IEC 62899-202-3:2019

Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method

IEC 62899-202-3:2019

Name:IEC 62899-202-3:2019   Standard name:Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
Standard number:IEC 62899-202-3:2019   language:English language
Release Date:15-Jan-2019   technical committee:TC 119 - Printed Electronics
Drafting committee:WG 2 - TC 119/WG 2   ICS number:01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION

IEC 62899-202-3
Edition 1.0 2019-01
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-3: Materials – Conductive ink – Measurement of sheet resistance of
conductive films – Contactless method




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IEC 62899-202-3
Edition 1.0 2019-01
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-3: Materials – Conductive ink – Measurement of sheet resistance of

conductive films – Contactless method

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 87.080 ISBN 978-2-8322-6411-9

– 2 – IEC 62899-202-3:2019 © IEC 2019
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Background to the eddy-current method . 7
5 Specimen . 8
5.1 Specimen . 8
5.2 Substrate . 8
5.3 Defects . 8
5.4 Size . 8
6 Apparatus . 8
6.1 General . 8
6.2 Sample stage . 9
6.3 Gap . 10
7 Test conditions . 10
8 Measurement procedure . 11
9 Report of the results . 11
9.1 General . 11
9.2 Test environment . 11
9.3 Test apparatus . 11
9.4 Test condition . 11
9.5 Test results . 11
Annex A (informative) Comparison between data from eddy-current probe and 4-point
probe measurements . 12
Annex B (informative) Effects of the probe position near the specimen edge. 14
Annex C (informative) Effects of the film thickness. 15
Bibliography . 16

Figure 1 – Schematic diagram of eddy-current probe apparatus (left: dual, right: single) . 9
Figure 2 – Apparatus on a stand table (single probe type) . 10
Figure A.1 – Measurement positions . 12
Figure A.2 – Comparison between contactless and 4-point methods . 13
Figure B.1 – Measurement positions . 14

Table 1 – Comparison between dual and single probes . 9
Table A.1 – Results of sheet resistance measurement . 12
Table C.1 – Thickness effects . 15

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 202-3: Materials – Conductive ink – Measurement of
sheet resistance of conductive films – Contactless method

FOREWORD
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International Standard IEC 62899-202-3 has been prepared by IEC technical committee 119:
Printed Electronics.
The text of this International Standard is based on the following documents:
FDIS Report on voting
119/240/FDIS 119/246/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62899-202-3:2019 © IEC 2019
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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INTRODUCTION
Conductive films, transparent or non-transparent, are a key element for electronic products. A
widespread method used for the measurement of the sheet resistance of conductive films is
the 4-point probe measurement. Nevertheless, making an electrical contact with the probes is
sometimes critical for the measurement. For some devices or films which are covered with an
insulating layer or composed of micro-/nano-structures, establishing an electrical contact is
difficult, which makes the 4-point probe method not suitable for the measurement of sheet
resistance (see Table A.1 and Figures A.1 and A.2 in Annex A). The 4-point probe method is
also sensitive to contact force and layer thickness. The eddy-current-based measurement
method, which does not require electrical contact, is widely used for this purpose in the
industry. This document specifies a standard method for measurement of sheet resistance
using a contactless eddy-current method.

– 6 – IEC 62899-202-3:2019 © IEC 2019
PRINTED ELECTRONICS –
Part 202-3: Materials – Conductive ink – Measurement of
sheet resistance of conductive films – Contactless method

1 Scope
This part of IEC 62899 defines terms and specifies a standard method for the measurement of
the sheet resistance of printed conductive films using a contactless eddy-current method.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 62899-202, Printed electronics – Materials – Part 202: Conductive ink
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in sta
...

  • Relates Information
  • ISO 8130-9:1992

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    09-28
  • HD 566 S1:1990

    HD 566 S1:1998
    09-28
  • ISO 5131:1982/Amd 1:1992

    ISO 5131:1982/Amd 1:1992
    09-28
  • EN 60598-2-22:1990

    EN 60598-2-22:1996
    09-27
  • ISO 8504-2:1992

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    09-27
  • EN 12165:2024

    prEN 12165:2022
    09-27
  • IEC TS 61158-6:1999

    IEC TS 61158-6:1999 - Digital data communications for measurement and control - Fieldbus for use in industrial control systems - Part 6: Application Layer protocol specification Released:3/24/1999 Isbn:2831847613
    09-27
  • ISO 4252:1992

    ISO 4252:1992 - Agricultural tractors -- Operator's workplace, access and exit -- Dimensions
    09-27