
...