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IEC 61967-4
Edition 2.0 2021-03
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
Ghz –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
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IEC 61967-4
Edition 2.0 2021-03
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
Ghz –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.200 ISBN 978-2-8322-9590-8
– 2 – IEC 61967-4:2021 RLV © IEC:2021
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General . 8
4.1 Measurement basics . 8
4.2 RF current measurement . 9
4.3 RF voltage measurement at IC pins . 9
4.4 Assessment of the measurement technique . 10
5 Test conditions . 10
6 Test equipment . 10
6.1 Test receiver specification RF measuring instrument . 10
6.2 RF current probe specification . 10
6.3 Test of the RF current probe capability . 11
6.4 Matching network specification . 11
7 Test setup . 12
7.1 General test configuration . 12
7.2 Printed circuit test board layout . 12
8 Test procedure . 13
9 Test report . 13
Annex A (normative informative) Probe calibration verification procedure . 15
Annex B (informative) Classification of conducted emission levels . 19
B.1 Introductory remark . 19
B.2 General . 19
B.3 Definition of emission levels . 19
B.4 Presentation of results . 19
B.4.1 General . 19
B.4.2 Examples. 21
Annex C (informative) Example of reference levels for automotive applications. 23
C.1 Introductory remark . 23
C.2 General . 23
C.3 Reference levels . 23
C.3.1 General . 23
C.3.2 Measurements of conducted emissions, 1 Ω method . 24
C.3.3 Measurements of conducted emissions, 150 Ω method . 24
Annex D (informative) EMC requirements and how to use EMC IC measurement
techniques . 25
D.1 Introduction Introductory remark . 25
D.2 Using EMC measurement procedures . 25
D.3 Assessment of the IC influence to the EMC behaviour of the modules . 25
Annex E (informative) Example of a test setup consisting of an EMC main test board
and an EME IC test board . 27
E.1 Introductory remark . 27
E.2 EMC main test board . 27
E.3 EME IC test board. 29
E.3.1 General explanation of the test board . 29
E.3.2 How to build the test system . 29
E.3.3 PCB layout and component positioning . 31
Annex F (informative) 150 Ω direct coupling networks for common mode emission
measurements of differential mode data transfer ICs and similar circuits . 33
F.1 Basic direct coupling network . 33
F.2 Example of a common-mode coupling network alternative for high speed
CAN or LVDS or RS485 or similar systems . 34
F.3 Example of a common-mode coupling network alternative for differential IC
outputs to resistive loads (e.g. airbag ignition driver) . 35
F.4 Example of a common-mode coupling network for fault tolerant CAN
systems . 35
Annex G (informative) Measurement of conducted emissions in extended frequency
range . 37
G.1 General . 37
G.2 Guidelines . 37
G.2.1 Measurement network . 37
G.2.2 Network components . 38
G.2.3 Network layout . 40
G.2.4 Network verification . 40
G.2.5 Test board . 41
G.3 Application area . 43
Bibliography . 45
Figure 1 – Example of two emitting loops returning to the IC via common ground . 8
Figure 2 – Example of IC with two ground pins, a small I/O loop and two emitting loops . 9
Figure 3 – Construction of the1 Ω RF current probe . 10
Figure 4 – Impedance matching network corresponding with IEC 61000-4-6 . 12
Figure 5 – General test configuration . 12
Figure A.1 – Test circuit . 15
Figure A.2 – Insertion loss of the 1 Ω probe . 16
Figure A.3 – Layout of the calibration verification test circuit . 17
Figure A.4 – Connection of the calibration verification test circuit . 17
Figure A.5 – Minimum decoupling limit versus frequency . 18
Figure A.6 – Example of 1 Ω probe input impedance characteristic . 18
Figure B.1 – Emission level scheme. 20
Figure B.2 – Example of the maximum emission level G8f . 21
Figure C.1 – 1 Ω method − Examples of reference levels for conducted disturbances
from semiconductors (peak detector) . 24
Figure C.2 – 150 Ω method − Examples of reference levels for conducted disturbances
from semiconductors (peak detector) . 24
Figure E.1 – EMC main test board . 28
Figure E.2 – Jumper field . 28
Figure E.3 – EME IC test board (contact areas for the spring connector pins of the
main test board) . 29
Figure E.4 – Example of an EME IC test system . 30
Figure E.5 – Component side of the EME IC test board . 31
– 4 – IEC 61967-4:2021 RLV © IEC:2021
Figure E.6 – Bottom side of the EME IC test board . 32
Figure F.1 – Basic direct coupling for common mode EMC measurements . 33
Figure F.2 – Measurement setup for the S21 measurement of the common-mode
coupling . 34
Figure F.3 – Using split load termination as coupling for measuring equipment . 34
Figure F.4 – Using split load termination as coupling for measuring equipment . 35
Figure F.5 – Example of an acceptable adaptation for special network requirements
(e.g. for
...