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IEC 60749-20-1
Edition 2.0 2019-06
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 20-1: Handling, packing, labelling and shipping of surface-mount devices
sensitive to the combined effect of moisture and soldering heat
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IEC 60749-20-1
Edition 2.0 2019-06
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 20-1: Handling, packing, labelling and shipping of surface-mount devices
sensitive to the combined effect of moisture and soldering heat
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-7124-7
– 2 – IEC 60749-20-1:2019 RLV © IEC:2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 General applicability and reliability considerations . 10
4.1 Assembly processes . 10
4.1.1 Mass reflow . 10
4.1.2 Localized heating. 10
4.1.3 Socketed components . 10
4.1.4 Point-to-point soldering . 11
4.1.5 Aqueous cleaning . 11
4.2 Reliability . 11
5 Dry packing . 11
5.1 Requirements . 11
5.2 Drying of SMDs and carrier materials before being sealed in MBBs . 11
5.2.1 Drying requirements – level A2 . 11
5.2.2 Drying requirements – levels B2a to B5a . 12
5.2.3 Drying requirements – carrier materials . 12
5.2.4 Drying requirements – other . 12
5.2.5 Excess time between bake and bag . 12
5.3 Dry pack . 12
5.3.1 Description . 12
5.3.2 Materials . 13
5.3.3 Labels . 16
5.3.4 Moisture barrier bag sealing . 17
5.3.5 Dry pack precautions . 17
5.3.6 Shelf life . 17
6 Drying. 17
6.1 Drying options . 17
6.2 Post exposure to factory ambient . 22
6.2.1 Floor life clock . 22
6.2.2 Any duration exposure . 22
6.2.3 Short duration exposure . 22
6.3 General considerations for baking . 22
6.3.1 High-temperature carriers . 22
6.3.2 Low-temperature carriers . 22
6.3.3 Paper and plastic container items . 23
6.3.4 Bakeout times . 23
6.3.5 ESD protection . 23
6.3.6 Reuse of carriers . 23
6.3.7 Solderability limitations . 23
7 Use . 23
7.1 Floor life clock start . 23
7.2 Incoming bag inspection . 23
7.2.1 Upon receipt . 23
7.2.2 Component inspection . 24
7.3 Floor life . 24
7.4 Safe storage . 24
7.4.1 Safe storage categories . 24
7.4.2 Dry pack . 24
7.4.3 Shelf life . 24
7.4.4 Dry atmosphere cabinet . 25
7.5 Reflow . 25
7.5.1 Reflow categories . 25
7.5.2 Opened MBB . 25
7.5.3 Reflow temperature extremes . 25
7.5.4 Additional thermal profile parameters. 25
7.5.5 Multiple reflow passes . 26
7.5.6 Maximum reflow passes . 26
7.6 Drying indicators . 26
7.6.1 Drying requirements . 26
7.6.2 Excess humidity in the dry pack . 26
7.6.3 Floor life or ambient temperature/humidity exceeded . 27
7.6.4 Level B6 SMDs . 27
Annex A (normative) Symbol and labels for moisture-sensitive devices . 28
A.1 Object . 28
A.2 Symbol and labels. 28
A.2.1 "Moisture-sensitive" symbol . 28
A.2.2 Moisture-sensitive identification (MSID) label . 28
A.2.3 Moisture-sensitive caution labels . 28
Annex B (informative) Board rework . 32
B.1 Component removal, rework and remount . 32
B.1.1 Removal precautions . 32
B.1.2 Removal for failure analysis . 32
B.1.3 Removal and remount . 32
B.2 Baking of populated boards. 32
Annex C (normative) Test method for humidity indicator cards used with electronic
component packaging . 33
C.1 HIC testing method . 33
C.2 Testing apparatus . 33
C.3 Testing procedure . 33
C.4 Data analysis . 34
Annex D (informative) Derivation of bake tables . 35
Annex E (informative) Derating due to factory environmental conditions . 37
Bibliography . 41
Figure 1 – Typical dry pack configuration for moisture-sensitive SMDs
in shipping tubes . 13
Figure 2 – Example humidity indicator cards . 16
Figure A.1 – Moisture-sensitive symbol (example) . 28
Figure A.2 – MSID label (example) . 28
Figure A.3 – Information label for level A1 or B1 (example) . 29
– 4 – IEC 60749-20-1:2019 RLV © IEC:2019
Figure A.4 – Moisture-sensitive caution label for level A2 (example) . 29
Figu
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