If the solar cell ribbon is made of copper, it can be soldered with an electric soldering iron. It is best to scrape the soldering point with a wallpaper knife before soldering (scraping with a broken hacksaw blade will give best results). , with rosin, first tin the soldering points (eat tin), then tin the ends of the wires. The electric soldering iron used should not be less than 50 watts or more. You can decide the power depending on the situation. will not work if the power is low.
A solar panel is a device that absorbs sunlight and converts solar radiation energy directly or indirectly into electrical energy through the photoelectric effect or photochemical effect. So how do you install solar panels? I'll tell you below.
Installation of solar panels
1. Battery test :
Battery test is to test the battery output parameters (current and voltage) to classify them. In order to improve the utilization rate of batteries and manufacture qualified quality battery components.
2. Front welding:
The welding machine used can spot weld the solder strip on the main grid line as multiple spots. The heat source used for welding is an infrared lamp. The length of the welding tape is approximately twice the side length of the battery.
3. Rear series connection:
The operator uses a soldering iron and solder wire to weld the front electrode (negative electrode) of the front battery to the rear electrode (positive electrode). of the rear battery. ), connect the 36 parts together in series and solder the wires to the positive and negative poles of the component string.
4. Laminate installationfied:
After the back is connected in series and passed inspection, the component chains, glass and cut EVA, fiberglass, The panel is laid to a certain level and is ready to be laminated. The glass is previously covered with a layer of reagent.
5. Component lamination:
Put the laid battery into the laminator, extract the air from the component by vacuuming, then heat to melt the EVA to melt the battery and glass. and the back plate are glued together; the whole is finally cooled and removed.
6. Cutting:
During rolling, EVA melts and solidifies outward due to pressure to form burrs, so it needs to be removed after the rolling.
7. Framing:
Similar to installing a frame on glass
8. Solder junction box:
< p> On the back of the component Solder a box at the wire level.9. High te testnsion:
Test the voltage resistance and dielectric strength of the components.
10. Component Testing:
The purpose of the test is to calibrate the output power of the battery, test its output characteristics and determine the quality level of the component .
Solar panel production process
(1) Cutting: Use multi-line cutting to cut the silicon rods into square silicon wafers.
(2) Cleaning: Use conventional silicon wafer cleaning methods, and then use acidic (or alkaline) solution to remove 30-50um of the damaged layer on the surface of the silicon wafer .
(3) Textured surface preparation: Use an alkaline solution to anisotropically etch the silicon wafer to prepare a textured surface on the surface of the silicon wafer.
(4) Diffusion of phosphorus: uUse a coating source (or a liquid source, or a solid phosphorus nitride flake source) for diffusion to form a PN+ junction, with a junction depth typically 0.3 to 0.5 µm.
(5) Peripheral etching: The diffusion layer formed on the peripheral surface of the silicon wafer during diffusion will short circuit the upper and lower electrodes of the battery. Masked wet etching or dry plasma etching is used for. remove the peripheral diffusion layer.
(6) Remove the PN+ junction at the back. Wet etching or grinding methods are commonly used to remove the PN+ junction on the back.
(7) Fabricate the upper and lower electrodes: use vacuum evaporation, chemical nickel plating, or aluminum paste printing and sintering. Make the bottom electrode first, then the top electrode. Printing on aluminum pastest a widely used treatment method.
(8) Make an anti-reflection film: In order to reduce the incident reflection loss, a layer of anti-reflection film must be covered on the surface of the silicon wafer. The materials used to make anti-reflective coatings include MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5, etc. The processing method can be vacuum coating method, ion plating method, spraying method, printing method, PECVD method or spraying method, etc.
(9) Sintering: The battery chip is sintered onto a nickel or copper base plate.
(10) Test Classification: Classification of tests according to the specifications of the specified parameters. The cell production process is relatively complex and typically involves major steps such as silicon wafer inspection, surface texturing, bondingn by diffusion, dephosphorization of silica glass, plasma etching, anti-reflective coating, screen printing, rapid sintering, as well as inspection and packaging.