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IEC 62769-4
Edition 2.0 2021-02
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –
Part 4: FDI Packages
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IEC 62769-4
Edition 2.0 2021-02
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –
Part 4: FDI Packages
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9391-1
– 2 – IEC 62769-4:2021 RLV © IEC 2021
CONTENTS
FOREWORD . 7
INTRODUCTION . 2
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, abbreviated terms and acronyms conventions . 13
3.1 Terms and definitions . 13
3.2 Abbreviated terms . 14
3.3 Conventions . 14
4 FDI Package Model . 14
4.1 Overview. 14
4.2 FDI Package Elements . 15
4.2.1 Package Catalog . 15
4.2.2 Electronic Device Description . 15
4.2.3 User Interface Plug-in . 16
4.2.4 Attachment . 17
4.3 FDI Package Types . 18
4.3.1 FDI Device Package . 18
4.3.2 FDI Communication Package . 18
4.3.3 FDI UIP Package . 19
4.3.4 FDI Profile Package . 19
5 FDI Package implementation . 21
5.1 Packaging technology . 21
5.2 Use of Open Packaging Conventions . 21
5.2.1 Unknown parts . 21
5.2.2 Invalid parts . 21
5.2.3 Unknown relationships . 21
5.2.4 Interleaving. 21
5.2.5 Core properties . 21
5.2.6 Thumbnails . 21
5.2.7 Digital signatures . 21
5.3 FDI Package Parts . 22
5.3.1 Package Catalog . 22
5.3.2 Electronic Device Description . 23
5.3.3 User Interface Plug-in . 23
5.3.4 Attachments . 26
6 FDI Package Versioning . 28
6.1 Version scheme . 28
6.2 Versioned elements . 29
6.3 Version Hierarchy . 29
6.4 UIP Compatibility . 31
7 Digital Signatures and Registration Certificates . 32
7.1 Signed Elements and Certification documents . 32
7.2 Signing mechanism . 33
7.3 FDI Package Originator, FDI Registration Authority. 33
7.4 FDI Host behavior . 34
Annex A (normative) File name conventions . 35
A.1 Identification . 35
A.2 FDI Package filename convention . 35
Annex B (informative) FDI Package Creation . 36
B.1 General . 36
B.2 Tools and Components . 36
B.3 Development . 36
Annex C (informative) FDI Package deployment . 39
C.1 General . 39
C.2 Scenarios . 39
Annex D (informative) Example . 42
D.1 General . 42
D.2 Open Packaging Conventions . 42
D.3 Creation and Handling of FDI Packages . 45
D.4 FDI Device Package Example . 45
Annex E (normative) Schema . 53
E.1 Target Namespace . 53
E.2 Catalog . 53
E.3 ClassificationIdT . 53
E.4 CommunicationProfileT . 53
E.5 CommunicationRoleT . 54
E.6 CommunicationServerT . 54
E.7 DeviceTypeT . 54
E.8 FdiRegistrationCert . 55
E.9 FdiRegistrationCertT . 55
E.10 HexStringT .
E.10 InterfaceT . 56
E.11 ListOfCommunicationProfilesT . 57
E.12 ListOfDeviceImagesT . 58
E.13 ListOfDeviceTypesT . 58
E.14 ListOfDocumentsT . 58
E.15 ListOfInterfacesT . 59
E.16 ListOfLocalizedStringsT . 59
E.17 ListOfProtocolSupportFilesT . 59
E.18 ListOfRegDeviceTypesT . 60
E.19 ListOfRegistrationsT . 60
E.20 ListOfSupportedDeviceRevisionsT . 61
E.21 ListOfSupportedUipsT . 61
E.22 ListOfUipVariantsT . 61
E.23 LocalizedStringT . 62
E.24 PackageT . 62
E.25 PackageTypeT . 63
E.26 PlatformT . 64
E.27 RegDeviceTypeT . 64
E.28 RegistrationT . 65
E.29 RelationshipIdT . 65
E.30 String256T . 66
E.31 SupportedUipT . 66
– 4 – IEC 62769-4:2021 RLV
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