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SLOVENSKI STANDARD
01-maj-2018
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic
discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2018)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 26: Prüfung
der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Human Body Model
(HBM) (IEC 60749-26:2018)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
26: Essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain
(HBM) (IEC 60749-26:2018)
Ta slovenski standard je istoveten z: EN IEC 60749-26:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60749-26
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2018
ICS 31.080.01 Supersedes EN 60749-26:2014
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 26: Electrostatic discharge (ESD) sensitivity testing -
Human body model (HBM)
(IEC 60749-26:2018)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 26: Essai de sensibilité Prüfverfahren - Teil 26: Prüfung der Empfindlichkeit gegen
aux décharges électrostatiques (DES) - Modèle du corps elektrostatische Entladungen (ESD) - Human Body Model
humain (HBM) (HBM)
(IEC 60749-26:2018) (IEC 60749-26:2018)
This European Standard was approved by CENELEC on 2018-02-19. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-26:2018 E
European foreword
The text of document 47/2438/FDIS, future edition 4 of IEC 60749-26, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-26:2018.
The following dates are fixed:
(dop) 2018-11-19
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-02-19
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60749-26:2014.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-26:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60749 (series) NOTE Harmonized as EN 60749 (series).
IEC 60749-27 NOTE Harmonized as EN 60749-27.
IEC 60749-26
Edition 4.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 26: Electrostatic discharge (ESD) sensitivity testing – Human body model
(HBM)
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques et climatiques –
Partie 26: Essai de sensibilité aux décharges électrostatiques (DES) – Modèle du
corps humain (HBM)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-5256-7
– 2 – IEC 60749-26:2018 © IEC 2018
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Apparatus and required equipment . 10
4.1 Waveform verification equipment . 10
4.2 Oscilloscope . 11
4.3 Additional requirements for digital oscilloscopes . 11
4.4 Current transducer (inductive current probe) . 11
4.5 Evaluation loads . 11
4.6 Human body model simulator . 12
4.7 HBM test equipment parasitic properties . 12
5 Stress test equipment qualification and routine verification . 12
5.1 Overview of required HBM tester evaluations . 12
5.2 Measurement procedures . 13
5.2.1 Reference pin pair determination . 13
5.2.2 Waveform capture with current probe . 13
5.2.3 Determination of waveform parameters . 14
5.2.4 High voltage discharge path test . 17
5.3 HBM tester qualification . 17
5.3.1 HBM ESD tester qualification requirements . 17
5.3.2 HBM tester qualification procedure . 17
5.4 Test fixture board qualification for socketed testers . 18
5.5 Routine waveform check requirements . 19
5.5.1 Standard routine waveform check description . 19
5.5.2 Waveform check frequency . 19
5.5.3 Alternate routine waveform capture procedure . 20
5.6 High voltage discharge path check . 20
5.6.1 Relay testers . 20
5.6.2 Non-relay testers . 20
5.7 Tester waveform records. 20
5.7.1 Tester and test fixture board qualification records . 20
5.7.2 Periodic waveform check records . 20
5.8 Safety . 21
5.8.1 Initial set-up . 21
5.8.2 Training . 21
5.8.3 Personnel safety . 21
6 Classification procedure . 21
6.1 Devices for classification . 21
6.2 Parametric and functional testing . 21
6.3 Device stressing . 21
6.4 Pin categorization . 22
6.4.1 General . 22
6.4.2 No connect pins . 22
6.4.3 Supply pins . 23
6.4.4 Non-supply pins . 23
IEC 60749-26:2018 © IEC 2018 – 3 –
6.5 Pin groupings . 24
6.5.1 Supply pin groups . 24
6.5.2 Shorted non-supply pin groups . 24
6.6 Pin stress combinations . 24
6.6.1 Pin stress combination categorization . 24
6.6.2 Non-supply and supply to supply combinations (1, 2, … N) . 26
6.6.3 Non-supply to non-supply combinations . 27
6.7 HBM stressing with a low-parasitic simulator . 28
6.7.1 Low-parasitic HBM simulator . 28
6.7.2 Requirements for low parasitics . 28
6.8 Testing after stressing . 28
7 Failure criteria . 28
8 Component classification . 28
Annex A (informative) HBM test method flow chart . 30
Annex B (informative) HBM test equipment parasitic properties . 33
B.1 Optional trailing pulse detection equipment / apparatus . 33
B.2 Optional pre-pulse voltage rise test equipment . 34
B.3 Open-relay tester capacitance parasitics . 36
B.4 Test to determine if an HBM simulator is a low-parasitic simulator . 36
Annex C (informative) Example of testing a product using Table 2, Table 3, or Table 2
with a two-pin HBM tester . 38
C.1 General . 38
C.2 Procedure A (following Table 2): . 39
C.3 Alternative procedure B (following Table 3): . 40
C.4 Alternative procedure C (following Table 2): . 41
Annex D (informative) Examples of coupled non-supply pin pairs . 43
Annex E (normative) Cloned non-supply (I/O) pin sampling test method . 44
E.1 Purpose and overview . 44
E.2 Pin sampling overview and statistical details . 44
E.3 IC product sele
...