ISO/IEC 14888-4:2024

Information security — Digital signatures with appendix — Part 4: Stateful hash-based mechanisms

ISO/IEC 14888-4:2024

Name:ISO/IEC 14888-4:2024   Standard name:Information security — Digital signatures with appendix — Part 4: Stateful hash-based mechanisms
Standard number:ISO/IEC 14888-4:2024   language:English language
Release Date:23-Jun-2024   technical committee:ISO/IEC JTC 1/SC 27 - Information security, cybersecurity and privacy protection
Drafting committee:ISO/IEC JTC 1/SC 27/WG 2 - Cryptography and security mechanisms   ICS number:35.030 - IT Security

International
Standard
ISO/IEC 14888-4
First edition
Information security — Digital
2024-06
signatures with appendix —
Part 4:
Stateful hash-based mechanisms
Sécurité de l'information — Signatures digitales avec
appendice —
Partie 4: Mécanismes basés sur le hachage dynamique
Reference number
© ISO/IEC 2024
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
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Published in Switzerland
© ISO/IEC 2024 – All rights reserved
ii
Contents Page
Foreword .v
Introduction .vi
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Symbols and abbreviated terms. 2
4.1 Symbols .2
4.2 Abbreviated terms .3
5 XMSS and XMSS-MT . 3
5.1 General .3
5.2 Common building blocks .3
5.2.1 General .3
5.2.2 Address format .3
5.2.3 Required cryptographic functions .4
5.2.4 Auxiliary functions .6
5.2.5 WOTS+ One-Time Signature Auxiliary Scheme .7
5.3 XMSS Algorithms .10
5.3.1 General .10
5.3.2 Auxiliary functions .10
5.3.3 XMSS Key Generation . 12
5.3.4 XMSS Signing .14
5.3.5 XMSS Authentication Path Computation . 15
5.3.6 XMSS Verification . 15
5.4 XMSS-MT Algorithms .17
5.4.1 General .17
5.4.2 XMSS-MT key Generation .17
5.4.3 XMSS-MT signing .18
5.4.4 XMSS-MT Verification .19
5.5 Suggested parameters . 20
6 LMS and HSS schemes .21
6.1 Byte ordering convention .21
W
6.2 Converting to base 2 .21
6.3 Checksum Calculation .21
6.4 Type code . 22
6.5 LM-OTS . 22
6.5.1 General . 22
6.5.2 Key generation . . 22
6.5.3 Signing . 23
6.5.4 Verification .24
6.5.5 Suggested Parameters .24
6.6 LMS. 25
6.6.1 General . 25
6.6.2 Key generation . . 25
6.6.3 Signing . 26
6.6.4 Verification . 26
6.6.5 Suggested Parameters .27
6.7 HSS . .27
6.7.1 General .27
6.7.2 Key generation . . 28
6.7.3 Signing . 29
6.7.4 Verification . 29
6.7.5 Suggested Parameters . 30

© ISO/IEC 2024 – All rights reserved
iii
7 State management .30
Annex A (normative) Object identifiers and ASN.1 module .31
Annex B (informative) Relation to other standards .33
Annex C (informative) Numerical examples .34
Bibliography .56

© ISO/IEC 2024 – All rights reserved
iv
Foreword
ISO (the International Organization for Standardization) and IEC (the International Electrotechnical
Commission) form the specialized system for worldwide standardization. National bodies that are
members of ISO or IEC participate in the development of International Standards through technical
committees established by the respective organization to deal with particular fields of technical activity.
ISO and IEC technical committees collaborate in fields of mutual interest. Other international organizations,
governmental and non-governmental, in liaison with ISO and IEC, also take part in the work.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types
of document should be noted. This document was drafted in accordance with the editorial rules of the ISO/
IEC Directives, Part 2 (see www.iso.org/directives or /members_experts/refdocs).
ISO and IEC draw attention to the possibility that the implementation of this document may involve the
use of (a) patent(s). ISO and IEC take no position concerning the evidence, validity or applicability of any
claimed patent rights in respect thereof. As of the date of publication of this document, ISO and IEC had not
received notice of (a) patent(s) which may be required to implement this document. However, implementers
are cautioned that this may not represent the latest information, which may be obtained from the patent
database available at www.iso.org/patents and https://patents.iec.ch. ISO and IEC shall not be held
responsible for identifying any or all such patent rights.
Any trade name used in this d
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