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ISO/IEC 30129
Edition 1.0 2015-10
INTERNATIONAL
STANDARD
colour
inside
Information technology – Telecommunications bonding networks for buildings
and other structures
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ISO/IEC 30129
Edition 1.0 2015-10
INTERNATIONAL
STANDARD
colour
inside
Information technology – Telecommunications bonding networks for buildings
and other structures
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.200 ISBN 978-2-8322-2924-8
– 2 – ISO/IEC 30129:2015
ISO/IEC 2015
CONTENTS
FOREWORD . 5
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 11
4 Conformance . 12
5 Overview of bonding networks . 12
6 Selection of the telecommunications bonding network approach . 13
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment . 13
6.2 Telecommunications bonding networks . 14
6.3 Telecommunications bonding network performance . 15
6.3.1 General . 15
6.3.2 Requirements . 16
6.3.3 DC resistance measurements . 17
7 Common features . 17
7.1 General . 17
7.2 Protective bonding networks . 18
7.2.1 Protective bonding network conductors (PBNCs) . 18
7.2.2 Main earthing terminal (MET) . 18
7.3 Telecommunications entrance facility (TEF) . 18
7.4 Telecommunications bonding network components . 18
7.4.1 Telecommunications bonding network conductors . 18
7.4.2 Telecommunications bonding network connections . 19
7.5 Cabinets, frames and racks . 19
7.5.1 External connections to a bonding network . 19
7.5.2 Rack bonding conductors. 20
7.5.3 Internal connections . 21
7.6 Miscellaneous bonding connections . 22
7.6.1 General . 22
7.6.2 Bonding conductors for d.c. resistance control . 22
7.6.3 Bonding conductors for impedance control . 22
7.7 Documentation . 23
8 Dedicated telecommunications bonding network . 23
8.1 General . 23
8.2 Components . 24
8.2.1 Primary bonding busbar (PBB) . 24
8.2.2 Secondary bonding busbar (SBB) . 25
8.2.3 Bonding conductors for d.c. resistance control . 25
8.2.4 Bonding conductors for impedance control . 26
8.3 Implementation . 27
8.3.1 Primary bonding busbar (PBB) . 27
8.3.2 Secondary bonding busbar (SBB) . 28
ISO/IEC 2015
8.3.3 Telecommunications bonding conductor (TBC) . 28
8.3.4 Telecommunications bonding backbone (TBB) . 29
8.3.5 Backbone bonding conductor (BBC) . 29
8.3.6 Bonds to continuous conductive pathway systems . 29
8.3.7 Bonds to structural metal . 29
9 Local telecommunications bonding networks in conjunction with protective
bonding networks . 30
9.1 Bonding for local distribution . 30
9.1.1 Star protective bonding networks . 30
9.1.2 Ring protective bonding networks . 31
9.2 Telecommunications bonding conductors . 32
9.2.1 Bonding conductors for d.c. resistance control . 32
9.2.2 Bonding conductors for impedance control . 32
9.3 Bonding for areas of telecommunications equipment concentration . 33
10 Local telecommunications bonding networks in conjunction with dedicated
telecommunications bonding networks . 33
10.1 Bonding for areas of telecommunications equipment concentration . 33
10.1.1 Requirements . 33
10.1.2 Recommendations . 33
10.1.3 Cabinets, frames and racks . 33
10.2 Telecommunications equipment bonding conductors (TEBC) . 33
10.2.1 TEBC for d.c. resistance control . 33
10.2.2 TEBC for impedance control . 34
10.2.3 Implementation . 34
11 Mesh bonded networks . 34
11.1 General . 34
11.2 Mesh bonding alternatives . 35
11.2.1 Local mesh bonding (MESH-IBN) networks . 35
11.2.2 MESH-BN . 37
11.3 Bonding conductors of a mesh bonding network . 38
11.3.1 Requirements . 38
11.3.2 Recommendations . 38
11.4 Bonding conductors to the mesh bonding network . 38
11.5 Supplementary bonding grid (SBG) . 39
11.6 System reference potential plane (SRPP) . 39
11.6.1 General . 39
11.6.2 Access floors . 40
11.6.3 Transient suppression plate (TSP) . 41
Annex A (normative) Maintenance of telecommunications bonding network
performance . 42
A.1 General . 42
A.2 Periodic activity . 42
A.2.1 Schedule . 42
A.2.2 Implementation . 42
A.3 Causes of performance deterioration . 43
A.3.1 Galvanic corrosion . 43
A.3.2 Requirements . 43
Annex B (normative) Bonding conductor cross-sectional area . 44
Annex C (infomative) Alternative terminology . 45
– 4 – ISO/IEC 30129:2015
ISO/IEC 2015
Bibliography . 46
Figure 1 – Schematic relationship between ISO/IEC 30129 and other relevant
standards . 7
Figure 2 – Schematic of telecommunications equipment distribution and associated
bonding con
...