|
IEC 60747-19-1
Edition 1.0 2019-11
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 19-1: Smart sensors – Control scheme of smart sensors
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de
CH-1211 Geneva 20
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
.
IEC 60747-19-1
Edition 1.0 2019-11
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 19-1: Smart sensors – Control scheme of smart sensors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-7606-8
– 2 – IEC 60747-19-1:2019 IEC 2019
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Construction of smart sensor’s control scheme . 8
4.1 General . 8
4.2 Assignment of the smart sensor’s registers in the control scheme . 8
4.3 Operation procedure of control scheme . 9
4.4 Physical connection between smart sensor and terminal module. 11
4.5 Optional configuration . 12
4.6 Optional function . 14
Annex A (informative) Practical example of smart sensor’s control scheme . 15
Annex B (informative) Smart sensor with multiple sensors – Practical example . 18
Figure 1 – Block diagram of hardware configuration regarding the smart sensor’s
control scheme from the terminal module in the smart sensing unit . 10
Figure 2 – Example of block diagram of connection lines between smart sensor and
terminal module . 12
Figure 3 – Example of block diagram of connection lines with optional interrupt input
and output lines between smart sensor and terminal module. 13
Figure A.1 – Block diagram of hardware configuration of smart accelerometer as an
example of smart sensors . 15
Figure B.1 – Block diagram of hardware configuration in the case of a smart sensor
with multiple sensors . 19
Figure B.2 – Block diagram of hardware configuration of a smart sensor with a
temperature sensor and a humidity sensor as an example of a smart sensor with
multiple sensors . 20
Table 1 – Assignment of the smart sensor’s registers in the smart sensor’s control
scheme . 11
Table 2 – Example of connection lines between smart sensor and terminal module . 12
Table 3 – Recommended optional configuration of connection lines between the smart
sensor and terminal module . 13
Table 4 – Recommended optional function of smart sensor’s control scheme . 14
Table A.1 – Practical example of assignment of smart sensor’s registers in smart
sensor’s control scheme . 16
Table B.1 – Practical example of assignment of registers of the smart sensor with a
temperature sensor and a humidity sensor . 21
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 19-1: Smart sensors – Control scheme of smart sensors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747 has been prepared by subcommittee SC47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
CDV Report on voting
47E/642/CDV 47E/668/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
– 4 – IEC 60747-19-1:2019 IEC 2019
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
INTRODUCTION
The development of smart sensors which integrate analog-to-digital conversion and digital
processing of the captured sensor signal(s) is in progress. A smart sensing unit, which
comprises a smart sensor; a terminal module, to control the smart sensor and perform
wireless communication; and a power supply for the smart sensor and the terminal module,
can send the output data of the smart sensor wirelessly to the outside. Here, the power supply
can be a plug-in power supply, a battery, an energy harvester, or their combination. A smart
sensing network where a large number of smart sensing units are located in manufacturing
factories, offices, and stores has been examined. With this network, environmental
monitoring, sensing of operational situations of manufacturing equipment and sensing of other
various events contribute to the realization of the following outcomes by analyzing the
collected sensing data. Namely, energy saving, improvement in factory productivity such as
operation rate, shortening of production lead time, preventive equipment maintenance, and
product quality improvement can be achieved.
However, considering the three components of the smart sensing unit, namely, the smart
sensor, terminal module, and power supply, standardization regarding control schemes to
connect the components to each other and regarding the indication of specifications of the
components has not been sufficiently established yet. This issue leads to the present situation,
where the development of each component in the smart sensing unit has not proceeded
efficiently.
The IEC 60747-19 series aims to address this issue. The IEC 60747-19 series comprises two
parts and its structure is currently conceived as follows:
Part 19-1: Smart sensors – Control scheme of smart sensors
Part 19-2 : Smart sensors – Indication of specifications of smart sensors and power supplies
to drive smart sensors
Part 19-1 specifies a control scheme of the smart sensor from the terminal module in the
smart sensing unit. Generally, the manufacturers of sensors have incorporated into the
sensors various parameters and conditions for sensing operations to fulfil various requests
and needs of the users. Therefore, it has been quite difficult for the users to understand how
to set the parameters and conditions adequately and master the use of sensors. This issue
has been a considerable obstacle in designing the smart sensing unit and smart sensing
system. The main objective of this part is to solve this obstacle for future expansion of the
smart sensors and smart sensing network systems.
Part 19-2 aims to provide guidelines to specify information that is required when the smart
sensing unit is newly designed. When the smart sensing unit is newly designed especially to
...