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SLOVENSKI STANDARD
01-september-2018
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SIST EN 60286-5:2005
SIST EN 60286-5:2005/A1:2009
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Packaging of components for automatic handling - Part 5: Matrix trays (IEC 60286-
5:2018)
Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 5:
Flachmagazine (IEC 60286-5:2018)
Emballage de composants pour opérations automatisées - Partie 5: Supports matriciels
(IEC 60286-5:2018)
Ta slovenski standard je istoveten z: EN IEC 60286-5:2018
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.020 Pakiranje in distribucija blaga Packaging and distribution of
na splošno goods in general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60286-5
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2018
ICS 31.020 Supersedes EN 60286-5:2004
English Version
Packaging of components for automatic handling - Part 5: Matrix
trays
(IEC 60286-5:2018)
Emballage de composants pour opérations automatisées - Gurtung und Magazinierung von Bauelementen für
Partie 5: Supports matriciels automatische Verarbeitung - Teil 5: Flachmagazine
(IEC 60286-5:2018) (IEC 60286-5:2018)
This European Standard was approved by CENELEC on 2018-05-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60286-5:2018 E
European foreword
The text of document 40/2556/CDV, future edition 3 of IEC 60286-5, prepared by IEC/TC 40
"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote
and approved by CENELEC as EN IEC 60286-5:2018.
The following dates are fixed:
• latest date by which the document has to be (dop) 2019-02-28
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2021-05-30
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60286-5:2004.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60286-5:2018 was approved by CENELEC as a European
Standard without any modification.
IEC 60286-5
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
Packaging of components for automatic handling –
Part 5: Matrix trays
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020 ISBN 978-2-8322-5617-6
– 2 – IEC 60286-5:2018 © IEC 2018
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
4 Material . 8
4.1 Electrostatic dissipative requirements . 8
4.2 Effect of properties . 8
4.3 Recycling and rigidity . 8
5 Mechanical stability . 8
5.1 Loaded tray . 8
5.2 Empty tray . 8
5.3 Outer edges . 8
6 Tray design, dimensions and other physical properties . 8
6.1 Tray design . 8
6.1.1 Number of pockets . 8
6.1.2 Orientation of pockets . 8
6.1.3 Design rules for pocket density . 9
6.2 Overall tray dimensions . 10
6.3 Cell dimensions . 10
6.4 Tray vacuum pick-up sites . 11
6.4.1 Size . 11
6.4.2 Centre . 11
6.4.3 Perimeter . 11
6.5 Detail features . 11
6.6 Weight . 12
6.7 Movement of components . 12
6.8 Dimensional information . 12
7 Polarity and orientation of components in the tray . 15
7.1 Pin one . 15
7.2 Loading . 15
8 Tray stacking . 15
8.1 Bundling . 15
8.2 Top protection . 16
8.3 Partial filling . 16
8.4 Protrusion of components . 16
8.5 Stack-up . 16
8.6 Damaging of components . 16
8.7 Warpage . 16
9 Missing components . 16
10 Marking . 16
Annex A (informative) List of existing matrix trays with wide anticipated use in the
electronic industries . 17
A.1 Matrix trays (for different packages) . 17
IEC 60286-5:2018 © IEC 2018 – 3 –
A.2 Matrix trays for PGA packages . 25
A.2.1 Dimensional information . 25
A.2.2 Variation sheet PGA (pin grid array package) . 28
Annex B (normative) Measurement methodology of the tray dimensions . 29
B.1 General . 29
B.2 Definition of the dimensions . 29
B.2.1 Outline dimensions . 29
B.2.2 Tray thickness (A) . 30
B.2.3 Dimensions of the stacking feature . 31
B.2.4 Warpage . 31
B.3 Measuring instrument. 31
B.4 Measurement conditions . 31
B.5 Measurement methodology . 31
B.5.1 Outline dimensions . 31
B.5.2 Tray thickness (A) . 32
B.5.3 Dimensions of the stacking feature . 33
B.5.4 Warpage . 33
Annex C (normative) Matrix trays – General considerations for design (design value) . 34
C.1 Lateral movement of leaded devices . 34
C.2 Lateral movement of un-leaded devices . 34
C.3 Lead protection . 35
Figure 1 – Sample of leaded packages . 11
Figure 2 – Sample of grid array packages . 11
Figure 3 – Tray main view . 13
Figure 4 – Tray stacking details . 14
Figure 5 – Tray tolerances . 14
Figure A.1 – Thin tray . 18
Figure A.2 – Thick matrix . 26
Figure B.1 – Cross-sections of the outline dimensions . 30
Figure B.2 – Tray thickness . 30
Figure B.3 – Examples of tray warpage . 31
Figure B.4 – Top view of a tray showing the measurement locations for the outline
dimensions . 32
Figure B.5 – Measurement locations for tray thickness . 32
Figure B.6 – Holding position in calliper jaws for measurement . 32
Figure B.7 – Correction of a lift of the tray at the measurement point . 32
Figure B.8 – Measurement loc
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