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TECHNICAL SPECIFICATION
Smart Cards;
UICC - Contactless Front-end (CLF) Interface;
Physical and data link layer characteristics
(Release 8)
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Release 8 2 ETSI TS 102 613 V8.4.0 (2018-08)
Reference
RTS/SCP-T070138v840
Keywords
smart card
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Release 8 3 ETSI TS 102 613 V8.4.0 (2018-08)
Contents
Intellectual Property Rights . 6
Foreword . 6
Modal verbs terminology . 6
Introduction . 7
1 Scope . 8
2 References . 8
2.1 Normative references . 8
2.2 Informative references . 9
3 Definitions, symbols and abbreviations . 9
3.1 Definitions . 9
3.2 Symbols . 10
3.3 Abbreviations . 10
3.4 Void . 11
3A Coding conventions . 11
4 Principle of the Single Wire Protocol . 11
5 System architecture . 12
5.1 General overview . 12
5.2 ETSI TS 102 221 support . 13
5.3 Configurations . 13
5.4 Interaction with other interfaces . 13
6 Physical characteristics. 13
6.1 Temperature range for card operation . 13
6.2 Contacts . 14
6.2.1 Provision of contacts . 14
6.2.2 Contact activation and deactivation . 14
6.2.2.0 Terminal behaviour . 14
6.2.2.1 SWIO contact activation . 14
6.2.2.2 SWIO contact deactivation. 14
6.2.2.3 Deactivation of the UICC . 14
6.2.3 Interface activation . 14
6.2.3.1 Initial interface activation . 14
6.2.3.2 Subsequent interface activation . 16
6.2.3.3 Timing parameters . 17
6.2.3.4 Impact on other interfaces . 19
6.2.4 Behaviour of a UICC in a terminal not supporting SWP . 19
6.2.5 Behaviour of terminal connected to a UICC not supporting SWP. 19
6.2.6 Inactive contacts . 19
7 Electrical characteristics . 20
7.1 Operating conditions . 20
7.1.0 Voltage and current definitions . 20
7.1.1 Supply voltage classes . 20
7.1.2 V (C1) low power mode definition . 21
cc
7.1.3 Signal S1 . 21
7.1.4 Signal S2 . 22
7.1.4.0 Definition . 22
7.1.4.1 Operating current for S2 . 22
8 Physical transmission layer . 22
8.1 S1 Bit coding and sampling time (Self-synchronizing code) . 22
8.2 S2 switching management . 23
8.3 SWP interface states management . 24
8.4 Power mode states/transitions and Power saving mode . 26
ETSI
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Release 8 4 ETSI TS 102 613 V8.4.0 (2018-08)
9 Data link layer . 27
9.1 Overview . 27
9.2 Medium Access Control (MAC) layer . 27
9.2.1 Bit order . 27
9.2.2 Structure . 27
9.2.3 Bit Stuffing . 28
9.2.4 Error detection . 29
9.3 Supported LLC layers . 29
9.3.0 LPDU structures . 29
9.3.1 Interworking of the LLC layers . 30
9.4 ACT LLC definition . 31
9.4.0 ACT LPDU structure . 31
9.4.1 SYNC_ID verification process . 32
10 SHDLC LLC definition . 33
10.1 SHDLC overview . 33
10.2 Endpoints . 33
10.3 SHDLC frame types . 33
10.4 Control Field . 34
10.4.0 Coding . 34
10.4.1 I-Frames coding . 34
10.4.2 S-Frames coding . 34
10.4.3 U-Frames coding . 35
10.5 Changing sliding window size and endpoint capabilities . 35
10.5.0 Capabilities negotiation . 35
10.5.1 RSET frame payload . 35
10.5.2 UA frame payload . 36
10.6 SHDLC context . 36
10.6.0 Definition . 36
10.6.1 Constants . 36
10.6.2 Variables . 37
10.6.3 Initial Reset State . 37
10.7 SHDLC sequence of frames . 37
10.7.1 Nomenclature . 37
10.7.2 Link establishment with default sliding window size . 38
10.7.3 Link establishment with custom sliding window size . 39
10.7.4 Data flow . 39
10.7.5 Reject (go N back) . 40
10.7.6 Last Frame loss . 40
10.7.7 Receive and not ready . 41
10.7.8 Selective reject . 41
10.8 Implementation model . 42
10.8.0 Sequence number calculation . 42
10.8.1 Information Frame emission . 42
10.8.2 Information Frame reception . 43
10.8.3 Reception Ready Frame reception . 44
10.8.4 Reject Frame reception . 44
10.8.5 Selective Reject Frame reception . 45
10.8.6 Acknowledge timeout . 45
10.8.7 Guarding/transmit timeout . 46
11 CLT LLC definition . 46
11.1 System Assumptions . 46
11.2 Overview . 46
11.2a Supported RF protocols . 46
11.3 CLT Frame Format . 47
11.4 CLT Command Set . 48
11.5 CLT Frame Interpretation . 48
11.5.1 CLT frames with Type A aligned DATA_FIELD . 48
11.5.2 Handling of DATA_FIELD by the CLF . 50
11.5.3 Handling of ADMIN_FIELD . 50
11.5.3.1 CL_PROTO_INF(A). 50
ETSI
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Release 8 5 ETSI TS 102 613 V8.4.0 (2018-08)
11.5.3.2 CL_PROTO_INF(F) . 51
11.5.3.3 CL_GOTO_INIT and CL_GOTO_HALT . 52
11.6 CLT Protocol Rules . 52
11.6.1 Rules for the CLF . 52
11.6.2 Rules for the UICC . 53
12 Timing and performance . 53
12.1 SHDLC Data transmission mode . 53
12.1.1 CLF processing delay when receiving data over an RF-link . 53
12.1.2 CLF processing delay when sending data over an RF-link . 54
12.2 CLT data transmission mode for ISO/IEC 14443 Type A . 54
12.2.1 CLF processing delay when receiving data from the PCD . 54
12.2.2 CLF processing delay when sending data to the PCD . 54
12.2.3 Timing values for the CLF processing delay . 55
12.2.4 Timing value for the CLF processing delay (Request Guard Time) . 56
12.3 CLT data transmission mode for ISO/IEC18092 212 kbps/424 kbps passive mode . 56
Annex A (informative): Change history . 57
History . 59
ETSI
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Release 8 6 ETSI TS 102 613 V8.4.0 (2018-08)
Intellectual Property Rights
Essential patents
IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information
pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found
in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in
respect of ETSI standards", which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web
server (https://ipr.etsi.org/).
Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee
can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web
server) which are, or may be, or may become, essential to the present document.
Trademarks
The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners.
ETSI claims no ownership of these except for any which are indicated as being the property of ETSI, and conveys no
right to use or reproduce any trademark and/or tradename. Mention of those trademarks in the present document does
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Foreword
This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP).
The contents of the present document are subject to continuing work within TC SCP and may change following formal
TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with
an identifying change of release date and an increase in version number as follows:
Version x.y.z
where:
x the first digit:
0 early working draft;
1 presented to TC SCP for information;
2 presented to TC SCP for approval;
3 or greater indicates TC SCP approved document under change control.
y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections,
updates, etc.
z the third digit is incremented when editorial only changes have been incorporated in the document.
Modal verbs terminology
In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and
"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of
provisions).
"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.
ETSI
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Release 8 7 ETSI TS 102 613 V8.4.0 (2018-08)
Introduction
The present document defines a communication interface between the UICC and a contactless frontend (CLF) in the
terminal. This interface allows the card emulation mode independent of the power state of the terminal as well as the
reader mode when the terminal is battery powered.
The aim of the present document is to ensure interoperability between a UICC and the CLF in the terminal
independently of the respective manufacturer, card issuer or operator. Any internal technical realization of either the
UICC or the CLF is only specified where these are reflected over the interface.
ETSI
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Release 8 8 ETSI TS 102 613 V8.4.0 (2018-08)
1 Scope
The present document specifies the Single Wire Protocol (SWP). SWP is the interface between the UICC and the CLF.
The present document defines:
• Layer 1: The physical layer which is responsible for activating, maintaining and deactivating the physical link
between the UICC and the CLF. It defines electrical (voltage and current levels, timing and coding of voltage
and current levels), mechanical (physical contacts) and functional (data rates) specifications. It also defines the
initial communication establishment and the end of the connection.
• Layer 2: The data link layer which is responsible for the physical addressing of the data through frames and
Link Protocol Data Units (LPDU). The data link layer is also responsible for error notification, ordered
delivery of frames and flow control. This layer can be split into two sub-layers:
- The Medium Access Control (MAC) layer which manages frames.
- The Logical Link Control layer which manages LPDUs and is responsible for the error-free exchange of
data between nodes. Three different Logical Link Control layers are defined in the present document.
2 References
2.1 Normative references
References are either specific (identified by date of publication and/or edition number or version number) or
non-specific. For specific references, only the cited version applies. For non-specific references, the latest version of the
referenced document (including any amendments) applies.
• In the case of a reference to a TC SCP document, a non specific reference implicitly refers to the latest version
of that document in the same Release as the present document.
Referenced documents which are not found to be publicly available in the expected location might be found at
https://docbox.etsi.org/Reference/.
NOTE: While any hyperlinks included in this clause were valid at the time of publication, ETSI cannot guarantee
their long term validity.
The following referenced documents are necessary for the application of the present document.
[1] ETSI TS 102 221: "Smart Cards; UICC-Terminal interface; Physical and logical characteristics".
[2] ISO/IEC 14443-2: "Identification cards -- Contactless integrated circuit cards -- Proximity cards --
Part 2: Radio frequency power and signal interface".
[3] ISO/IEC 14443-3: "Identification cards -- Contactless integrated circuit(s) cards -- Proximity cards
-- Part 3: Initialization and anticollision".
[4] ISO/IEC 14443-4: "Identification cards -- Contactless integrated circuit(s) cards -- Proximity cards
-- Part 4: Transmission protocol".
[5] ISO/IEC 13239: "Information technology -- Telecommunications and information exchange
between systems -- High-level data link control (HDLC) procedures".
[6] ETSI TS 102 600: "Smart Cards; UICC-Terminal interface; Characteristics of the USB interface".
[7] ETSI TS 102 223: "Smart Cards; Card Application Toolkit (CAT)".
[8] ISO/IEC 18092: "Information technology -- Telecommunications and information exchange
between systems -- Near Field Communication -- Interface and Protocol (NFCIP-1)".
ETSI
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Release 8 9 ETSI TS 102 613 V8.4.0 (2018-08)
2.2 Informative references
References are either specific (identified by date of publication and/or edition number or version nu
...