The general method is to first clean the silicon wafer with an acidic solution with a composition ratio of H2SO4:H2O2=5:1 or 4:1. The strong oxidizing property of the cleaning solution breaks down and removes organic matter; after rinsing with ultra pure water, use an alkali with a composition ratio of H2O:H2O2:NH4OH=5:2:1 or 5:1:1 or 7:2:1 Cleaning with a chemical cleaning solution, in reason for the oxidation of H2O2 and NH4O
Please adopt